MPC8572EPXAVND - PowerPC e500 1.5GHz Dual-Core MPU | NXP
MPN： MPC8572EPXAVND ✗ 停產MPC8572EPXAVND 概覽
A microprocessor (MPU) is a single-chip CPU central processing unit integrating control unit, ALU, registers, and often caches and peripherals on one die. The PowerQUICC III family sits in NXP's communications-processor hierarchy: PowerPC e500 core -> MPC85xx architecture -> PowerQUICC family -> communications processors -> embedded MPUs. The e500 core is a 32-bit Book-E implementation tuned for low-latency deterministic control and networking workloads rather than general-purpose compute.
Key features include dual 32-bit PowerPC e500 cores, integrated SPE (Signal Processing Engine) and SEC (Security Engine) co-processors, three Enhanced Three-Speed Ethernet (eTSEC) controllers supporting 10/100/1000 Mbps, a DDR2/DDR3 SDRAM memory controller, four PCI Express interfaces, two serial RapidIO interfaces, a DUART, and flexible I/O multiplexing. The 1023-FCBGA package exposes the full pin complement required for these high-bandwidth peripherals.
The architecture uses a coherent SMP fabric between the two e500 cores, allowing symmetric multi-processing for control-plane tasks. The SEC engine accelerates DES, 3DES, AES, SHA-1/2, and Kasumi, while the SPE offloads DSP-style operations on packet payloads. The DDR2/DDR3 controller with ECC supports registered DIMMs at speeds up to 800 MHz data rate, giving the platform enough memory bandwidth for stateful firewall and routing tables.
Typical applications include enterprise routers, multi-service switches, line cards, IP-PBX systems, and secure VPN gateways. The dual cores plus security accelerators make it well suited to combined control-plane + data-plane + encryption workloads on a single SoC.
When designing in the MPC8572EPXAVND, allocate adequate PCB layers (typically 8+ with dedicated power planes) for the 1.5 GHz core and DDR memory. Place decoupling capacitors within 5 mm of every power pin and route the DDR differential clocks with controlled impedance. Verify thermal design against the worst-case industrial junction temperature.
This page consolidates distributor pricing, same-family drop-in variants, and engineering design notes beyond the manufacturer marketing summary to accelerate your evaluation.
直接替換替代品，適用於 MPC8572EPXAVND — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8572EPXAVND （相同外形與佔位） — 差異在於 Operating Temperature, Manufacturer, Memory Controller, Mounting Type, Core Processor.
MPC8572ECPXAVND
✅ 直接替換聯絡詢價
查看資料表 →MPC8572EVTAVND
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8572ELVTAVND
✅ 直接替換聯絡詢價
查看資料表 →MPC8572EPXARLC
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8572EPXATLD
✅ 直接替換聯絡詢價
查看資料表 →MPC8572EPXAVND 最大額定值與電氣特性
| Core Processor | PowerPC e500 |
| Number of Cores | 2 |
| 資料匯流排寬度 | 32-bit |
| Maximum Core Frequency | 1.5 GHz |
| Co-Processors / DSP | SPE (Signal Processing Engine), SEC (Security Engine) |
| Series | MPC85xx (PowerQUICC III) |
| RAM Controllers | DDR2, DDR3 (with ECC) |
| Ethernet Controllers | 3 x eTSEC (10/100/1000 Mbps) |
| PCI Express | 4 lanes / 2 controllers |
| Serial RapidIO | 2 interfaces |
| UART | DUART (2 channels) |
| Graphics Acceleration | No |
| 工作電源電壓 | 1.1 V (core), 1.8 V / 2.5 V / 3.3 V (I/O) |
| 封裝 | 1023-ball FCBGA (33 x 33 mm) |
| 安裝類型 | Surface Mount (BGA) |
| 工作溫度 | -40C to +105C (industrial grade) |
MPC8572EPXAVND 1023-ball fcbga (33 x 33 mm) 腳位配置指南
MPC8572EPXAVND（1023-ball fcbga (33 x 33 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8572EPXAVND.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8572EPXAVND 適用於 6 應用s: Enterprise Edge Router, Multi-Service Switching Line Card, IP-PBX and Unified Communications Gateway, Industrial Firewall and VPN Appliance, Wireless Backhaul Aggregation Platform, Secure Storage Controller and NAS Appliance.
Enterprise Edge Router
The MPC8572EPXAVND fits enterprise edge routers because its dual 1.5 GHz PowerPC e500 cores deliver deterministic routing throughput while the three eTSEC controllers aggregate multiple Gigabit uplinks. The integrated SEC engine accelerates IPSec and SSL/TLS for site-to-site VPN termination at line rate without burdening the cores. The DDR2/DDR3 controller with ECC maintains stateful firewall and routing tables reliably at the upper industrial temperature ceiling. NXP reference designs recommend pairing it with a SerDes-based Gigabit PHY and an external TCAM for OSPF/BGP adjacency handling.
推薦
Multi-Service Switching Line Card
In multi-service switching line cards, the MPC8572EPXAVND acts as the control-plane processor with 4 PCI Express lanes providing chip-to-chip interconnect to a switch fabric ASIC. The 2 Serial RapidIO interfaces offer an alternative deterministic backplane for telecom deployments where latency must be tightly bounded. The 1 MB shared L2 cache keeps control-plane memory transactions local, reducing DDR bandwidth pressure. Designers pair it with a fabric companion such as NXP's P2020 or a third-party TDM mapper to aggregate T1/E1 and Ethernet traffic on a single line card.
推薦
IP-PBX and Unified Communications Gateway
The MPC8572EPXAVND fits IP-PBX and unified communications gateways because the dual e500 cores handle call-control signaling and RTP media paths in parallel, while the SPE offloads voice/video codecs from the cores. The SEC engine secures SIP/TLS and SRTP media streams without CPU intervention, preserving call capacity. With three Gigabit Ethernet controllers the gateway can segment management, voice VLAN, and WAN uplink traffic physically. A reference IP-PBX design typically pairs it with a TDM circuit emulation IC for legacy PSTN connectivity and a DSP farm for transcoding.
推薦
Industrial Firewall and VPN Appliance
The MPC8572EPXAVND powers industrial firewall and VPN appliances where the SEC engine's AES-256/SHA-256 throughput sustains multi-gigabit IPSec tunnels for SCADA backhaul. The industrial -40C to +105C temperature grade permits deployment in factory floor enclosures without active cooling. DDR2/DDR3 with ECC guards configuration memory against soft errors in electrically noisy industrial environments. Application notes from NXP document pairing the part with hardware random-number generators and secure-boot supervisors for FIPS-compliant deployments.
推薦
Wireless Backhaul Aggregation Platform
Wireless backhaul aggregation platforms leverage the MPC8572EPXAVND to terminate multiple T1/E1 and Ethernet pseudowires while the Serial RapidIO ports provide deterministic low-latency links to baseband modems. The dual cores separate management-plane OAM from data-plane pseudowire forwarding for predictable jitter. The 1.5 GHz clock budget provides headroom for shaping, policing, and QoS queues per pseudowire. Reference designs combine the processor with a Timing-over-Packet/SyncEtagger IC and an external SATA controller for logging.
推薦
Secure Storage Controller and NAS Appliance
The MPC8572EPXAVND is suitable for secure storage controllers because the SEC engine accelerates AES-XTS full-disk encryption without throughput loss on RAID rebuild operations. The PCI Express lanes connect to multi-port SAS/SATA controllers for 8+ drive bays, while the eTSEC controllers handle GbE management and data ports. ECC-protected DDR memory ensures metadata consistency during unexpected power-loss events. NXP's reference design pairs it with an external BMC for IPMI and a hardware RNG for cryptographic key generation.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8572EPXAVND — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8572ECPXAVND | MPC8572EVTAVND | MPC8572ELVTAVND | MPC8572EPXARLC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same |
| Core Architecture | Dual PowerPC e500 | Dual PowerPC e500 | Dual PowerPC e500 | Dual PowerPC e500 | Dual PowerPC e500 |
| Maximum Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz (or per suffix) | 1.5 GHz (LV variant) | 1.5 GHz |
| Co-Processors | SPE + SEC | SPE + SEC | SPE + SEC | SPE + SEC | SPE + SEC |
| Temperature Grade | -40C to +105C (industrial) | -40C to +85C (extended) | Per suffix decoder | Per suffix decoder | Per suffix decoder |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet Controllers | 3 x eTSEC (GbE) | 3 x eTSEC (GbE) | 3 x eTSEC (GbE) | 3 x eTSEC (GbE) | 3 x eTSEC (GbE) |
| PCI Express | 4 lanes / 2 controllers | 4 lanes / 2 controllers | 4 lanes / 2 controllers | 4 lanes / 2 controllers | 4 lanes / 2 controllers |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Higher industrial temperature ceiling than the CPXAVND variant (對比MPC8572ECPXAVND)
- Same 1.5 GHz maximum frequency with potentially tighter voltage tuning (對比MPC8572EVTAVND)
- Integrated SEC engine for hardware-accelerated cryptography (對比MPC8572EPXARLC)
- Standalone LV variant offers lower core voltage for power-sensitive designs (對比MPC8572ELVTAVND)
設計說明
The 1023-ball FCBGA package at 1.5 GHz requires a minimum 8-layer PCB stack-up with continuous ground and power planes beneath the BGA. Use micro-via-in-pad technology if escape density demands it, and follow NXP's BGA escape routing recommendations in the hardware specifications document. Route DDR2/DDR3 signals with 50-ohm single-ended impedance and match length within 25 mils across byte lanes to maintain signal integrity at the 800 MHz data rate.
At 1.5 GHz with all peripherals active, the MPC8572EPXAVND dissipates several watts into the FCBGA. For closed industrial enclosures, attach a heat spreader or heatsink to the top of the package and verify junction temperature against the 105C limit using the NXP-supplied thermal model. Forced airflow (typically 1-2 m/s) is recommended for fanless designs to keep junction rise under 40C above ambient.
The MPC8572EPXAVND requires four supply rails (1.1 V core, 1.8 V DDR, 2.5 V, 3.3 V I/O) with strict sequencing and ramp-rate requirements per the hardware specifications document. Place bulk decoupling within 10 mm of the BGA and 0.1 uF ceramic capacitors within 5 mm of every power pin. Use a multi-rail PMIC with programmable soft-start to enforce the correct power-up sequence and prevent latch-up during brownout events.
The eTSEC, Serial RapidIO, and PCI Express interfaces are high-speed SerDes links requiring controlled-impedance routing and tight length matching. Use the NXP IBIS-AMI models for simulation and follow the reference design's via pattern to maintain 85-100 ohm differential impedance. Add AC-coupling capacitors on each SerDes lane near the transmitter as required by the protocol, and verify eye diagrams at the receiver with compliance patterns.
Do not assume all MPC8572E suffix variants share identical voltage and temperature ratings - decode the suffix against the NXP part-number guide before substituting on existing boards. Verify the DDR memory topology matches the configured data rate (800 MT/s) in U-Boot or your RCW (Reset Configuration Word). When migrating from prototype to production, validate the JTAG boundary-scan BSDL against your final assembly to catch shorts and opens.
合規資訊
Compliance status not present in the verified distributor data; RoHS, REACH, lead-free, and halogen-free fields are marked unknown per Data Authenticity Rule 1. AEC-Q100 is not applicable because this is a communications MPU rather than an automotive-grade IC. Designers should request the NXP material declaration directly for the exact compliance certificate.
