MCIMX6U1AVM08AB - Microcontrollers | NXP Semiconductors
MPN： MCIMX6U1AVM08AB ✗ 停產MCIMX6U1AVM08AB 概覽
A microprocessor (MPU) is a system-on-chip that integrates one or more CPU cores, memory controllers, peripheral interfaces, and often a graphics processor on a single die. The MCIMX6U1AVM08AB sits in the i.MX6 family hierarchy between the single-core i.MX6 Solo and the higher-end i.MX6 Dual, which adds a 3D GPU and additional multimedia IP. Within the broader taxonomy, this places it at: ARM Cortex-A9 core -> i.MX6 applications processor -> i.MX family -> NXP applications processors -> 32-bit MPU -> semiconductor. Understanding this hierarchy helps designers benchmark it against competing Cortex-A9 parts such as TI Sitara AM437x and other mid-range multimedia MPUs.
Key features include dual ARM Cortex-A9 cores at 800 MHz, hardware video codecs supporting up to 1080p decoding, integrated LVDS/MIPI display controllers, dual Gigabit Ethernet MACs with hardware acceleration, USB 2.0 with PHY, PCI Express Gen 2.0, and multiple connectivity peripherals including CAN, I2C, SPI, UART, and SD/MMC. The processor is paired with an advanced power management block enabling per-domain clock gating and DVFS for energy-efficient operation.
From an architectural standpoint, the part uses NEON SIMD media processing extensions, a 32 KB / 32 KB L1 cache per core, and a unified 512 KB L2 cache. It supports LPDDR2, LVDDR3, and DDR3/LV-DDR3 memory interfaces, providing flexible system-memory configurations. Bus architectures include AHB for high-bandwidth peripherals and APB for low-bandwidth configuration registers.
Typical uses include industrial HMI panels, automotive infotainment head units, telematics and connected-vehicle gateways, point-of-sale terminals, medical imaging displays, and ruggedized multimedia IoT edge devices. The automotive grade specified in the MPN suffix (-A) makes it well suited to in-vehicle applications that must operate across the full automotive temperature window.
When designing with the MCIMX6U1AVM08AB, follow the NXP hardware design guide and use the evaluation board reference schematic to plan DDR routing. Pin 1 of the MAPBGA is typically identified by the corner marking; engineers should consult the package mechanical drawing before PCB layout. Thermal management at this die size benefits from a well-grounded inner copper plane layer.
This page synthesizes NXP-authorized distributor pricing, drop-in same-family variants, and practical design guidance that complements the official i.MX6 reference manual.
直接替換替代品，適用於 MCIMX6U1AVM08AB — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MCIMX6U1AVM08AB （相同外形與佔位） — 差異在於 MSL Level, Memory Interface, Supply Voltage.
MCIMX6S4AVM08AB
✅ 直接替換聯絡詢價
查看資料表 →MCIMX6U5AVM08AB
✅ 直接替換📋 參考替代品（不在目錄中）
MCIMX6U1AVM08AC
✅ 直接替換📋 參考替代品（不在目錄中）
MCIMX6U1AVM08AB 最大額定值與電氣特性
| Core Architecture | ARM Cortex-A9 (dual-core) |
| Maximum Core Frequency | 800 MHz |
| 資料匯流排寬度 | 32-bit |
| Family | i.MX 6DualLite (i.MX6DL) |
| 封裝 / 外殼 | 624-MAPBGA (21x21 mm) |
| 腳位數 | 624 |
| 供應電壓 | 1.8 V / 2.5 V / 2.8 V / 3.15 V (multi-rail) |
| Temperature Grade | Automotive |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 512 KB unified |
| NEON SIMD | Yes |
| Memory Interface | LPDDR2, LPDDR3, DDR3, LV-DDR3 |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
MCIMX6U1AVM08AB 624-mapbga (21x21 mm) 腳位配置指南
MCIMX6U1AVM08AB（624-mapbga (21x21 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MCIMX6U1AVM08AB.
請參閱 資料表 以查看完整腳位配置。
典型應用
MCIMX6U1AVM08AB 適用於 6 應用s: Industrial Human-Machine Interface (HMI), Automotive Infotainment Head Unit, Telematics and Connected-Vehicle Gateway, Point-of-Sale Terminal, Medical Imaging Display Console, Ruggedized Multimedia IoT Edge Device.
Industrial Human-Machine Interface (HMI)
The MCIMX6U1AVM08AB fits industrial HMI panels thanks to its dual ARM Cortex-A9 cores and integrated 2D GPU, which can drive LVDS/MIPI displays up to 1080p without an external graphics chip. The 800 MHz core clock executes Qt/QML or Web-based HMI stacks with smooth frame rates, while the DDR3/LPDDR2 controller keeps memory bandwidth ample for animated UIs. Placed on a 4-layer carrier board with a 5V to 1.8V/2.5V/2.8V/3.15V PMIC, it dissipates roughly 2-3 W at full load versus the 5-8 W of an i.MX6 Quad part, easing thermal design.
推薦
Automotive Infotainment Head Unit
The MCIMX6U1AVM08AB is qualified for in-vehicle use by its automotive temperature grade and integrates hardware video codecs for 1080p H.264 decode plus audio DSP offload, which is precisely what mid-tier infotainment head units need. Dual Cortex-A9 cores support Android Auto/CarPlay class stacks with their Linux/Android base port running on one core and media pipelines on the other. Compared with the i.MX6 Dual or Quad, the DualLite's omission of 3D GPU cuts BOM cost; designers wanting 3D maps must step up to MCIMX6U4AVM08AC, which changes pin assignments.
推薦
Telematics and Connected-Vehicle Gateway
Dual Gigabit Ethernet MACs with hardware acceleration let the MCIMX6U1AVM08AB aggregate automotive Ethernet traffic from ECUs while running a Linux telematics stack on the Cortex-A9 cores. The integrated CAN controllers tie the SoC directly to vehicle CAN-FD busses without external bridges, lowering system cost and PCB area. At 800 MHz the part handles TLS encryption on roughly 100 Mbps of network traffic; design for a heatsink or thermal via array if the gateway is sealed against airflow.
推薦
Point-of-Sale Terminal
POS terminals running Android or Linux benefit from the MCIMX6U1AVM08AB's hardware crypto accelerators and dual display controllers for customer/operator screens. The integrated LVDS/MIPI and PCIe controllers let the carrier board drive a touch display, a printer, and a magnetic-card reader off a single SoC. Compared with the single-core i.MX6 Solo, the dual Cortex-A9 lets one core run payment processing and the other drive the UI, isolating security and UX threads.
推薦
Medical Imaging Display Console
The MCIMX6U1AVM08AB supports medical-grade imaging displays because its DVI/HDMI output and LVDS interface pair with high-resolution panels and its hardware codecs handle ultrasound/ endoscopy video at low latency. With 800 MHz Cortex-A9 and NEON SIMD, real-time image preprocessing runs in software without offloading to a DSP. Designers should observe IEC 60601 isolation requirements on the carrier board - the SoC itself is not medical-grade certified, but it integrates well into systems that target IEC 60601-1.
推薦
Ruggedized Multimedia IoT Edge Device
Outdoor signage, kiosk terminals, and ruggedized edge devices run on the MCIMX6U1AVM08AB due to its automotive temperature grade, integrated LVDS panels, and 2D GPU that drives human-readable dashboards. The PCIe Gen 2.0 controller accepts an AI accelerator card or SSD for edge AI, while dual GbE handles uplink and daisy-chain connectivity. Typical carrier-board power dissipation lands between 2-3 W, which suits fanless enclosures; effective thermal management requires a continuous inner copper plane and thermal vias under the BGA.
推薦
推薦產品摘要
工程參考資料，適用於 MCIMX6U1AVM08AB — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MCIMX6S4AVM08AB | MCIMX6U5AVM08AB | MCIMX6U1AVM08AC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 624-MAPBGA (21x21 mm) | 624-MAPBGA (21x21 mm) | 624-MAPBGA (21x21 mm) | 624-MAPBGA (21x21 mm) |
| Core | Dual ARM Cortex-A9 | Single ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Family | i.MX6 DualLite (U1) | i.MX6 Solo (S4) | i.MX6 DualLite (U5) | i.MX6 DualLite (U1) |
| GPU | 2D only | 2D only | 2D only | 2D only |
| Lifecycle | NRND | NRND | NRND | NRND |
主要差異化特點
- Balanced multimedia and dual-core compute (對比MCIMX6S4AVM08AB)
- Lower power than i.MX6 Quad (對比MCIMX6U4AVM08AC)
- Automotive temperature grade standard (對比MCIMX6U1AVM08AC)
設計說明
Estimated: at typical 1.05 V core supply with both Cortex-A9 cores active, the MCIMX6U1AVM08AB dissipates approximately 2-3 W. The 21x21 mm MAPBGA package benefits from a 4-layer PCB with a continuous GND plane under the BGA; thermal vias (0.2 mm drill, 0.5 mm pitch) tied to inner copper help spread heat. For sealed industrial enclosures, derate to roughly 70% of maximum core frequency.
Follow the NXP i.MX6 hardware design guide for DDR3/LPDDR2 routing: 50 ohm single-ended impedance, length matching within +/-25 mils for byte lanes, and decoupling within 100 mils of every BGA power pin. Place the 24 MHz crystal within 5 mm of the XTAL pins with a guard ring tied to AGND. Route USB DP/DN as a 90 ohm differential pair with no stubs, and add common-mode chokes at the connector.
Do not power the MCIMX6U1AVM08AB without bringing up all four voltage rails (1.8 V, 2.5 V, 2.8 V, 3.15 V) in the order specified by the NXP power-up sequence; the PMIC's POWER_OK signal must gate the processor's reset to avoid latch-up. Avoid routing high-speed signals under the BGA shadow - the inner planes will be perforated by via arrays. Always program the boot configuration fuses before production flashing.
合規資訊
RoHS compliance per NXP product page. AEC-Q100 specifically refers to automotive electrical-component qualification; the -A suffix indicates NXP's automotive temperature grade but is not equivalent to AEC-Q100 certification, which is not declared on the product page.
