ISL8200MIRZ - 10A Current-Share DC/DC Power Module | Renesas
MPN： ISL8200MIRZ ✗ 停產ISL8200MIRZ 概覽
**Background - What is a DC/DC Power Module?** A DC/DC power module is a complete switch-mode power supply (SMPS) miniaturized into a single IC-style package. Unlike a discrete buck converter, which requires the engineer to select and lay out external MOSFETs, an inductor, and compensation components, a power module embeds all these building blocks inside the device, leaving only input/output bulk capacitors and a feedback resistor divider external. Power modules belong to the broader category of point-of-load (PoL) converters, which sit on the PCB next to the load they power (FPGA core rail, ASIC, SoC). Within the SMPS family tree, a power module sits below the buck converter hierarchy: buck converter -> step-down regulator -> PoL converter -> power module -> integrated power management IC.
**Key features** of the ISL8200MIRZ include 10A continuous output current, current-share pin for parallel operation up to 60A (six modules), internal 4.5V/20V MOSFETs, internal inductor, internal feedback compensation, adjustable soft-start, power-good indicator, and over-current/over-voltage/thermal protection. The high level of integration eliminates the design and manufacturing risks associated with discrete buck implementations.
**Technical architecture**: The ISL8200MIRZ uses a voltage-mode PWM controller with internal loop compensation. The internal MOSFETs and inductor are co-packaged to minimize parasitic loop inductance, achieving high efficiency (typically >90% at 5V input to 3.3V output at moderate loads) and reduced EMI. The current-share bus allows multiple ISL8200M modules to operate in master-slave configuration with ±10% current matching.
**Typical applications** include datacom/telecom equipment (48V-to-PoL), FPGA/ASIC core and auxiliary rails, servers and storage area networks, and industrial point-of-load regulation. Designers favor it where PCB real estate is constrained or where rapid time-to-market outweighs the per-ampere cost of a discrete design.
**Design consideration**: Place input bulk capacitors within 5 mm of the module's VIN pins to minimize parasitic inductance, and use the exposed thermal pad for both thermal dissipation and the electrical ground return. The current-share pin must be tied together on all paralleled modules; floating it disables parallel operation.
**Unique value**: This page combines distributor pricing, EOL/last-time-buy status, same-family pin-compatible alternatives, and practical parallel-operation notes - information not consolidated on the manufacturer datasheet or distributor product pages.
直接替換替代品，適用於 ISL8200MIRZ — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ISL8200MIRZ （相同外形與佔位） — 差異在於 Output Voltage Range, RoHS Status, Topology.
ISL8200MIRZ-T
✅ 直接替換聯絡詢價
查看資料表 →ISL8200AM
✅ 直接替換📋 參考替代品（不在目錄中）
ISL8225MIRZ-T
✅ 直接替換📋 參考替代品（不在目錄中）
ISL8200MIRZ 最大額定值與電氣特性
| 拓撲 | Non-Isolated PoL Module, Step-Down (Buck) |
| 輸出數量 | 1 |
| 輸入電壓範圍 | 4.5 V to 20 V |
| 輸出電壓範圍 | 0.6 V to 6 V (adjustable) |
| Output Current | 10 A continuous |
| Current Share | Yes - parallel up to 6 modules (60 A) |
| 效率 | Up to ~95% (load/input dependent) |
| Integrated Components | PWM controller, MOSFETs, inductor, compensation |
| 電源良好輸出 | Yes |
| 軟啟動 | Adjustable (external capacitor) |
| Protection Features | OCP, OVP, OTP, UVLO |
| 工作溫度 | -40 C to +85 C (industrial) |
| 封裝 | QFN-style thermally-enhanced surface mount |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant (per Renesas product page) |
ISL8200MIRZ qfn-style thermally-enhanced surface mount 腳位配置指南
ISL8200MIRZ（qfn-style thermally-enhanced surface mount 封裝）的腳位配置。 此功率元件具有閘極、汲極與源極端子。對於非極性封裝，請參閱製造商資料表以取得確切的第 1 腳方向與佈局詳細資訊。常見應用包括電源設計、馬達驅動與負載切換。
無詳細腳位定義資料： ISL8200MIRZ.
請參閱 資料表 以查看完整腳位配置。
典型應用
ISL8200MIRZ 適用於 6 應用s: FPGA Core and Auxiliary Rails, Datacom and Telecom Point-of-Load, Server and Storage ASIC Power, Industrial 12V Bus Systems, Parallel Operation for 60A+ Rails, Test and Measurement Instrumentation.
FPGA Core and Auxiliary Rails
The ISL8200MIRZ is well matched to powering FPGA core, auxiliary, and transceiver rails in datacom and telecom designs. The 10A continuous current and adjustable 0.6V-6V output range cover the typical FPGA rail set: 1.0V core, 1.8V auxiliary, 2.5V transceiver, and 3.3V I/O. The current-share pin enables multiple ISL8200M modules to be paralleled for high-current FPGA cores (>10A), achieving ±10% phase-to-phase current matching without external balancing ICs. Engineers favor this module when PCB real estate is constrained because the integrated inductor, MOSFETs, and compensation eliminate ~20 external components. Post-EOL, the ISL8200AM should be evaluated as an active successor.
推薦
Datacom and Telecom Point-of-Load
The ISL8200MIRZ was designed specifically for 12V intermediate bus architectures used in datacom and telecom equipment. Accepting 4.5V-20V input, it can be powered directly from a 12V bus or from a front-end 48V-to-12V intermediate bus converter. The 0.6V minimum output supports modern ASIC and SoC core rails, while the 10A capability handles single-rail loads up to ~60W. The high level of integration reduces EMI vs. discrete buck designs, simplifying CE/FCC compliance in dense rack-mount systems.
推薦
Server and Storage ASIC Power
Server motherboards and RAID controllers demand compact, high-efficiency point-of-load regulation. The ISL8200MIRZ's 90-95% typical efficiency at 12V-to-3.3V conversion keeps thermal rise manageable in 1U/2U rack chassis, and the integrated inductor eliminates a tall through-hole component that would otherwise complicate airflow. The exposed thermal pad provides direct heatsinking to an inner PCB ground plane. Designers of new server boards should note the EOL status and plan migration to the ISL8200AM or a modern alternative PoL IC.
推薦
Industrial 12V Bus Systems
Industrial PLCs, motor controllers, and ruggedized embedded systems often use a 12V or 24V internal bus. The ISL8200MIRZ accepts up to 20V input, which fits directly off a regulated 12V rail but is below the typical 24V industrial bus voltage. For 24V industrial bus applications, a pre-regulator (24V-to-12V) is required before the ISL8200M. The -40C to +85C industrial temperature range supports harsh factory environments. After the April 2026 EOL, industrial customers should qualify the ISL8200AM or a non-pin-compatible alternative module.
推薦
Parallel Operation for 60A+ Rails
Up to six ISL8200MIRZ modules can be paralleled via the current-share pin to deliver 60A (or more) to a single high-current rail, making the module useful for ASICs, GPUs, and multi-core processors requiring >50W of core power. The ISHARE bus negotiates master/slave roles automatically, achieving ±10% current matching. Designers must tie the ISHARE pins of all paralleled modules together on the PCB and provide adequate input/output bulk capacitance to handle the combined inrush current at startup. This is a key differentiator vs. discrete PoL solutions which require an external current-share controller.
推薦
Test and Measurement Instrumentation
Bench-top test equipment, ATE systems, and laboratory instruments demand clean, low-noise rails for precision analog and mixed-signal subsystems. The ISL8200MIRZ provides a fixed-frequency PWM that produces predictable, repeatable EMI signatures, simplifying CE/FCC pre-compliance testing. The PGOOD output enables sequenced power-up of multi-rail instruments, while the adjustable soft-start controls inrush into downstream bulk capacitors. For new instrument designs after EOL, the ISL8200AM offers similar performance in active production status.
推薦
推薦產品摘要
工程參考資料，適用於 ISL8200MIRZ — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ISL8200MIRZ-T | ISL8200AM | ISL8225MIRZ-T |
|---|---|---|---|---|
| Brand | Renesas Electronics (formerly Intersil) | Renesas Electronics - same | Renesas Electronics - same | Renesas Electronics - same |
| Package | QFN-style thermally-enhanced SMD | QFN-style thermally-enhanced SMD - same | QFN-style thermally-enhanced SMD - same family | QFN-style thermally-enhanced SMD - same family |
| Lifecycle Status | Obsolete (EOL April 2026) | Obsolete (EOL April 2026) | Active (Renesas recommended successor) | Active (same family) |
| Pinout Compatibility | Reference design | Identical (same die) | Same family, verify pin-by-pin vs datasheet | Same family dual-output variant, different pinout - requires PCB review |
主要差異化特點
- Same-die drop-in option still purchasable (對比ISL8200MIRZ-T)
- Active lifecycle status in same family (對比ISL8200AM)
- Fully integrated PoL module (controller + FETs + magnetics) (對比Discrete buck converter designs)
設計說明
The ISL8200MIRZ uses a thermally-enhanced QFN-style package with a bottom-side exposed thermal pad. The pad MUST be soldered to the PCB ground plane, and the ground plane should extend as a copper pour beneath the module with thermal vias to inner/outer copper layers. At 10A load with 12V-to-3.3V conversion (~87% efficiency), the module dissipates approximately 1.3W - well within the package rating with proper PCB layout. Skipping the thermal pad solder connection or omitting the copper pour can push junction temperature above the +125C limit at high ambient temperatures.
Place input bulk capacitors within 5mm of the module's VIN pins and output capacitors within 5mm of VOUT, using wide copper traces or pours to minimize parasitic inductance. A 22uF ceramic + 100uF polymer aluminum combination per module is a typical starting point; derate capacitance based on DC bias of the ceramic. The exposed thermal pad must be grounded and stitched with thermal vias (typically 0.3mm drill, 1mm pitch, 9-12 vias minimum).
Three common pitfalls when using the ISL8200MIRZ: (1) Floating the ISHARE pin disables parallel operation - when using a single module, tie ISHARE to a defined voltage per datasheet (do not leave NC); (2) Exceeding 20V input triggers permanent MOSFET damage - add a TVS or upstream fuse for 24V industrial bus applications; (3) Post-April 2026 EOL, verify part date code and chain-of-custody from independent distributors to avoid counterfeit or remarked parts.
The ISL8200MIRZ was discontinued by Renesas in April 2026 per industry reporting. No pin-compatible drop-in successor has been released. For new designs, Renesas recommends the ISL8200AM (active status, same 10A/6V/20V family). Cross-brand alternatives (TI TPSM, ADI LTM series) require complete PCB redesign due to different pinouts. Last-time-buy inventory may be available from independent distributors but should be qualified and date-coded before use in production designs.
合規資訊
RoHS and REACH compliance per Renesas/Intersil product page. Not AEC-Q100 qualified - this is a commercial/industrial-grade power module, not an automotive part. Post-EOL, compliance certificates for new manufacturing lots are no longer issued; existing inventory retains the compliance status it was originally qualified under.
