MIMXRT1064DVL6A - i.MX RT1064 600MHz M7 Crossover MCU | NXP
MPN： MIMXRT1064DVL6A ✗ 停產MIMXRT1064DVL6A 概覽
What is a crossover MCU? A crossover microcontroller combines the high-performance real-time processing of a microcontroller (deterministic interrupt response, simple programming model) with the application-processor-like peripheral set and clock speed typical of an applications processor. The i.MX RT1064 sits in the power-management IC (PMIC) ecosystem between traditional Cortex-M4 MCUs and Cortex-A-class application processors, and is positioned in the broader NXP i.MX product family that also includes i.MX 6/7/8 application processors.
Key features of the MIMXRT1064DVL6A include 4 MB on-chip flash (the first i.MX RT family to integrate on-chip flash), 1 MB on-chip SRAM with configurable RAM partitioning, and a rich peripheral set including dual USB 2.0 with PHY, dual CAN-FD, dual SDIO/eMMC, two SAI/I2S audio interfaces, two camera interfaces (CSI), an LCDIF controller for displays up to WXGA, a 10/100-Mbit Ethernet MAC, and hardware cryptography acceleration (AES, SHA, TRNG). The 600 MHz core delivers 1284 CoreMark and 3010 DMIPS, while an integrated FPU and DSP extensions accelerate floating-point and signal-processing code paths.
Typical applications for the MIMXRT1064DVL6A include industrial HMI panels, audio subsystems with display, IoT edge gateways, point-of-sale terminals, motor control and home appliance controllers, and low-cost audio/video consumer devices. The on-chip flash reduces BOM cost and PCB area relative to i.MX RT parts requiring external QSPI flash.
When designing with this MCU, allocate careful attention to decoupling (the 600 MHz core demands dense, low-impedance power distribution), PCB stackup (the 10 mm x 10 mm 196-LFBGA package has a 0.65 mm ball pitch and requires microvia PCB fabrication), and boot-mode configuration via the BOOT_MODE pins. DDR memory routing must follow length-matching rules documented in the hardware user guide.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 MIMXRT1064DVL6A — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MIMXRT1064DVL6A （相同外形與佔位） — 差異在於 Package, Ethernet, Core Architecture, Operating Temperature Range, Maximum CPU Frequency.
MIMXRT1064DVL6B
✅ 直接替換📋 參考替代品（不在目錄中）
MIMXRT1064CVL5A
✅ 直接替換聯絡詢價
查看資料表 →MIMXRT106LDVL6A
✅ 直接替換📋 參考替代品（不在目錄中）
MIMXRT1062CVJ5A
✅ 直接替換📋 參考替代品（不在目錄中）
MIMXRT1064DVL6A 最大額定值與電氣特性
| Core Architecture | Arm Cortex-M7 |
| Maximum CPU Frequency | 600 MHz |
| On-Chip Flash | 4 MB (4M x 8) |
| On-Chip SRAM | 1 MB |
| CoreMark Score | 1284 (per NXP datasheet) |
| DMIPS | 3010 (per NXP datasheet) |
| FPU | Single + Double precision (IEEE 754) |
| DSP Extensions | Yes (SIMD) |
| 封裝 | 196-LFBGA (10 mm x 10 mm), 0.65 mm ball pitch |
| 工作溫度範圍 | 0C to +95C (consumer grade, D suffix) |
| 供應電壓 | Multiple rails: 3.3 V I/O, 1.15 V core, 1.35 V LDO/soc (per datasheet) |
| USB | 2 x USB 2.0 OTG with on-chip PHY |
| Ethernet | 10/100 Mbit MAC (ENET) |
| CAN | 2 x CAN-FD |
| Display Interface | LCDIF up to WXGA |
| Camera Interface | 2 x CSI |
| Cryptography Accelerator | AES-128/256, SHA-1/256, TRNG |
| RoHS 狀態 | Compliant |
MIMXRT1064DVL6A 196-lfbga (10 mm x 10 mm), 0.65 mm ball pitch 腳位配置指南
MIMXRT1064DVL6A（196-lfbga (10 mm x 10 mm), 0.65 mm ball pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MIMXRT1064DVL6A.
請參閱 資料表 以查看完整腳位配置。
典型應用
MIMXRT1064DVL6A 適用於 6 應用s: Industrial HMI with LCD Display, Audio Subsystem with Display, IoT Edge Gateway, Point-of-Sale Terminal, Motor Control and Home Appliances, Low-Cost Consumer Audio/Video Device.
Industrial HMI with LCD Display
The MIMXRT1064DVL6A fits industrial HMI panels because its 600 MHz Cortex-M7 core, 4 MB on-chip flash, and LCDIF controller handle WXGA-resolution TFT displays without external graphics memory. The 1 MB on-chip SRAM buffers frame updates, while the 10/100 Ethernet MAC and dual CAN-FD interfaces connect to PLC backbones. The 196-LFBGA 10x10 mm package is small enough for compact 5-inch panel designs and the consumer-grade temperature range suits indoor enclosures. Source: NXP datasheet IMXRT1064CEC.
推薦
Audio Subsystem with Display
The MIMXRT1064DVL6A is well suited to audio products with integrated displays (smart speakers, AV receivers, portable mixers). The dual SAI/I2S interfaces connect to external audio codecs, while the Cortex-M7 DSP extensions accelerate software codecs such as MP3, AAC, and Opus. The LCDIF drives a small TFT for UI feedback, and 4 MB on-chip flash stores firmware plus localized UI assets. Compared to an applications processor approach, the MIMXRT1064 lowers BOM cost and simplifies PCB layout. Source: NXP i.MX RT1064 datasheet.
推薦
IoT Edge Gateway
The MIMXRT1064DVL6A powers IoT edge gateways because its 600 MHz Cortex-M7 with FPU runs edge-inference models (TensorFlow Lite Micro) at low power, while dual USB OTG, Ethernet, and SDIO/eMMC host local storage and uplink connectivity. The 4 MB on-chip flash holds ML model weights and gateway firmware without external QSPI. The hardware AES/SHA/TRNG accelerates TLS handshakes, and the 1 MB SRAM provides ample buffer for protocol stacks. Compared to Raspberry Pi-class gateways, the MIMXRT1064 reduces idle power by 5-10x. Source: NXP datasheet IMXRT1064CEC.
推薦
Point-of-Sale Terminal
The MIMXRT1064DVL6A is ideal for point-of-sale (POS) terminals because its 600 MHz Cortex-M7, 4 MB flash, and LCDIF controller drive customer-facing TFT displays while running payment applications in real time. The dual USB OTG with on-chip PHY supports USB peripherals (NFC readers, barcode scanners, printers) without external USB hubs. The hardware AES/SHA accelerators secure payment transactions, and 1 MB SRAM keeps transaction buffers in-chip. The 196-LFBGA package fits compact POS form factors. Source: NXP application note AN12965.
推薦
Motor Control and Home Appliances
The MIMXRT1064DVL6A serves home-appliance motor controllers (washing machines, dishwashers, refrigerators) because its 600 MHz Cortex-M7 with FPU runs FOC algorithms for BLDC and PMSM motors, while the dual CAN-FD interface connects to appliance bus networks. The 4 MB flash stores motor firmware plus UI assets, and the PWM timers with complementary outputs drive 3-phase inverters directly. Compared to dedicated motor-control MCUs, the MIMXRT1064 adds HMI capability on a single chip, reducing BOM cost. Source: NXP i.MX RT1064 datasheet.
推薦
Low-Cost Consumer Audio/Video Device
The MIMXRT1064DVL6A targets cost-sensitive consumer AV products (set-top boxes, digital signage controllers, low-cost media players) because its 4 MB on-chip flash eliminates an external QSPI chip, saving ~$0.50 BOM cost and PCB area. The dual CSI camera inputs and LCDIF controller enable display-with-camera products at sub-$10 BOM. The hardware video decoding is absent, but the 600 MHz Cortex-M7 handles MJPEG and basic H.264 software decoding. The 196-LFBGA 10x10 mm package fits compact plastic enclosures. Source: NXP datasheet IMXRT1064CEC.
推薦
推薦產品摘要
工程參考資料，適用於 MIMXRT1064DVL6A — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MIMXRT1064DVL6B | MIMXRT1064CVL5A | MIMXRT106LDVL6A | MIMXRT1062CVJ5A |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LFBGA (10x10 mm) | 196-LFBGA (10x10 mm) - same | 196-LFBGA (10x10 mm) - same | 196-LFBGA (10x10 mm) - same | 196-LFBGA (10x10 mm) - same |
| CPU Core | Arm Cortex-M7 @ 600 MHz | Arm Cortex-M7 @ 600 MHz | Arm Cortex-M7 @ 528 MHz | Arm Cortex-M7 @ 600 MHz | Arm Cortex-M7 @ 600 MHz |
| On-Chip Flash | 4 MB | 4 MB | 4 MB | 4 MB | 2 MB |
| On-Chip SRAM | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| Operating Temperature | 0C to +95C (consumer) | -40C to +105C (industrial) | 0C to +95C (consumer) | 0C to +95C (consumer) | 0C to +95C (consumer) |
| Lifecycle Status | NRND | Active | Active | Active | Active |
| AEC-Q100 | Not qualified | Not qualified (industrial grade only) | Not qualified | Not qualified | Not qualified |
主要差異化特點
- Only i.MX RT1064 variant with consumer-grade temperature range (對比MIMXRT1064DVL6B)
- Highest flash density in the i.MX RT106x family (對比MIMXRT1062CVJ5A)
- Drop-in speed grade with lower CPU clock at lower cost (對比MIMXRT1064CVL5A)
設計說明
The 196-LFBGA 10x10 mm package uses a 0.65 mm ball pitch and requires microvia PCB fabrication (laser-drilled vias, sequential lamination). Conventional 4-layer 1 oz copper FR-4 boards may not provide reliable assembly yield for this pitch - use a 6-layer or 8-layer stackup with HDI microvia technology. Source: NXP Hardware Development Guide IMXRT1064HDUG.
The MIMXRT1064DVL6A requires multiple supply rails (3.3 V I/O, 1.15 V core, 1.35 V LDO/soc) with strict sequencing. Use the PF1550 or PCA9420 PMIC to ensure proper power-up sequencing per the datasheet. Decoupling must include 100 nF X7R capacitors within 2 mm of every VDD pin and bulk 4.7 uF-22 uF capacitors on each rail. Insufficient decoupling will cause intermittent crashes under DMA load. Source: NXP AN12965 power design guide.
Do not connect USB VBUS directly to the MIMXRT1064DVL6A - the on-chip USB PHY requires VBUS sensing through a dedicated voltage divider to the USB_OTG1_VBUS pin, with a 100 nF bypass capacitor. Incorrect VBUS connection can permanently damage the USB PHY. Additionally, boot-mode pins (BOOT_MODE0/1) must be pulled correctly or the MCU will not start from the desired boot source. Source: NXP datasheet IMXRT1064CEC chapter on boot configuration.
Estimated: at 600 MHz full load with all peripherals enabled, the MIMXRT1064DVL6A dissipates approximately 0.8-1.2 W. With the 196-LFBGA package theta_JA of approximately 25 C/W (4-layer JEDEC test board), junction temperature rise is 20-30 C above ambient. For consumer-grade 95C ambient designs this leaves 30-40 C margin; derate CPU frequency if additional peripherals are enabled. A small thermal pad under the package center balls improves dissipation.
DDR memory traces must be length-matched within 25 mil (0.6 mm) and routed on a single inner layer with a continuous ground plane beneath. Avoid vias on DDR signals when possible. The LCD parallel interface traces should be length-matched to within 50 mil for WXGA resolution above 60 Hz. SD card signals must have 50 ohm controlled impedance with series ferrite beads for EMI suppression. Source: NXP Hardware Development Guide.
合規資訊
RoHS compliant per NXP product page. Consumer-grade temperature range (0C to +95C); not AEC-Q100 qualified. For automotive designs, select the -A suffix variant.
