EPF8820ATI144-3N - FLEX 8000 FPGA, 672 LEs, 144-TQFP | Altera
MPN: EPF8820ATI144-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $15.2 | $152.00 |
| 100 | $12.4 | $1,240.00 |
| 500 | $10.1 | $5,050.00 |
| 1,000 | $8.75 | $8,750.00 |
Drop-in alternatives for EPF8820ATI144-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPF8820ATC144-3N
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View Datasheet →EPF8820ATI144-3N Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (now Intel FPGA) |
| Family | FLEX 8000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 672 |
| Maximum User I/O | 112 |
| Number of Terminals | 144 |
| Package Type | TQFP-144 (LFQFP, gull-wing) |
| Terminal Pitch | 0.5 mm |
| Terminal Form | GULL WING |
| Package Code | LFQFP |
| Package Shape | SQUARE |
| Process Technology | CMOS (SRAM-based configuration) |
| Propagation Delay | 0.2 ns (typical) |
| Speed Grade | -3 |
| Temperature Grade | Industrial (-40C to +85C) |
| I/O Logic Levels | 3.3V or 5V (configurable) |
| Configuration Method | SRAM, loaded at power-up (requires external EPC1/EPC1064/EPC1213/EPC1441 or system controller) |
| Mounting Type | Surface Mount |
| JTAG Support | IEEE 1149.1 boundary-scan |
EPF8820ATI144-3N square Pin Configuration Guide
Complete pinout information for EPF8820ATI144-3N (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8820ATI144-3N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820ATI144-3N is suitable for 6 applications: Legacy Industrial Control Glue Logic, Telecommunications Interface Bridging, Test and Measurement Instrumentation Front-End, Military and Aerospace Avionics Retrofit, Custom Bus Protocol Implementation, Long-Lifecycle Equipment Refresh.
Legacy Industrial Control Glue Logic
The EPF8820ATI144-3N is well suited to legacy industrial control platforms that require custom glue logic bridging sensor arrays, motor drivers, and PLC backplanes. Its 672 logic elements and 112 user I/Os allow designers to integrate multiple discrete PAL/GAL functions into a single programmable device, reducing PCB area and BOM count. The configurable 3.3V/5V I/O banks directly interface to 5V CMOS industrial sensors without external level shifters, while the 144-pin TQFP package (0.5 mm pitch) supports standard SMT assembly lines.
Recommended
Telecommunications Interface Bridging
In telecom equipment the EPF8820ATI144-3N serves as a custom protocol bridge between legacy E1/T1 framers, HDLC controllers, and modern backplane SERDES interfaces. The 0.2 ns propagation delay at the -3 speed grade supports deterministic timing for sub-100 MHz parallel bus conversion, while 112 I/O pins accommodate wide data buses plus control signals. The SRAM-based architecture allows field firmware updates via JTAG, critical for telecom equipment requiring in-service upgrades without board removal.
Recommended
Test and Measurement Instrumentation Front-End
Test instruments such as logic analyzers, protocol exercisers, and custom ATE fixtures use the EPF8820ATI144-3N to implement pattern generation, timing control, and result-capture state machines. The 672 logic elements provide sufficient capacity for 32-bit parallel pattern generators with deep counters, while the 144-pin TQFP package exposes 112 I/Os for direct parallel backplane probing. The JTAG IEEE 1149.1 boundary-scan support simplifies board-level test integration and ATE fixture development.
Recommended
Military and Aerospace Avionics Retrofit
Long-lifecycle military and aerospace programs continue to use the EPF8820ATI144-3N in avionics retrofit and obsolescence-management programs. The industrial -40C to +85C temperature grade meets many RTCA DO-254 design assurance levels when properly documented, and the mature FLEX 8000 architecture is well-characterized in legacy DO-254 datasets. Engineers rely on its 112 I/O count and 0.5 mm pitch TQFP-144 package for direct PCB drop-in within existing qualified layouts.
Recommended
Custom Bus Protocol Implementation
The EPF8820ATI144-3N excels at implementing custom parallel bus protocols such as proprietary backplanes, ARINC 429, MIL-STD-1553 monitoring, or legacy peripheral buses where standard microcontrollers lack sufficient I/O or timing flexibility. The 112 I/O count can be partitioned into address, data, and control buses with margin for handshake lines, while the FLEX 8000 LUT-based architecture maps cleanly to bus state machines. Industrial temperature range supports outdoor and vehicle-mounted equipment.
Recommended
Long-Lifecycle Equipment Refresh
Industrial equipment manufacturers with 15-25 year product support commitments use the EPF8820ATI144-3N as a stable platform for service replacement boards. Because the part is mature and well-documented in obsolescence-management databases, board designers can confidently specify it for the full support window without re-validation risk. The 144-pin TQFP footprint is compatible with modern SMT lines, and authorized brokers still stock inventory for ongoing service requirements.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ATI144-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ATC144-3N | EPF8820ATI144-3 | EPF8820ATI144-2N | EPF8820ATI144-2 | EPF8820ATI144-1 |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (LFQFP, 0.5 mm pitch) | TQFP-144 (LFQFP) - same | TQFP-144 (LFQFP) - same | TQFP-144 (LFQFP) - same | TQFP-144 (LFQFP) - same | TQFP-144 (LFQFP) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 672 | 672 | 672 | 672 | 672 | 672 |
| Max User I/O | 112 | 112 | 112 | 112 | 112 | 112 |
| Speed Grade | -3 | -3 | -3 | -2 (slower) | -2 (slower) | -1 (slowest) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Process / Configuration | CMOS SRAM | CMOS SRAM - same | CMOS SRAM - same | CMOS SRAM - same | CMOS SRAM - same | CMOS SRAM - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Unit Price (qty 100, as of 2026-09-12) | $12.40 | $11.80 (estimated, similar tier) | $12.40 (estimated) | $11.20 (estimated, slower grade) | $11.20 (estimated) | $10.50 (estimated, slowest grade) |
Key Differentiators
- Highest -3 speed grade in the FLEX 8000 TQFP-144 family (vs EPF8820ATI144-2N)
- Industrial temperature grade for harsh-environment deployment (vs EPF8820ATC144-3N)
- Mature, well-documented legacy FPGA with extensive design heritage (vs EPF8636AQC208-3)
Design Notes
The EPF8820ATI144-3N uses volatile SRAM configuration memory and does NOT retain its bitstream through power cycles. A non-volatile configuration device such as EPC1, EPC1064, EPC1213, or EPC1441 must be present on every board, or the FPGA will not configure at power-up. Designers porting designs from non-volatile CPLDs must add this storage element or the board will appear dead on first power-up. Estimated: this is a documented FLEX 8000 family behavior, not a derived calculation.
The 144-pin TQFP package has a 0.5 mm terminal pitch and gull-wing leads, requiring precise land pattern definition per IPC-7351. Place all VCCINT and VCCIO decoupling capacitors (0.1 uF X7R minimum) within 3 mm of each supply pin to minimize SSO noise. Keep the JTAG TDI/TDO/TMS/TCK traces short and route them on the same layer as the FPGA to avoid signal-integrity issues during in-system programming. Estimated land pattern guidance based on industry-standard 0.5 mm TQFP conventions.
When using 5V VCCIO to interface to legacy TTL peripherals, ensure that input signals do not exceed the absolute maximum rating of 7V, and that pull-ups on open-drain lines are sized for the I/O bank's drive strength. Mixing 3.3V and 5V banks is supported by FLEX 8000, but each VCCIO pin must be tied to its corresponding rail; leaving VCCIO floating causes unpredictable I/O behavior. JTAG TCK should be buffered if multiple devices share the scan chain to preserve edge rates.
The 144-pin TQFP package has a moderate thermal resistance and relies primarily on PCB copper pours for heat dissipation. For industrial -40C to +85C operation at full 112-I/O switching activity, provide at least 2 square inches of unbroken ground plane on the top layer beneath the package. Avoid placing the device adjacent to high-power regulators. Estimated: junction temperature calculations depend on switching activity not specified in datasheet; this guidance is conservative.
Differential clock inputs should be routed with matched lengths (within 1 mm) and a continuous ground reference on an adjacent layer. FastTrack interconnect routing inside the device is fixed but predictable; reserve one global clock pin pair for the system clock and use a dedicated PLL-equipped LE cluster if frequency multiplication is needed. Configuration-related pins (nSTATUS, CONF_DONE, nCONFIG) require external 10 kohm pull-ups to VCCIO for reliable operation.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data; FLEX 8000 family predates many modern compliance standards. AEC-Q100 not qualified. Designers should request compliance documentation directly from authorized distributors when required.
