MPC875CZT133 - PowerQUICC 32-Bit MPU, 133MHz, 256-BGA | NXP
MPN： MPC875CZT133 ⚠ 最後購買機會MPC875CZT133 概覽
A PowerQUICC processor is a family of integrated communications processors that combine a Power Architecture CPU core with system peripherals and communication engines on a single die. In the broader taxonomy, the MPC875 sits within the Microprocessor Unit (MPU) category, itself a subset of microcontrollers and processing ICs used for embedded control and networking. PowerQUICC architecture is widely used in networking equipment where on-chip Ethernet, ATM, and serial controllers replace external PHY and glue logic, reducing BOM cost and PCB area.
Key features of the MPC875CZT133 include a 32-bit PowerPC core running at 133 MHz, an integrated communications processor module (CPM) for protocol acceleration, dual 10/100 Ethernet MACs, peripheral interfaces including UART, SPI, I2C, and a memory controller supporting SDRAM and Flash. The device is manufactured in a 0.18 micron CMOS process and supports an industrial operating temperature range from -40C to +100C, enabling deployment in thermally constrained networking line cards.
Typical application areas include telecom line cards, Ethernet switches and routers, industrial control gateways, and embedded serial backplane designs where deterministic comms offload is more valuable than raw CPU frequency. The integrated CPM handles HDLC, ATM, and Ethernet bridging independently of the CPU, freeing the core for application and management tasks.
When designing with this part, ensure proper power decoupling and signal integrity on the BGA substrate, and plan for thermal dissipation in enclosed enclosures. NXP recommends JTAG boundary scan and a buffered reset supervisor for production-grade boards.
This page synthesizes distributor pricing, drop-in alternatives from the same PowerQUICC family, lifecycle notes (EOL announced by NXP), and practical design considerations not found in the manufacturer datasheet alone.
直接替換替代品，適用於 MPC875CZT133 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC875CZT133 （相同外形與佔位） — 差異在於 Package, Manufacturer, Operating Temperature, Core Architecture, Core Frequency.
MPC875CZT166
✅ 直接替換📋 參考替代品（不在目錄中）
MPC875CVR133
✅ 直接替換聯絡詢價
查看資料表 →MPC870CZT133
✅ 直接替換聯絡詢價
查看資料表 →MPC852TCVR50A
✅ 直接替換聯絡詢價
查看資料表 →MPC852TVR100A
✅ 直接替換聯絡詢價
查看資料表 →MPC875CZT133 最大額定值與電氣特性
| Core Architecture | Power Architecture (PowerPC) 32-bit |
| Core Frequency | 133 MHz |
| Family | MPC8xx PowerQUICC |
| Processor Type | MPC8xx Communications Processor |
| 供應電壓 | 3.3 V |
| 工作溫度 | -40 C to +100 C |
| 封裝 | 256-Pin BGA (23x23 mm) |
| Process Technology | 0.18 micron CMOS |
| 安裝類型 | Surface Mount |
| Terminal Form | Ball |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS 狀態 | RoHS non-compliant (contains lead) |
| Ethernet MACs | Dual 10/100 (per datasheet) |
| System Core | Power Architecture technology |
MPC875CZT133 256-pin bga (23x23 mm) 腳位配置指南
MPC875CZT133（256-pin bga (23x23 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC875CZT133.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC875CZT133 適用於 6 應用s: Telecom Line Cards, Industrial Ethernet Gateways, Routers and Access Concentrators, Embedded Communication Controllers, Printer and Imaging Controllers, Avionics and Defense Subsystems.
Telecom Line Cards
The MPC875CZT133 fits telecom line card designs that require deterministic multi-channel serial connectivity. Its integrated CPM offloads HDLC and PPP framing at wire speed, freeing the 133 MHz PowerPC core for service-layer processing and OAM tasks. The dual 10/100 Ethernet MACs support direct connection to PHY transceivers for backhaul or aggregation ports. The 256-BGA's 23x23 mm footprint is well-suited to standard line card form factors (AdvancedTCA, compactPCI), where board real estate is at a premium. Power consumption is bounded by the 3.3V single-rail design, simplifying PSU design and reducing BOM cost. Compared with general-purpose MPU alternatives, the MPC875CZT133's hardware protocol acceleration eliminates the need for an external framer or TCAM, reducing overall system cost and latency. The -40C to +100C industrial range covers carrier-grade indoor environments comfortably.
推薦
Industrial Ethernet Gateways
The MPC875CZT133 suits industrial Ethernet gateway designs that bridge fieldbus networks to enterprise IT infrastructure. Its serial peripherals (UART, SPI, I2C) connect directly to industrial sensors and motor controllers, while the dual Ethernet MACs provide redundant LAN connectivity for ring or daisy-chain topologies. The Power Architecture core executes Modbus TCP, EtherNet/IP, or PROFINET stacks deterministically at 133 MHz, and the CPM handles the lower-layer MAC bridging without consuming CPU cycles. Operating temperature of -40C to +100C covers factory floor cabinets near motors and process equipment. The leaded PBGA package issue can be worked around with conformal coating for harsh industrial environments. Engineers migrating to newer designs should evaluate PowerQUICC II successors for better toolchain support and RoHS compliance.
推薦
Routers and Access Concentrators
The MPC875CZT133 targets small-to-medium enterprise router and access concentrator platforms that benefit from integrated Ethernet and serial connectivity. The integrated CPM handles packet classification, forwarding, and shaping at line rate, allowing the 133 MHz core to focus on routing protocol processing (OSPF, BGP, RIP), firewalling, and management plane software. The 256-BGA package supports the high pin count needed for multiple external PHY interfaces and SDRAM expansion typical of branch-office routers. Power dissipation is moderate at the 133 MHz / 3.3V operating point and is manageable with passive copper cooling on standard router enclosures. Drop-in migration to the MPC875CZT166 (166 MHz) is supported for higher-throughput SKUs within the same PCB layout.
推薦
Embedded Communication Controllers
The MPC875CZT133 is well matched to embedded communications controllers used in SCADA systems, building automation, and remote telemetry units (RTUs). Its CPM offloads protocol framing (DNP3, IEC 60870-5, Modbus), enabling deterministic response times that are critical for utility and transportation automation. The dual Ethernet MACs support redundant IP links, while serial interfaces connect to legacy field devices. Operating from a single 3.3V rail simplifies power tree design for solar-powered or battery-backed remote deployments. The Power Architecture toolchain (gcc PowerPC, CodeWarrior, Green Hills) is mature and well-documented, easing long-term software maintenance. For new designs NXP recommends migration to PowerQUICC II/III but the MPC875CZT133 remains a cost-effective option for maintenance and refurbishment programs.
推薦
Printer and Imaging Controllers
The MPC875CZT133 historically served high-end networked printer and multifunction device controllers where deterministic I/O and integrated Ethernet were valued. The dual Ethernet MACs enable printer sharing across departments, while parallel and serial interfaces connect to scanner, finisher, and engine subsystems. The CPM handles pre-processing of PDL (page description language) data and rasterization offload, freeing the 133 MHz PowerPC core for higher-level job control and user interface logic. Operating temperature of -40C to +100C covers typical office equipment thermal envelopes. Drop-in upgrade to MPC875CZT166 is supported for higher-page-per-minute SKUs without PCB rework.
推薦
Avionics and Defense Subsystems
The MPC875CZT133's extended temperature range and Power Architecture core make it suitable for avionics databus and defense subsystem controllers. The integrated serial controllers map directly to MIL-STD-1553 and ARINC 429 interfaces via external transceivers, and the CPM handles deterministic databus traffic. The 133 MHz core runs real-time OS kernels (VxWorks, LynxOS, INTEGRITY) commonly used in defense applications. The 256-BGA package has a track record in aerospace board designs. Note that defense applications often require long-term availability commitments that the EOL status of the MPC875CZT133 does not support; new defense designs should consult NXP's last-time-buy and obsolescence management program.
推薦
推薦產品摘要
工程參考資料，適用於 MPC875CZT133 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC875CZT166 | MPC875CVR133 | MPC870CZT133 | MPC852TCVR50A | MPC852TVR100A |
|---|---|---|---|---|---|---|
| Package | 256-Pin BGA (23x23 mm) | 256-Pin BGA (23x23 mm) - same | 256-Pin BGA (VR suffix) - same | 256-Pin BGA (23x23 mm) - same | 256-Pin BGA - same family | 256-Pin BGA - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 133 MHz | 166 MHz (+25%) | 133 MHz (same) | 133 MHz (same) | 50 MHz (-62%) | 100 MHz (-25%) |
| Architecture | Power Architecture (PowerPC) 32-bit | Power Architecture | Power Architecture | Power Architecture | Power Architecture | Power Architecture |
| Family | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 1.7 V / 3.3 V (mixed) | 1.7 V / 3.3 V (mixed) |
| Lifecycle Status | Last Time Buy (EOL) | Last Time Buy | Last Time Buy | Last Time Buy | Obsolete | Obsolete |
| RoHS Status | Contains Lead (non-compliant) | Contains Lead (non-compliant) | Contains Lead (non-compliant) | Contains Lead (non-compliant) | Contains Lead (non-compliant) | Contains Lead (non-compliant) |
主要差異化特點
- Higher CPM integration level compared to MPC852 (對比MPC852TCVR50A)
- Pin-compatible higher-frequency upgrade within same family (對比MPC875CZT166)
- Same-package lower-cost option for cost-sensitive designs (對比MPC870CZT133)
設計說明
Estimated: at 3.3V supply and 133 MHz operation the MPC875CZT133 dissipates approximately 0.8-1.2W; the 256-BGA package requires attention to PCB thermal relief. Use a minimum 4-layer PCB with continuous ground and power planes directly beneath the BGA, plus thermal vias under the center balls. For enclosed industrial enclosures without airflow, derate clock speed or add a small heatsink to maintain junction temperature below 100C.
The 256-BGA at 1.27mm pitch demands 6/6 mil trace-and-space PCB fabrication rules per NXP application notes. All power pins (3.3V and GND) require local decoupling capacitors of 0.1uF ceramic placed within 2mm of each ball, with bulk 10uF tantalum or ceramic capacitors near the package edge. JTAG pins (TRST, TCK, TMS, TDI, TDO) must be brought out to a header for boundary-scan debug during prototype bring-up.
Do not confuse the MPC875CZT133 (256-BGA ZT suffix) with the MPC875CVR133 - the VR suffix denotes a different package variant (CBGA/PBGA family). Pin 1 orientation differs between the two, and the BOM must specify the correct variant. Also note the part is leaded PBGA and RoHS non-compliant; do not specify this part for new RoHS-bound designs without consulting the environmental compliance team.
The 3.3V supply must be sequenced after the 1.7V internal core voltage regulator stabilizes - check the datasheet power-up sequencing diagram before power-on. Use a supervisor IC (e.g., TLV803) to assert reset until the supply rail is stable. Inrush at power-up is approximately 0.5A for the bulk capacitors and BGA core; size upstream regulators with adequate transient headroom.
合規資訊
MPC875CZT133 contains lead and is RoHS non-compliant per distributor datasheet summary. EOL status as of NXP product page. Reach, halogen-free, and conflict-mineral status not specified in publicly available data.
