RTAX2000SL-1LG624V - 2M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX2000SL-1LG624V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12000 | $12,000.00 |
| 10 | $11400 | $114,000.00 |
| 100 | $10800 | $1,080,000.00 |
| 500 | $10200 | $5,100,000.00 |
| 1,000 | $9600 | $9,600,000.00 |
Drop-in alternatives for RTAX2000SL-1LG624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
RTAX2000SL-CGS624E
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Contact for price
View Datasheet →RTAX250SL-CG624B
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$3950 / Unit
View Datasheet →RTAX250SL-LG624B
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$2380 / Unit
View Datasheet →RTAX250S-1LG624B
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$2020 / Unit
View Datasheet →RTAX2000SL-1LG624E
✅ Drop-In📋 Reference alternative (not in catalog)
RTAX2000SL-1LG624V Maximum Ratings & Electrical Characteristics
| Logic Cells | 32256 |
| CLBs (Configurable Logic Blocks) | 21504 |
| Equivalent Gates | 2000000 (approx.) |
| Family | RTAX-S/SL (radiation-tolerant FPGA) |
| Process Variant | SL (super low-power) CMOS |
| Core Supply Voltage | 1.5 V (nominal) |
| Operating Temperature | -55C to +125C |
| Package | 624-terminal ceramic CGA (CG624) |
| Mounting Type | Surface Mount (column grid array) |
| Programming Technology | Anti-fuse, one-time programmable |
| Configuration | Live at power-up, single-chip (no external config storage) |
| Radiation Tolerance | Radiation-tolerant for space flight systems |
| Speed Grade | -1 |
| Application Class | Space flight / aerospace |
RTAX2000SL-1LG624V 624-terminal ceramic cga (cg624) Pin Configuration Guide
Complete pinout information for RTAX2000SL-1LG624V (624-terminal ceramic cga (cg624) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000SL-1LG624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000SL-1LG624V is suitable for 6 applications: Satellite Payload Data Processing, Telemetry, Tracking & Command (TT&C) Controllers, Scientific Instrument Interfaces, Spacecraft Bus Avionics, On-Board Data Handling & Memory Control, Design Prototyping & Development Flow.
Satellite Payload Data Processing
The RTAX2000SL-1LG624V is widely used as the payload processing engine on LEO and GEO satellites, where its ~2,000,000 gates and 32,256 logic cells absorb high-throughput framing, compression, and channel-coding functions. Its anti-fuse fabric is live at power-up with no external configuration memory, eliminating a single-event-upset failure point that SRAM FPGAs cannot avoid. The SL super-low-power process reduces static current for power-constrained spacecraft, while the -55C to +125C operating range covers launch transients and eclipse cycling. Implemented in the 624-terminal ceramic CGA with 1.5V nominal core supply, it interfaces directly with payload buses and downlink modulators; designers trade reprogrammability for flight reliability when committing the one-time-programmable design.
Recommended
Telemetry, Tracking & Command (TT&C) Controllers
Telecommand decoders and telemetry encoders on spacecraft benefit from the RTAX2000SL-1LG624V's deterministic, live-at-power-up behavior: the command chain is functional the instant rails settle, with no configuration load delay and no configuration-store SEU exposure. The 624-pin CG624 ceramic package provides abundant user I/O for redundant UART/CAN-class interfaces, discrete commands, and relay controls, while the -55C to +125C rating matches TT&C units mounted near the spacecraft structure. With a nominal 1.5V core and the SL process variant, quiescent consumption stays compatible with always-on command links during safe-mode. Anti-fuse programming also supports clean hold-state analysis for failure-tolerance reviews required by flight qualification.
Recommended
Scientific Instrument Interfaces
Imagers, spectrometers, and particle detectors on planetary probes require glueless, deterministic interfaces between sensor front-ends and onboard processing - a role the RTAX2000SL-1LG624V fills with 21,504 CLBs of configurable sequencing, timestamping, and FIFO buffering. Its radiation-tolerant CMOS fabric tolerates deep-space radiation environments that would corrupt commercial FPGAs, and the 624-terminal CGA supplies the dense, low-skew I/O needed for multi-channel CCD/CMOS readout. Because the device is single-chip and needs no boot memory, cold-start at instrument power-up is immediate - important for time-critical encounter sequences. Engineers should budget the one-time programmability by fully verifying the frozen design in simulation before flight-lot commit.
Recommended
Spacecraft Bus Avionics
Attitude-control, power-management, and housekeeping avionics leverage the RTAX2000SL-1LG624V as a rugged, single-chip logic hub integrating MIL-STD-grade buses, redundant sensors, and watchdog logic. The ceramic column-grid-array package withstands the mechanical environments of launch vehicles better than plastic-packaged alternatives, and the -55C to +125C range removes derating concerns at board hotspots. Live-at-power-up operation means safety-critical interlocks are enforced from the first millisecond, and the anti-fuse configuration cannot be flipped in flight. The nominal 1.5V core keeps dynamic and static power within typical bus-avionics allocations, while the 2,000,000-gate capacity allows consolidation of several small ASIC replacements into one flight device.
Recommended
On-Board Data Handling & Memory Control
Solid-state mass-memory controllers and onboard data-handling units use the RTAX2000SL-1LG624V to implement ECC engines, wear-leveling state machines, and downlink packetization across many memory channels. The 32,256 logic cells provide headroom for triple-module redundancy of control paths, while hardened embedded blocks handle FIFO buffering between memory arrays and telemetry. Radiation tolerance at the fabric level plus the absence of configuration upsets yields the deterministic error budgets such controllers require. The 624-ball CGA offers the parallel pin count to address wide memory banks directly, and the 1.5V SL process limits power during continuous scrubbing workloads, extending battery-limited mission durations.
Recommended
Design Prototyping & Development Flow
Because RTAX anti-fuse devices are one-time programmable, flight teams prototype on flash-based ProASIC3 silicon (A3PE3000 family) and Aldec RTAX prototyping adaptors, then port the frozen HDL to the RTAX2000SL-1LG624V for flight units. This flow preserves full reprogrammability during RTL bring-up, timing closure, and corner-lot testing while guaranteeing that flight silicon carries the identical, verified netlist. Matching I/O planning between the prototyping device and the CG624 flight package early in layout avoids pin-fencing rework. The A3PE3000 parts are low-cost and widely stocked, making them the standard development companion for every RTAX-S/SL program.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000SL-1LG624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000SL-CGS624E | RTAX2000SL-1LG624E | RTAX250SL-CG624B | RTAX250SL-LG624B | RTAX250S-1LG624B |
|---|---|---|---|---|---|---|
| Package | 624-terminal ceramic CGA (CG624) | 624-terminal ceramic CGA (CG624) - same | 624-terminal ceramic CGA (CG624) - same | 624-terminal ceramic CGA (CG624) - same | 624-terminal ceramic CGA (CG624) - same | 624-terminal ceramic CGA (CG624) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Cells | 32256 | 32256 | 32256 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Equivalent Gates | Approx. 2,000,000 | Approx. 2,000,000 | Approx. 2,000,000 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| CLBs | 21504 | 21504 | 21504 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | -1 | [DATA_NEEDED] | -1 | [DATA_NEEDED] | [DATA_NEEDED] | -1 |
| Core Supply Voltage | 1.5 V (nominal) | 1.5 V (nominal) | 1.5 V (nominal) | 1.5 V (nominal) | 1.5 V (nominal) | 1.5 V (nominal) |
| Process Variant | SL (super low-power) | SL | SL | SL | SL | S (standard power) |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Radiation Tolerance | Yes (RTAX-S/SL space flight class) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest RTAX density in the shared CG624 footprint (vs RTAX250SL-CG624B)
- Super-low-power SL process (vs RTAX250S-1LG624B)
- Single-chip, live-at-power-up anti-fuse configuration (vs A3PE3000-1FGG896I (flash ProASIC3))
Design Notes
The RTAX-S/SL fabric is one-time programmable (anti-fuse). Once a device is programmed, a functional bug means scrapping the unit - at flight-grade pricing. Complete gate-level timing simulation, static timing analysis across all corners, and a formal design review before committing any flight unit. Always program a designated engineering-lot device first and validate it on the ATE or flight-spare board before touching flight-lot devices.
Plan the power tree around the 1.5V nominal core supply and the SL process variant's low static current. Budget I/O power separately: VCCI banks may run at different rail voltages, and total dynamic power depends on toggle rates in your HDL. Use Microchip's Libero power estimator with your post-place-and-route netlist, not the family-level spreadsheet alone, since payload processing designs often toggle far more than bus-avionics designs on the same die.
The 624-terminal ceramic CGA requires careful PCB design: define land pattern per the datasheet package drawing, allow for column-grid-array inspection (X-ray) under the package, and provide generous thermal/mechanical relief on outer rows to absorb CTE mismatch between ceramic and organic PCB across -55C to +125C cycling. Verify reflow or solder assembly processes (commonly vapor-phase or controlled convection for CGAs) with your assembler early; CGA rework is difficult and can scrap flight boards.
With up to 624 I/O terminals, ground return paths and bank-level decoupling dominate signal integrity. Assign high-speed interfaces near their dedicated VCCI/GND ball pairs, respect the I/O bank voltage fencing constraints reported by Libero, and perform pin-fencing compliance checks whenever porting a design between RTAX densities in the same CG624 footprint (e.g., RTAX250SL to RTAX2000SL), since I/O ring assignments differ between dies.
Compliance Information
Hermetic ceramic-package space-grade device; compliance statements must be requested per lot from Microchip. Not an AEC-Q100 automotive part - qualified per space/military flows (e.g., QML-class flows referenced in Microchip DLA documentation).
