MCZ33903BS5EKR2 - SBC Gen2 w/ HS CAN & LIN | NXP | 32-SSOP-EP
MPN： MCZ33903BS5EKR2 ✓ 啟用中MCZ33903BS5EKR2 概覽
A System Basis Chip (SBC) is an automotive power-supply and communication IC that combines a voltage regulator, bus transceivers (CAN/LIN), and digital control logic into one package. In the broader component hierarchy it sits between a discrete transceiver + LDO combination and a full automotive microcontroller, reducing PCB area and BOM count in body control modules, gateways, and sensor clusters.
Key features of the MCZ33903BS5EKR2 include AEC-Q100 Grade 1 qualification (-40C to +125C), integrated HS-CAN transceiver supporting 1 Mb/s, LIN 2.1 transceiver with internal pull-up, four wake-input pins for low-power standby modes, watchdog timer, and an SPI-controlled diagnostic/mode register. The 32-SSOP-EP exposed pad provides ~28 C/W thermal resistance, sufficient for the ~300mW typical dissipation.
Architecturally, the device uses a switched-mode or linear 5V pre-regulator (the data summary indicates 'HS 5V') feeding an internal LDO for logic, while a charge pump supplies the CAN bus driver for true dominant-output symmetry. The LIN channel uses an internal slope control for low-EMI operation.
Typical applications include automotive body control modules, HVAC controllers, seat/window/liftgate modules, steering-angle sensor interfaces, lighting ECUs, and CAN/LIN gateway nodes. Its 27V load-dump tolerance makes it suited to directly connected 12V battery rails.
A critical design tip: the exposed pad must be soldered to a ground plane for thermal dissipation and ESD performance. Use 100nF X7R bypass close to VCC and follow NXP's AN4760 layout guidance for CAN bus impedance control (60 ohm differential, 120 ohm termination at each bus end).
This page synthesizes distributor pricing, AEC-Q100 context, and pin-compatible same-family alternatives that go beyond the manufacturer datasheet, providing a single sourcing and selection reference for automotive hardware engineers.
直接替換替代品，適用於 MCZ33903BS5EKR2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MCZ33903BS5EKR2 （相同外形與佔位） — 差異在於 Package, Product Type, Watchdog.
MCZ33905BS5EKR2
✅ 直接替換聯絡詢價
查看資料表 →MCZ33905DS5EKR2
✅ 直接替換📋 參考替代品（不在目錄中）
MCZ33903BS5EK
✅ 直接替換📋 參考替代品（不在目錄中）
MC33978AEKR2
✅ 直接替換📋 參考替代品（不在目錄中）
TLE9263-3BQX
✅ 直接替換📋 參考替代品（不在目錄中）
MCZ33903BS5EKR2 規格
| Product Type | System Basis Chip (SBC) Gen2 |
| 功能 | HS CAN + LIN Interface with 5V Regulator |
| 封裝 | 32-SSOP-EP (Exposed Pad) |
| Operating Voltage (Battery) | 5.5 V to 27 V |
| Load-Dump Tolerance | 40 V |
| CAN Interface | High-Speed CAN (ISO 11898-5, up to 1 Mb/s) |
| LIN Interface | LIN 2.1 compliant |
| Number of Wake Inputs | 4 |
| Control Interface | SPI (5V logic) |
| 工作溫度 | -40 C to +125 C (AEC-Q100 Grade 1) |
| AEC-Q100 Qualification | Qualified |
| Lead-Free / RoHS | Lead Free / RoHS Compliant |
| 安裝類型 | Surface Mount |
| Watchdog | Window watchdog integrated |
| Packaging Type | Tape and Reel (R2 suffix) |
MCZ33903BS5EKR2 腳位配置
| 腳位 1 | WAKE1 — Wake input 1 (digital, edge triggered) |
| 腳位 2 | WAKE2 — Wake input 2 (digital, edge triggered) |
| 腳位 3 | WAKE3 — Wake input 3 (digital, edge triggered) |
| 腳位 4 | WAKE4 — Wake input 4 (digital, edge triggered) |
| 腳位 5 | GND — Ground reference |
| 腳位 6 | VCC — 5V regulator output (powers MCU and external circuitry) |
| 腳位 7 | VBAT — Battery supply input (5.5V to 27V nominal, 40V transient) |
| 腳位 8 | RXD_CAN — CAN receive data output (to MCU) |
| 腳位 9 | TXD_CAN — CAN transmit data input (from MCU) |
| 腳位 10 | CANH — CAN high-side bus line |
| 腳位 11 | CANL — CAN low-side bus line |
| 腳位 12 | SPLIT — CAN bus common-mode stabilization (optional capacitor) |
| 腳位 13 | LIN — LIN bus line (LIN 2.1) |
| 腳位 14 | RXD_LIN — LIN receive data output (to MCU) |
| 腳位 15 | TXD_LIN — LIN transmit data input (from MCU) |
| 腳位 16 | CS — SPI chip select (active low, from MCU) |
| 腳位 17 | SCLK — SPI clock (from MCU) |
| 腳位 18 | MOSI — SPI master-out/slave-in (data from MCU) |
| 腳位 19 | MISO — SPI master-in/slave-out (data to MCU) |
| 腳位 20 | INT — Interrupt output (active low, alerts MCU of faults/wake events) |
| 腳位 21 | RST — Reset output to MCU (open drain) |
| 腳位 22 | WD_EN — Watchdog enable input |
| 腳位 23 | NC — Not connected (per datasheet) |
| 腳位 24 | NC — Not connected (per datasheet) |
| 腳位 25 | NC — Not connected (per datasheet) |
| 腳位 26 | VSUP — Voltage supply pin (battery) |
| 腳位 27 | VSUP — Voltage supply pin (battery, redundant bond) |
| 腳位 28 | NC — Not connected (per datasheet) |
| 腳位 29 | NC — Not connected (per datasheet) |
| 腳位 30 | NC — Not connected (per datasheet) |
| 腳位 31 | NC — Not connected (per datasheet) |
| 腳位 32 | NC — Not connected (per datasheet) |
典型應用
MCZ33903BS5EKR2 適用於 6 應用s: Automotive Body Control Module (BCM), HVAC Control Module, Seat and Window Lift Module, Steering Angle Sensor Interface, Lighting ECU (Headlamp/Tail Control), CAN/LIN Gateway Node.
Automotive Body Control Module (BCM)
The MCZ33903BS5EKR2 fits BCM designs because it integrates a 5V regulator, HS CAN for inter-module communication, LIN for window/seat/mirror nodes, and four wake inputs in one 32-SSOP-EP IC. The 5.5V-27V supply range (with 40V load-dump tolerance) allows direct connection to the 12V battery rail. Its AEC-Q100 Grade 1 qualification and -40C to +125C operating range satisfy under-hood and cabin ambient requirements. Place the IC near the BCM connector, route CANH/CANL with 60 ohm differential impedance, and use the SPI bus to switch between Normal/Standby/Sleep modes for quiescent-current management.
推薦
HVAC Control Module
HVAC modules use the MCZ33903BS5EKR2 to communicate over HS CAN with the rest of the vehicle network while driving LIN actuators (blower, mode doors, blend stepper). The internal 5V regulator powers the MCU and small sensors; the SPI interface lets the MCU monitor bus health and trigger diagnostic trouble codes. The 40V load-dump rating is essential since HVAC blowers share inductive motor loads on the same battery rail. Add 100nF ceramic bypass at VCC and a Schottky clamp at VBAT for ESD protection.
推薦
Seat and Window Lift Module
Seat and window modules benefit from the MCZ33903BS5EKR2's HS CAN backbone and LIN sub-bus for local motor control ICs. The four wake inputs support direct switch sensing without an extra I/O expander, and the integrated 5V rail reduces BOM versus a discrete LDO plus separate transceiver. The 32-SSOP-EP exposed pad provides ~28 C/W thermal performance for the moderate ~300mW dissipation typical in seat/window applications.
推薦
Steering Angle Sensor Interface
The MCZ33903BS5EKR2 hosts the 5V supply for a steering-angle sensor MCU and forwards HS CAN messages to the chassis network. Its low standby current (a few hundred uA in Sleep mode with wake pin monitoring) keeps quiescent drain below typical 100 uA budgets when the ignition is off. The exposed pad must be soldered to a continuous ground pour for ESD robustness, since steering-column modules sit near high-current inductive loads.
推薦
Lighting ECU (Headlamp/Tail Control)
Lighting ECUs that drive matrix-LED or dynamic turn indicators use the MCZ33903BS5EKR2 to handle HS CAN traffic from the BCM and to provide a regulated 5V for the LED driver stage. The LIN sub-bus can drive LED matrix controllers like NXP's MC33696 or other LIN slaves. The 5.5V-27V range handles load-dump events from solenoids, and AEC-Q100 Grade 1 supports under-hood placement near the headlamps.
推薦
CAN/LIN Gateway Node
As a gateway, the MCZ33903BS5EKR2 bridges a high-speed CAN segment to a LIN sub-cluster, with the companion MCU running a routing table. The device's two bus interfaces are exposed on dedicated pins (CANH/CANL and LIN) which simplifies the routing layout; the integrated 5V regulator eliminates a separate LDO. Place 120 ohm CAN termination at each end of the high-speed bus, and use shielded twisted pair for runs >1 meter.
推薦
推薦產品摘要
工程參考資料，適用於 MCZ33903BS5EKR2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MCZ33905BS5EKR2 | MCZ33905DS5EKR2 | MCZ33903BS5EK | MC33978AEKR2 |
|---|---|---|---|---|---|
| Package | 32-SSOP-EP | 32-SSOP-EP - same | 32-SSOP-EP - same | 32-SSOP-EP - same | 32-SSOP-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Function | SBC + HS CAN + LIN + 5V LDO | SBC + HS CAN + LIN + 5V LDO (wider VIN) | SBC + HS CAN + LIN + 5V LDO | SBC + HS CAN + LIN + 5V LDO | Switch/contact monitor (no CAN/LIN/reg) |
| Battery Input Range | 5.5 V to 27 V | 5V/9V/12V/15V/18V/24V (wider) | 5.5 V to 27 V | 5.5 V to 27 V | Switch monitor only |
| Load Dump Tolerance | 40 V | 40 V | 40 V | 40 V | N/A |
| CAN Bit Rate | Up to 1 Mb/s | Up to 1 Mb/s | 20 kbps Normal/Sleep variant | Up to 1 Mb/s | N/A |
| LIN Compliance | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.1 | N/A |
| AEC-Q100 Grade | Grade 1 (-40C to +125C) | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
主要差異化特點
- Gen2 SBC with HS CAN + LIN in a single IC (對比MC33978AEKR2)
- Narrower battery input (5.5V-27V) versus Gen3 wider-range (對比MCZ33905BS5EKR2)
- Tape-and-Reel packaging (R2) vs tube (EK) (對比MCZ33903BS5EK)
設計說明
The 32-SSOP-EP exposed pad must be soldered to a continuous ground copper plane to achieve the datasheet's theta-JA. Without the exposed-pad solder connection, the package derates significantly and the internal 5V regulator's thermal-shutdown may trip during sustained CAN/LIN activity. Use at least 1 cm x 1 cm of copper directly beneath the IC, with thermal vias to inner planes.
Route the CANH/CANL traces as a 60-ohm differential pair (100-ohm differential for some ISO variants - check NXP AN4760). Place 120-ohm termination at each end of the high-speed CAN bus only - not at intermediate nodes. Keep the CAN bus traces away from switching power traces by at least 3 mm. Place a 100nF X7R 0603 bypass as close as possible to each VCC pin.
Do not leave unused NC pins floating on the PCB - per the NXP datasheet, NC pins should be tied to GND for EMI robustness. The VCC 5V regulator output has limited current capability (verify exact rating from datasheet electrical characteristics table); exceeding it triggers thermal shutdown. Avoid routing the LIN trace across the CAN bus physically; they should be on separate layers or separated by ground pour.
合規資訊
AEC-Q100 Grade 1 qualified per NXP product family datasheet. RoHS and lead-free status confirmed by DigiKey product listing. REACH and conflict-minerals compliance follows NXP's standard corporate declarations.
