LPC55S28JBD64Y - 150MHz Cortex-M33, 512KB Flash MCU | NXP
MPN： LPC55S28JBD64Y ✓ 啟用中LPC55S28JBD64Y 概覽
A microcontroller unit (MCU) is a single-chip computer that integrates a processor core, non-volatile program memory, SRAM, and peripherals such as UART, SPI, I2C, and USB into one package. Within the embedded-systems hierarchy, the MCU sits below application processors but above simple logic devices, and belongs to NXP's LPC5500 family within the broader EdgeVerse edge-computing platform, itself a descendant of the general-purpose ARM Cortex-M microcontroller lineage.
Key differentiating features of the LPC55S28JBD64Y include the ARMv8-M mainline Cortex-M33 core with a Memory Protection Unit (MPU), a built-in Nested Vectored Interrupt Controller (NVIC), and a non-maskable interrupt (NMI) input with selectable sources. The device is fabricated on a cost-effective 40-nm NVM process technology and offers Flexcomm serial connectivity with I2C, SPI, UART/USART, SDIO, and USB interfaces.
Technically, the LPC55S2x/S2x family is pin-, software- and peripheral-compatible across members, which the vendor cites as accelerating time to market. NXP's datasheet documentation details the Cortex-M33 core at revision r0p3, confirming secure ARMv8-M architecture suitable for TrustZone-style secure development workflows. The 512 KB flash allows complex firmware stacks, while the 150 MHz clock supports demanding real-time control and signal-processing workloads.
Typical applications include industrial automation and control nodes, IoT edge devices requiring secure boot and encrypted communication, and consumer embedded products such as smart accessories and battery-powered systems, where the LPC55S28's low power consumption and flexible serial connectivity provide a strong fit.
A key design consideration: the 'Y' ordering suffix denotes tape-and-reel packaging for automated assembly, while the otherwise-identical 'K' variant ships in trays; both share the same 64-HTQFP footprint, so pick based on your production line's feeding method.
This page synthesizes distributor pricing context, drop-in family alternatives, and practical design notes beyond the manufacturer datasheet, giving engineers a single decision-ready reference.
直接替換替代品，適用於 LPC55S28JBD64Y — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： LPC55S28JBD64Y （相同外形與佔位） — 差異在於 Package, Core Processor, Mounting Type, Process Technology, Connectivity.
LPC55S28JBD64K
✅ 直接替換聯絡詢價
查看資料表 →LPC55S26JBD64Y
✅ 直接替換聯絡詢價
查看資料表 →LPC55S69JBD64Y
✅ 直接替換📋 參考替代品（不在目錄中）
LPC5528JBD64
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC55S28JBD64Y 最大額定值與電氣特性
| Core Processor | ARM Cortex-M33 |
| Core Size | 32-bit |
| Core Revision | r0p3 |
| 最大時脈頻率 | 150 MHz |
| Flash Memory | 512 KB (512K x 8) |
| Connectivity | Flexcomm, I2C, SDIO, SPI, UART/USART, USB |
| Memory Protection Unit (MPU) | Yes |
| Interrupt Controller | NVIC (built-in) |
| NMI Input | Yes, with selectable sources |
| 封裝 | 64-HTQFP (10x10 mm), Square |
| Terminal Form | Gull Wing |
| Number of Terminals | 64 |
| 安裝類型 | Surface Mount |
| Temperature Grade | Industrial |
| Process Technology | 40 nm NVM |
| Product Family | LPC55S2x (EdgeVerse platform) |
| Packaging Suffix | Y = Tape & Reel |
LPC55S28JBD64Y 64-htqfp (10x10 mm), square 腳位配置指南
LPC55S28JBD64Y（64-htqfp (10x10 mm), square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： LPC55S28JBD64Y.
請參閱 資料表 以查看完整腳位配置。
典型應用
LPC55S28JBD64Y 適用於 6 應用s: Industrial Automation and Control, IoT Edge Devices, Secure Connected Consumer Products, Embedded USB Device Applications, Data Acquisition and Sensor Hubs, Battery-Powered Portable Instruments.
Industrial Automation and Control
The LPC55S28JBD64Y fits industrial control nodes because its 150 MHz Cortex-M33 core with MPU provides deterministic execution and memory isolation for real-time control loops, while the industrial temperature grade suits factory-floor environments. Its Flexcomm architecture flexibly assigns serial blocks as I2C, SPI, or UART/USART to talk to PLC I/O, motor drivers, and HMI panels, with the NMI input giving fast fault handling for safety interlocks. The 512 KB flash stores protocol stacks and firmware update images, and the built-in USB interface simplifies field configuration and diagnostics without extra bridge ICs.
推薦
IoT Edge Devices
For IoT edge nodes, the LPC55S28JBD64Y aligns on three parameters: the 150 MHz Cortex-M33 delivers enough headroom for TLS encryption and sensor fusion, the 512 KB flash holds secure bootloaders plus connectivity stacks, and the 40-nm NVM process keeps active power low for battery-powered designs. NXP explicitly places the LPC552x/S2x family in its EdgeVerse edge-computing platform for this use case. The selectable-source NMI and MPU support fault-tolerant operation, while Flexcomm ports adapt to Wi-Fi/BLE modules over UART or SPI, and SDIO supports storage expansion for local data logging.
推薦
Secure Connected Consumer Products
Consumer connected accessories benefit from the LPC55S28JBD64Y's balance of cost and capability: a single 150 MHz ARMv8-M core runs application firmware plus a secure boot flow, and the S-series security subset supports key storage and cryptographic operations needed for cloud pairing. Peripherals cover capacitive-touch, display (via SPI/SDIO), and USB interfaces in one 64-HTQFP 10x10 mm footprint, keeping BOM count low. The 512 KB flash accommodates feature-rich consumer firmware, and the pin-compatible family lets product tiers share one PCB with the LPC55S26 or LPC55S69 for cost or feature scaling.
推薦
Embedded USB Device Applications
The on-chip USB controller of the LPC55S28JBD64Y makes it a strong fit for USB device-class products such as custom HID devices, virtual COM-port instruments, and firmware-update dongles. Running at 150 MHz, the Cortex-M33 comfortably services USB interrupt traffic while executing application logic, and the Flexcomm UART/SPI ports link the MCU to sensors or FPGAs behind the USB facade. The 512 KB flash retains bootloader and descriptor images, enabling field firmware upgrades over USB, a common requirement for professional equipment and developer tools in the 64-HTQFP form factor.
推薦
Data Acquisition and Sensor Hubs
As a sensor hub, the LPC55S28JBD64Y aggregates multiple sensor streams through its Flexcomm serial blocks configured as SPI or I2C masters, timed by the 150 MHz core with DMA-style throughput aided by NVIC-managed interrupts. The 512 KB flash supports local calibration tables, linearization code, and logging buffers, while the MPU isolates safety-critical code from data-handling tasks. The NMI input provides immediate response to over-range or watchdog fault conditions. Industrial temperature grading keeps the part reliable in outdoor and uncontrolled-environment sensor deployments where consumer-grade MCUs drift or fail.
推薦
Battery-Powered Portable Instruments
Portable instruments leverage the LPC55S28JBD64Y's low-power 40-nm process and 150 MHz performance-on-demand: the core runs at full speed for measurement bursts and idles between readings to extend battery life. The 512 KB flash stores instrument firmware, UI assets, and logged datasets, while the SDIO-capable Flexcomm block writes to storage cards for data export. USB on-chip enables charging and PC connectivity without a separate controller. The industrial temperature grade also covers ruggedized handhelds used in field service, where consumer parts would violate operating-range requirements during thermal extremes.
推薦
推薦產品摘要
工程參考資料，適用於 LPC55S28JBD64Y — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | LPC55S28JBD64K | LPC55S26JBD64Y | LPC55S69JBD64Y | LPC5528JBD64 |
|---|---|---|---|---|---|
| Package | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) - same | 64-HTQFP (10x10 mm) - same | 64-HTQFP (10x10 mm) - same | 64-HTQFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M33 (r0p3), single core | ARM Cortex-M33, single core | ARM Cortex-M33, single core | ARM Cortex-M33, dual core | ARM Cortex-M33, single core |
| Max Clock Frequency | 150 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz |
| Connectivity | Flexcomm, I2C, SDIO, SPI, UART/USART, USB | Same peripheral set | Flexcomm, I2C, SDIO, SPI, UART/USART, USB | Flexcomm, I2C, SDIO, SPI, UART/USART, USB | Flexcomm, I2C, SPI, UART/USART, USB |
主要差異化特點
- 512 KB flash in the lowest-cost single-core tier (對比LPC55S26JBD64Y)
- Lower cost than dual-core for single-core workloads (對比LPC55S69JBD64Y)
- Tape-and-reel delivery for high-volume assembly (對比LPC55S28JBD64K)
設計說明
The 64-HTQFP (10x10 mm) gull-wing package requires a standard 0.5 mm pitch land pattern; verify against the NXP footprint recommendation in the family datasheet before release. Because the entire LPC552x/S2x family is pin-compatible, design the PCB so any family member (LPC55S26, LPC55S28, LPC55S69) can be fitted - this costs nothing at layout time and preserves a sourcing escape path. Use a solid ground plane under the chip and connect the exposed center thermal pattern per NXP layout guidelines for best signal integrity.
Provide clean, decoupled supplies per the family datasheet power-domain diagram, placing 100 nF ceramic capacitors at each supply pin pair plus one bulk capacitor per rail, as close to the pins as possible. With a 40-nm core running at 150 MHz, core supply integrity directly affects maximum achievable clock frequency; poor decoupling typically manifests as intermittent failures near the top of the frequency range rather than outright non-start. Route analog supply domains separately from digital per NXP reference designs for the LPC55xx family.
Do not confuse the ordering suffixes: JBD64Y is tape-and-reel and JBD64K is tray - mixing them in procurement changes packaging, not function, but automated lines cannot use tray-only feed. Also confirm flash capacity needs before choosing the LPC55S26 as a cost-down: its smaller flash is the primary functional difference versus this 512 KB part. Finally, when migrating firmware to the LPC55S69, dual-core code will not run on this single-core LPC55S28, so abstract peripheral drivers from core-specific services from day one.
合規資訊
Compliance details not present in the provided web data. NXP's official product page lists an Environmental Quality section for LPC55S28JBD64; consult it directly for RoHS/REACH status.
