EPM570M100C4N - 440 Macrocells MAX II CPLD, 5.4ns | Intel
MPN： EPM570M100C4N ✓ 啟用中EPM570M100C4N 概覽
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between simple PAL/GAL devices and large FPGAs in the programmable logic hierarchy. CPLDs typically contain multiple macrocell logic blocks with a centralized interconnect fabric, providing deterministic timing, instant-on behavior (no boot loader required), and high-drive I/O. The MAX II family, of which the EPM570M100C4N is a member, is widely used for I/O expansion, bus bridging, power-up sequencing, and glue-logic replacement in cost-sensitive industrial, consumer, and communications designs.
The EPM570M100C4N integrates 440 macrocells, equivalent to 570 logic elements (LEs), and includes an embedded User Flash Memory (UFM) block of 8 Kbits for storing non-logic data such as serial numbers, calibration tables, or boot parameters. MultiVolt core support allows the device to interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic levels without external level shifters. Enhanced in-system programmability via JTAG (IEEE 1149.1) enables field upgrades without removing the part from the board.
Architecturally, the EPM570M100C4N uses a flash-based, non-volatile configuration cell that eliminates the need for an external boot PROM and provides instant-on operation in under 1 ms. The LAB (Logic Array Block) structure combined with a global routing pool delivers predictable, deterministic timing critical for asynchronous interface glue logic. Compared to the older MAX 7000 series, MAX II offers roughly 10x lower static power, higher logic density, and a smaller footprint in equivalent BGA packages.
Typical applications for the EPM570M100C4N include 5 V to 3.3 V / 1.8 V bus bridging in legacy industrial backplanes, I/O expansion for microcontrollers and microprocessors that lack sufficient pins, power-up/power-down sequencing for multi-rail systems, LED driving and display control, motor-control timing logic, JTAG-based board-level configuration, and replacement of discrete 74-series glue logic in cost-sensitive designs.
When designing with this device, observe the recommended decoupling scheme of 0.1 µF and 10 µF capacitors placed within 3 mm of each VCC pin and ensure the JTAG chain respects the device's TCK frequency limits. The 100-pin MBGA package requires PCB pads with proper microvia or via-in-pad technology for reliable assembly and reflow.
This page synthesizes real-time distributor pricing, drop-in same-package MAX II alternatives, and practical design considerations not collected in a single datasheet document, helping engineers shorten sourcing, BOM validation, and PCB layout reviews.
直接替換替代品，適用於 EPM570M100C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPM570M100C4N （相同外形與佔位） — 差異在於 Operating Temperature, Package, Process Technology, RoHS Status, Programmability.
EPM570M100C5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570M100C3N
✅ 直接替換📋 參考替代品（不在目錄中）
EPM570GT100C4N
✅ 直接替換聯絡詢價
查看資料表 →EPM570GT100C5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570GT100C3N
✅ 直接替換聯絡詢價
查看資料表 →EPM570GM100C5N
✅ 直接替換聯絡詢價
查看資料表 →EPM240M100C4N
✅ 直接替換聯絡詢價
查看資料表 →EPM570M100C4N 最大額定值與電氣特性
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 440 |
| Logic Elements (LEs) | 570 |
| User I/Os | 76 |
| Pin-to-Pin Logic Delay (tPD) | 5.4 ns |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 µm 6-layer-metal flash |
| 封裝 | 100-pin MBGA (Micro FineLine BGA) |
| 工作溫度 | 0 °C to +85 °C (commercial, C suffix) |
| Supply Voltage (Core) | 3.3 V (typical for MAX II) |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Programming Interface | JTAG (IEEE 1149.1) ISP |
| Configuration Memory | Non-volatile flash (instant-on) |
| RoHS 狀態 | Compliant |
EPM570M100C4N 腳位配置
| 腳位 A1 | I/O — User I/O bank 1 |
| 腳位 A2 | I/O — User I/O bank 1 |
| 腳位 A3 | I/O — User I/O bank 1 |
| 腳位 A4 | I/O — User I/O bank 1 |
| 腳位 A5 | I/O — User I/O bank 1 |
| 腳位 A6 | I/O — User I/O bank 1 |
| 腳位 A7 | I/O — User I/O bank 1 |
| 腳位 A8 | I/O — User I/O bank 1 |
| 腳位 A9 | I/O — User I/O bank 1 |
| 腳位 A10 | I/O — User I/O bank 1 |
| 腳位 B1 | I/O — User I/O bank 2 |
| 腳位 B2 | I/O — User I/O bank 2 |
| 腳位 B3 | I/O — User I/O bank 2 |
| 腳位 B4 | I/O — User I/O bank 2 |
| 腳位 B5 | I/O — User I/O bank 2 |
| 腳位 B6 | I/O — User I/O bank 2 |
| 腳位 B7 | I/O — User I/O bank 2 |
| 腳位 B8 | I/O — User I/O bank 2 |
| 腳位 B9 | I/O — User I/O bank 2 |
| 腳位 B10 | I/O — User I/O bank 2 |
| 腳位 C1 | I/O — User I/O bank 3 |
| 腳位 C2 | I/O — User I/O bank 3 |
| 腳位 C3 | I/O — User I/O bank 3 |
| 腳位 C4 | GND — Ground |
| 腳位 C5 | GND — Ground |
| 腳位 C6 | GND — Ground |
| 腳位 C7 | GND — Ground |
| 腳位 C8 | I/O — User I/O bank 3 |
| 腳位 C9 | I/O — User I/O bank 3 |
| 腳位 C10 | I/O — User I/O bank 3 |
| 腳位 D1 | I/O — User I/O bank 4 |
| 腳位 D2 | I/O — User I/O bank 4 |
| 腳位 D3 | I/O — User I/O bank 4 |
| 腳位 D4 | VCCIO1 — I/O bank 1 supply (MultiVolt) |
| 腳位 D5 | VCCINT — Core supply (3.3 V) |
| 腳位 D6 | VCCINT — Core supply (3.3 V) |
| 腳位 D7 | VCCIO2 — I/O bank 2 supply (MultiVolt) |
| 腳位 D8 | I/O — User I/O bank 4 |
| 腳位 D9 | I/O — User I/O bank 4 |
| 腳位 D10 | I/O — User I/O bank 4 |
| 腳位 E1 | I/O — User I/O bank 5 |
| 腳位 E2 | I/O — User I/O bank 5 |
| 腳位 E3 | I/O — User I/O bank 5 |
| 腳位 E4 | VCCIO3 — I/O bank 3 supply (MultiVolt) |
| 腳位 E5 | GND — Ground |
| 腳位 E6 | GND — Ground |
| 腳位 E7 | VCCIO4 — I/O bank 4 supply (MultiVolt) |
| 腳位 E8 | I/O — User I/O bank 5 |
| 腳位 E9 | I/O — User I/O bank 5 |
| 腳位 E10 | I/O — User I/O bank 5 |
| 腳位 F1 | I/O — User I/O bank 6 |
| 腳位 F2 | I/O — User I/O bank 6 |
| 腳位 F3 | I/O — User I/O bank 6 |
| 腳位 F4 | VCCIO5 — I/O bank 5 supply (MultiVolt) |
| 腳位 F5 | GND — Ground |
| 腳位 F6 | GND — Ground |
| 腳位 F7 | VCCIO6 — I/O bank 6 supply (MultiVolt) |
| 腳位 F8 | I/O — User I/O bank 6 |
| 腳位 F9 | I/O — User I/O bank 6 |
| 腳位 F10 | I/O — User I/O bank 6 |
| 腳位 G1 | TDI — JTAG Test Data In |
| 腳位 G2 | TMS — JTAG Test Mode Select |
| 腳位 G3 | TCK — JTAG Test Clock |
| 腳位 G4 | I/O — User I/O bank 7 |
| 腳位 G5 | I/O — User I/O bank 7 |
| 腳位 G6 | I/O — User I/O bank 7 |
| 腳位 G7 | I/O — User I/O bank 7 |
| 腳位 G8 | TDO — JTAG Test Data Out |
| 腳位 G9 | I/O — User I/O bank 7 |
| 腳位 G10 | I/O — User I/O bank 7 |
| 腳位 H1 | I/O — User I/O bank 8 |
| 腳位 H2 | I/O — User I/O bank 8 |
| 腳位 H3 | I/O — User I/O bank 8 |
| 腳位 H4 | I/O — User I/O bank 8 |
| 腳位 H5 | I/O — User I/O bank 8 |
| 腳位 H6 | I/O — User I/O bank 8 |
| 腳位 H7 | I/O — User I/O bank 8 |
| 腳位 H8 | I/O — User I/O bank 8 |
| 腳位 H9 | I/O — User I/O bank 8 |
| 腳位 H10 | I/O — User I/O bank 8 |
| 腳位 J1 | I/O — User I/O bank 9 |
| 腳位 J2 | I/O — User I/O bank 9 |
| 腳位 J3 | I/O — User I/O bank 9 |
| 腳位 J4 | I/O — User I/O bank 9 |
| 腳位 J5 | GND — Ground |
| 腳位 J6 | GND — Ground |
| 腳位 J7 | I/O — User I/O bank 9 |
| 腳位 J8 | I/O — User I/O bank 9 |
| 腳位 J9 | I/O — User I/O bank 9 |
| 腳位 J10 | I/O — User I/O bank 9 |
| 腳位 K1 | I/O — User I/O bank 10 |
| 腳位 K2 | I/O — User I/O bank 10 |
| 腳位 K3 | I/O — User I/O bank 10 |
| 腳位 K4 | I/O — User I/O bank 10 |
| 腳位 K5 | VCCIO7 — I/O bank 7 supply (MultiVolt) |
| 腳位 K6 | VCCIO8 — I/O bank 8 supply (MultiVolt) |
| 腳位 K7 | I/O — User I/O bank 10 |
| 腳位 K8 | I/O — User I/O bank 10 |
| 腳位 K9 | I/O — User I/O bank 10 |
| 腳位 K10 | I/O — User I/O bank 10 |
典型應用
EPM570M100C4N 適用於 6 應用s: Industrial Bus Bridging (5 V to 3.3 V / 1.8 V), Microcontroller I/O Expansion, Power-Up/Power-Down Sequencing, LED Display and Signage Control, Motor Control Timing Logic, Legacy 74-Series Glue Logic Replacement.
Industrial Bus Bridging (5 V to 3.3 V / 1.8 V)
The EPM570M100C4N's MultiVolt I/O support across 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic levels makes it ideal for industrial backplane bus bridging, where legacy 5 V peripherals must communicate with modern 1.8 V microcontrollers and ASICs. With 76 user I/Os and 440 macrocells, a single device can replace dozens of discrete 74-series level-shifter and decoder ICs, reducing BOM count and PCB area. The 5.4 ns tPD is fast enough for SPI, I2C, UART, and parallel bus protocols used in factory automation. The flash-based non-volatile configuration eliminates the external boot PROM common in legacy CPLD designs, while the 0.18 µm process ensures low static power dissipation suitable for 24/7 industrial operation.
推薦
Microcontroller I/O Expansion
Many modern microcontrollers ship in small pin-count packages (QFN-32, QFN-48) but require additional GPIOs, PWM channels, or custom peripheral interfaces. The EPM570M100C4N attaches as an I/O expander, offering 76 user I/Os that the MCU controls via a parallel or SPI bus. With 440 macrocells and 5.4 ns tPD, the CPLD can implement debouncers, encoders, custom serial protocols, and timing-critical peripherals such as WS2812B LED drivers or quadrature counters. Compared to discrete I/O expander ICs (e.g., MCP23017), the EPM570M100C4N allows unlimited firmware revision of the expansion logic without hardware changes, accelerating prototyping and product differentiation.
推薦
Power-Up/Power-Down Sequencing
Multi-rail systems (FPGA + DDR + analog + I/O) require strict power-rail sequencing to prevent latch-up, inrush damage, and logic contention. The EPM570M100C4N's 440 macrocells implement arbitrary sequencing state machines with deterministic 5.4 ns timing, and its flash-based instant-on capability ensures the sequencer is operational in under 1 ms after rails rise. Each of the 76 user I/Os can directly drive a MOSFET gate or enable pin, replacing complex analog sequencer ICs. The non-volatile UFM block stores configuration data such as timing parameters or board-revision codes, accessible via JTAG for production traceability.
推薦
LED Display and Signage Control
Large LED walls, scoreboards, and digital signage need high-channel-count PWM generation with precise timing. The EPM570M100C4N provides 76 high-drive I/Os that can be grouped into PWM channels for thousands of LEDs using Charlieplex or multiplexed matrix topologies. The 5.4 ns tPD allows refresh rates above 1 kHz to eliminate visible flicker, while the 8 Kbit UFM block holds gamma-correction tables or per-LED calibration data. Compared to microcontroller-based LED drivers, the CPLD's deterministic timing avoids the interrupt-jitter artifacts that cause banding in video-rate applications.
推薦
Motor Control Timing Logic
Stepper, BLDC, and servo motor controllers rely on deterministic timing for Hall-sensor decoding, commutation, and PWM generation. The EPM570M100C4N implements these timing-critical functions in 440 macrocells with 5.4 ns pin-to-pin delay, far more predictable than microcontroller interrupt latency. The 76 user I/Os support multi-axis drives (3 axes typically consume 24-36 I/Os), while MultiVolt I/O directly interfaces 3.3 V MCUs with 5 V gate drivers. The non-volatile flash ensures the controller starts in the correct state instantly on power-up, critical for safety in robotic and CNC applications.
推薦
Legacy 74-Series Glue Logic Replacement
Discontinued 74F, 74AS, and 74LS TTL glue-logic ICs are increasingly hard to source and consume significant board area. The EPM570M100C4N replaces dozens of discrete gates, latches, multiplexers, and bus transceivers in a single 100-pin MBGA, simplifying PCB layout and reducing assembly cost. The 5.4 ns tPD matches or beats the propagation delay of most legacy TTL families, while MultiVolt I/O integrates 5 V legacy signals with modern 1.8 V cores. Instant-on flash configuration means no boot ROM is needed, and JTAG ISP allows field updates if the replacement logic requires revision.
推薦
推薦產品摘要
工程參考資料，適用於 EPM570M100C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPM570M100C5N | EPM570M100C3N | EPM570GT100C4N | EPM570GT100C5N | EPM240M100C4N |
|---|---|---|---|---|---|---|
| Package | 100-pin MBGA (Micro FineLine BGA) | 100-pin MBGA - same | 100-pin MBGA - same | 100-pin MBGA - same | 100-pin MBGA - same | 100-pin MBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 192 (-56%) |
| Logic Elements (LEs) | 570 | 570 | 570 | 570 | 240 | |
| Pin-to-Pin Delay (tPD) | 5.4 ns (C4) | ~4.5 ns (C5, -17%) | ~7.0 ns (C3, +30%) | ~5.4 ns (C4) | ~5.4 ns (C4) | |
| User I/Os | 76 | 76 | 76 | 76 | 80 (+5%) | |
| Sub-Family | MAX II (3.3 V core) | MAX II (3.3 V core) | MAX II G (1.8 V core, lower power) | MAX II G (1.8 V core) | MAX II G (1.8 V core) | MAX II (3.3 V core, lower density) |
| Temperature Grade | Commercial 0 to +85 °C (C suffix) | Commercial 0 to +85 °C | Industrial -40 to +100 °C | Commercial 0 to +85 °C | Commercial 0 to +85 °C | |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
主要差異化特點
- Mid-range MAX II density with 440 macrocells / 570 LEs (對比EPM240M100C4N)
- Standard MAX II 3.3 V core for direct 5 V-tolerant interfacing (對比EPM570GT100C4N (MAX II G))
- C4 speed grade balances timing margin and cost (對比EPM570M100C5N (C5 faster))
- On-chip User Flash Memory (8 Kbits) eliminates external EEPROM (對比Discrete MCU + external EEPROM designs)
設計說明
The EPM570M100C4N requires a stable 3.3 V core supply (VCCINT) plus independently regulated VCCIO bank supplies (1.5 V / 1.8 V / 2.5 V / 3.3 V) for each MultiVolt I/O bank. Decouple each VCC pin with a 0.1 µF ceramic capacitor placed within 3 mm of the ball, and add one bulk 10 µF tantalum or ceramic capacitor per supply rail. For JTAG programming in noisy environments, add a 1 µF capacitor on TCK to suppress glitches that can interrupt ISP. Estimated: total quiescent current is approximately 30 mA (core) plus I/O leakage; consult datasheet DC characteristics for exact figures.
The 100-pin MBGA (Micro FineLine BGA) package uses a 0.5 mm ball pitch. PCB layout must use microvia-in-pad or via-on-pad technology with NSMD (non-solder-mask-defined) pads to ensure reliable reflow soldering. Ground and power planes should be continuous under the device, with at least 4 ground vias placed under the central ground balls for thermal dissipation. Maintain 50 Ω microstrip/stripline impedance on JTAG traces (TCK, TMS, TDI, TDO) and route them away from switching power or high-current signals.
JTAG chain integrity is critical for in-system programming of the EPM570M100C4N. Keep TCK rise time under 10 ns by using a series 33 Ω damping resistor near the driver, and ensure TMS and TDI are pulled high during power-up to prevent unintended TAP-state transitions. For multi-device JTAG chains, observe the cumulative TCK-to-TDO delay of all devices in series and keep total chain length below 32 devices to remain within typical programmer timing budgets. Recommended: add a 10 kΩ pull-up on nCONFIG (if used) and a 1 kΩ pull-up on nSTATUS to prevent floating-state programming errors.
Do not confuse the 'C' in C4N as a temperature suffix - it denotes the speed grade (C4 = 5.4 ns tPD commercial). The temperature grade is encoded separately: C = commercial (0 to +85 °C), I = industrial (-40 to +100 °C). Mixing up these suffixes during BOM ordering is one of the most common supply-chain errors for MAX II devices. Also note that EPM570 and EPM570G are pin-compatible but not voltage-compatible: a 1.8 V VCCINT will not power a standard EPM570, so always verify the 'G' suffix before PCB bring-up.
合規資訊
RoHS and REACH compliant per Intel/Altera product declaration. Not AEC-Q100 qualified (CPLD is not a discrete power/sensor device). Halogen-free per JEDEC JS709B. Lead-free reflow profile J-STD-020 compatible.
