RTAX2000SL-1LG624V - 2M-Gate Rad-Tolerant FPGA | Microchip
MPN： RTAX2000SL-1LG624V ✓ 啟用中RTAX2000SL-1LG624V 概覽
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the heavy-ion and proton environments of spaceflight, where commercial silicon would suffer destructive latch-up or unacceptable configuration upsets. The RTAX-S/SL family sits within the broader hierarchy: FPGA -> programmable logic IC -> space-grade semiconductor, and serves as the flight-compute backbone for satellites, rovers, and planetary probes.
Key features of this device include the SL (super low-power) process variant, live-at-power-up operation enabled by its non-volatile anti-fuse programmable fabric, and a true single-chip form factor that eliminates external configuration storage - a critical reliability advantage in orbit where configuration memories are vulnerable to single-event upsets. Low static power consumption preserves the tight spacecraft power budget.
Architecturally, the RTAX-S/SL fabric combines configurable logic modules, embedded SRAM blocks, and hard-wired FIFOs, with ample parallel and serial I/O for payload interfaces. The die also supports roughly 250,000 ASIC gates of additional capability per the SL density roadmap. Programming is one-time (anti-fuse), so design freeze and qualification flow mirror an ASIC while retaining FPGA development schedules.
Typical applications include satellite payload data processing, telemetry and telecommand controllers, sensor-interface engines for scientific instruments, and bus avionics for LEO, GEO, and deep-space missions.
Design consideration: because the fabric is one-time programmable, perform full timing simulation and radiation-lot qualification before commit; plan for the ceramic column-grid-array solder assembly early.
This page synthesizes distributor data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 RTAX2000SL-1LG624V — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： RTAX2000SL-1LG624V （相同外形與佔位） — 差異在於 Package, Configuration, Equivalent System Gates, Embedded Memory, Family.
RTAX2000SL-CGS624E
✅ 直接替換聯絡詢價
查看資料表 →RTAX250SL-CG624B
✅ 直接替換聯絡詢價
查看資料表 →RTAX250SL-LG624B
✅ 直接替換聯絡詢價
查看資料表 →RTAX250S-1LG624B
✅ 直接替換聯絡詢價
查看資料表 →RTAX2000SL-1LG624E
✅ 直接替換📋 參考替代品（不在目錄中）
RTAX2000SL-1LG624V 最大額定值與電氣特性
| Logic Cells | 32256 |
| CLBs (Configurable Logic Blocks) | 21504 |
| Equivalent Gates | 2000000 (approx.) |
| Family | RTAX-S/SL (radiation-tolerant FPGA) |
| Process Variant | SL (super low-power) CMOS |
| Core Supply Voltage | 1.5 V (nominal) |
| 工作溫度 | -55C to +125C |
| 封裝 | 624-terminal ceramic CGA (CG624) |
| 安裝類型 | Surface Mount (column grid array) |
| Programming Technology | Anti-fuse, one-time programmable |
| Configuration | Live at power-up, single-chip (no external config storage) |
| Radiation Tolerance | Radiation-tolerant for space flight systems |
| Speed Grade | -1 |
| Application Class | Space flight / aerospace |
RTAX2000SL-1LG624V 624-terminal ceramic cga (cg624) 腳位配置指南
RTAX2000SL-1LG624V（624-terminal ceramic cga (cg624) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： RTAX2000SL-1LG624V.
請參閱 資料表 以查看完整腳位配置。
典型應用
RTAX2000SL-1LG624V 適用於 6 應用s: Satellite Payload Data Processing, Telemetry, Tracking & Command (TT&C) Controllers, Scientific Instrument Interfaces, Spacecraft Bus Avionics, On-Board Data Handling & Memory Control, Design Prototyping & Development Flow.
Satellite Payload Data Processing
The RTAX2000SL-1LG624V is widely used as the payload processing engine on LEO and GEO satellites, where its ~2,000,000 gates and 32,256 logic cells absorb high-throughput framing, compression, and channel-coding functions. Its anti-fuse fabric is live at power-up with no external configuration memory, eliminating a single-event-upset failure point that SRAM FPGAs cannot avoid. The SL super-low-power process reduces static current for power-constrained spacecraft, while the -55C to +125C operating range covers launch transients and eclipse cycling. Implemented in the 624-terminal ceramic CGA with 1.5V nominal core supply, it interfaces directly with payload buses and downlink modulators; designers trade reprogrammability for flight reliability when committing the one-time-programmable design.
推薦
Telemetry, Tracking & Command (TT&C) Controllers
Telecommand decoders and telemetry encoders on spacecraft benefit from the RTAX2000SL-1LG624V's deterministic, live-at-power-up behavior: the command chain is functional the instant rails settle, with no configuration load delay and no configuration-store SEU exposure. The 624-pin CG624 ceramic package provides abundant user I/O for redundant UART/CAN-class interfaces, discrete commands, and relay controls, while the -55C to +125C rating matches TT&C units mounted near the spacecraft structure. With a nominal 1.5V core and the SL process variant, quiescent consumption stays compatible with always-on command links during safe-mode. Anti-fuse programming also supports clean hold-state analysis for failure-tolerance reviews required by flight qualification.
推薦
Scientific Instrument Interfaces
Imagers, spectrometers, and particle detectors on planetary probes require glueless, deterministic interfaces between sensor front-ends and onboard processing - a role the RTAX2000SL-1LG624V fills with 21,504 CLBs of configurable sequencing, timestamping, and FIFO buffering. Its radiation-tolerant CMOS fabric tolerates deep-space radiation environments that would corrupt commercial FPGAs, and the 624-terminal CGA supplies the dense, low-skew I/O needed for multi-channel CCD/CMOS readout. Because the device is single-chip and needs no boot memory, cold-start at instrument power-up is immediate - important for time-critical encounter sequences. Engineers should budget the one-time programmability by fully verifying the frozen design in simulation before flight-lot commit.
推薦
Spacecraft Bus Avionics
Attitude-control, power-management, and housekeeping avionics leverage the RTAX2000SL-1LG624V as a rugged, single-chip logic hub integrating MIL-STD-grade buses, redundant sensors, and watchdog logic. The ceramic column-grid-array package withstands the mechanical environments of launch vehicles better than plastic-packaged alternatives, and the -55C to +125C range removes derating concerns at board hotspots. Live-at-power-up operation means safety-critical interlocks are enforced from the first millisecond, and the anti-fuse configuration cannot be flipped in flight. The nominal 1.5V core keeps dynamic and static power within typical bus-avionics allocations, while the 2,000,000-gate capacity allows consolidation of several small ASIC replacements into one flight device.
推薦
On-Board Data Handling & Memory Control
Solid-state mass-memory controllers and onboard data-handling units use the RTAX2000SL-1LG624V to implement ECC engines, wear-leveling state machines, and downlink packetization across many memory channels. The 32,256 logic cells provide headroom for triple-module redundancy of control paths, while hardened embedded blocks handle FIFO buffering between memory arrays and telemetry. Radiation tolerance at the fabric level plus the absence of configuration upsets yields the deterministic error budgets such controllers require. The 624-ball CGA offers the parallel pin count to address wide memory banks directly, and the 1.5V SL process limits power during continuous scrubbing workloads, extending battery-limited mission durations.
推薦
Design Prototyping & Development Flow
Because RTAX anti-fuse devices are one-time programmable, flight teams prototype on flash-based ProASIC3 silicon (A3PE3000 family) and Aldec RTAX prototyping adaptors, then port the frozen HDL to the RTAX2000SL-1LG624V for flight units. This flow preserves full reprogrammability during RTL bring-up, timing closure, and corner-lot testing while guaranteeing that flight silicon carries the identical, verified netlist. Matching I/O planning between the prototyping device and the CG624 flight package early in layout avoids pin-fencing rework. The A3PE3000 parts are low-cost and widely stocked, making them the standard development companion for every RTAX-S/SL program.
推薦
推薦產品摘要
工程參考資料，適用於 RTAX2000SL-1LG624V — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | RTAX2000SL-CGS624E | RTAX2000SL-1LG624E | RTAX250SL-CG624B | RTAX250SL-LG624B | RTAX250S-1LG624B |
|---|---|---|---|---|---|---|
| Package | 624-terminal ceramic CGA (CG624) | 624-terminal ceramic CGA (CG624) - same | 624-terminal ceramic CGA (CG624) - same | 624-terminal ceramic CGA (CG624) - same | 624-terminal ceramic CGA (CG624) - same | 624-terminal ceramic CGA (CG624) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Supply Voltage | 1.5 V (nominal) | 1.5 V (nominal) | 1.5 V (nominal) | 1.5 V (nominal) | 1.5 V (nominal) | 1.5 V (nominal) |
| Process Variant | SL (super low-power) | SL | SL | SL | SL | S (standard power) |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Radiation Tolerance | Yes (RTAX-S/SL space flight class) | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- Highest RTAX density in the shared CG624 footprint (對比RTAX250SL-CG624B)
- Super-low-power SL process (對比RTAX250S-1LG624B)
- Single-chip, live-at-power-up anti-fuse configuration (對比A3PE3000-1FGG896I (flash ProASIC3))
設計說明
The RTAX-S/SL fabric is one-time programmable (anti-fuse). Once a device is programmed, a functional bug means scrapping the unit - at flight-grade pricing. Complete gate-level timing simulation, static timing analysis across all corners, and a formal design review before committing any flight unit. Always program a designated engineering-lot device first and validate it on the ATE or flight-spare board before touching flight-lot devices.
Plan the power tree around the 1.5V nominal core supply and the SL process variant's low static current. Budget I/O power separately: VCCI banks may run at different rail voltages, and total dynamic power depends on toggle rates in your HDL. Use Microchip's Libero power estimator with your post-place-and-route netlist, not the family-level spreadsheet alone, since payload processing designs often toggle far more than bus-avionics designs on the same die.
The 624-terminal ceramic CGA requires careful PCB design: define land pattern per the datasheet package drawing, allow for column-grid-array inspection (X-ray) under the package, and provide generous thermal/mechanical relief on outer rows to absorb CTE mismatch between ceramic and organic PCB across -55C to +125C cycling. Verify reflow or solder assembly processes (commonly vapor-phase or controlled convection for CGAs) with your assembler early; CGA rework is difficult and can scrap flight boards.
With up to 624 I/O terminals, ground return paths and bank-level decoupling dominate signal integrity. Assign high-speed interfaces near their dedicated VCCI/GND ball pairs, respect the I/O bank voltage fencing constraints reported by Libero, and perform pin-fencing compliance checks whenever porting a design between RTAX densities in the same CG624 footprint (e.g., RTAX250SL to RTAX2000SL), since I/O ring assignments differ between dies.
合規資訊
Hermetic ceramic-package space-grade device; compliance statements must be requested per lot from Microchip. Not an AEC-Q100 automotive part - qualified per space/military flows (e.g., QML-class flows referenced in Microchip DLA documentation).
