STM32L4R5ZIT6P - Cortex-M4 MCU 120MHz 2MB Flash | STMicroelectronics
MPN： STM32L4R5ZIT6P ✓ 啟用中STM32L4R5ZIT6P 概覽
An ultra-low-power MCU is a microcontroller specifically architected to minimize energy use across active, sleep, deep-sleep, and shutdown modes, enabling battery-powered and energy-harvesting designs. Within the system hierarchy, the STM32L4+ sits at the high end of ST's ultra-low-power line, above the STM32L0 and STM32L1 families, and below the Cortex-M7 based STM32F7/H7 high-performance lines. The Cortex-M4 core adds DSP extensions and a single-precision FPU, making it suitable for signal-processing tasks that the Cortex-M0+ cannot handle efficiently.
Key features include a 120 MHz Cortex-M4 core with FPU and MPU, 2 MB dual-bank Flash supporting read-while-write, 640 KB SRAM including 16 KB SRAM2 with parity, a 1.8V core supply with internal SMPS step-down converter for ultra-low-power Run mode, and an extensive peripheral set including USB OTG full-speed, three SPIs, three I2C, six USART/UARTs, two SAIs, one CAN, one SDMMC, and a 12-bit ADC with 5 Msps throughput. The Chrom-ART 2D graphics accelerator and OctoSPI Flash interface support modern display and memory expansion requirements.
Typical applications include low-power IoT sensor nodes, wearable health monitors, industrial HMI with TFT displays, smart meters, asset tracking with BLE or LoRa, and battery-powered data loggers. The 144-LQFP package provides generous GPIO (over 100 pins) for complex designs with multiple peripherals.
When designing with this part, evaluate the package size relative to your PCB - the 144-LQFP (20x20 mm) footprint is among the largest in the STM32 family; the smaller 64-LQFP or 48-LQFP variants of the same silicon may suffice if your GPIO budget is smaller. The internal SMPS requires careful PCB layout to minimize EMI.
直接替換替代品，適用於 STM32L4R5ZIT6P — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： STM32L4R5ZIT6P （相同外形與佔位） — 差異在於 Package, ADC, Core, DAC, Maximum Clock Frequency.
STM32L4R5ZIT6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →STM32L4R5ZIY6TR
✅ 直接替換📋 參考替代品（不在目錄中）
STM32L4R9ZIT6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →STM32L4S5ZIT6
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
STM32L4R5VIT6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →STM32U575ZIT6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →STM32L4R5ZIT6P 最大額定值與電氣特性
| Core Processor | ARM Cortex-M4 with FPU and MPU |
| Core Size | 32-Bit Single-Core |
| 最大時脈頻率 | 120 MHz |
| Performance | 150 DMIPS / 273 CoreMark |
| Flash Memory Size | 2 MB (2M x 8) |
| SRAM Size | 640 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| 工作溫度範圍 | -40C to +85C |
| 封裝 | 144-LQFP (20 x 20 mm) |
| 安裝類型 | Surface Mount |
| USB | USB OTG Full-Speed |
| ADC | 12-bit, 5 Msps |
| DAC | 12-bit |
| Graphics Accelerator | Chrom-ART 2D accelerator |
| External Memory Interface | OctoSPI / FSMC / SDMMC |
| MSL 等級 | 3 (168 hours) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
STM32L4R5ZIT6P 腳位配置
| 腳位 1 | PE2 — General-purpose I/O PE2, TRACECLK on some packages |
| 腳位 2 | PE3 — General-purpose I/O PE3, TRACED0 |
| 腳位 3 | PE4 — General-purpose I/O PE4, TRACED1 |
| 腳位 4 | PE5 — General-purpose I/O PE5, TRACED2 |
| 腳位 5 | PE6 — General-purpose I/O PE6, TRACED3 |
| 腳位 6 | VBAT — RTC battery supply input |
| 腳位 7 | PC13 — General-purpose I/O PC13, RTC tamper |
| 腳位 8 | PC14 — General-purpose I/O PC14, OSC32_IN |
| 腳位 9 | PC15 — General-purpose I/O PC15, OSC32_OUT |
| 腳位 10 | VSS — Ground |
| 腳位 11 | VDD — Digital supply voltage |
| 腳位 12 | PH0 — General-purpose I/O PH0, OSC_IN |
| 腳位 13 | PH1 — General-purpose I/O PH1, OSC_OUT |
| 腳位 14 | NRST — Reset input (active low) |
| 腳位 15 | PC0 — General-purpose I/O PC0, ADC1_IN1 |
| 腳位 16 | PC1 — General-purpose I/O PC1, ADC1_IN2 |
| 腳位 17 | PC2 — General-purpose I/O PC2, ADC1_IN3 |
| 腳位 18 | PC3 — General-purpose I/O PC3, ADC1_IN4 |
| 腳位 19 | VSSA — Analog ground |
| 腳位 20 | VDDA — Analog supply voltage |
| 腳位 21 | PA0 — General-purpose I/O PA0, ADC1_IN5, WKUP1 |
| 腳位 22 | PA1 — General-purpose I/O PA1, ADC1_IN6 |
| 腳位 23 | PA2 — General-purpose I/O PA2, ADC1_IN7, USART2_TX |
| 腳位 24 | PA3 — General-purpose I/O PA3, ADC1_IN8, USART2_RX |
| 腳位 25 | VSS — Ground |
| 腳位 26 | VDD — Digital supply voltage |
| 腳位 27 | PA4 — General-purpose I/O PA4, ADC1_IN9, SPI1_NSS |
| 腳位 28 | PA5 — General-purpose I/O PA5, ADC1_IN10, SPI1_SCK |
| 腳位 29 | PA6 — General-purpose I/O PA6, ADC1_IN11, SPI1_MISO |
| 腳位 30 | PA7 — General-purpose I/O PA7, ADC1_IN12, SPI1_MOSI |
| 腳位 31 | PC4 — General-purpose I/O PC4, ADC1_IN13 |
| 腳位 32 | PC5 — General-purpose I/O PC5, ADC1_IN14 |
| 腳位 33 | PB0 — General-purpose I/O PB0, ADC1_IN15 |
| 腳位 34 | PB1 — General-purpose I/O PB1, ADC1_IN16 |
| 腳位 35 | PB2 — General-purpose I/O PB2, BOOT1 |
| 腳位 36 | PE7 — General-purpose I/O PE7 |
| 腳位 37 | PE8 — General-purpose I/O PE8 |
| 腳位 38 | PE9 — General-purpose I/O PE9 |
| 腳位 39 | PE10 — General-purpose I/O PE10 |
| 腳位 40 | PE11 — General-purpose I/O PE11 |
| 腳位 41 | PE12 — General-purpose I/O PE12 |
| 腳位 42 | PE13 — General-purpose I/O PE13 |
| 腳位 43 | PE14 — General-purpose I/O PE14 |
| 腳位 44 | PE15 — General-purpose I/O PE15 |
| 腳位 45 | PB10 — General-purpose I/O PB10, I2C2_SCL |
| 腳位 46 | PB11 — General-purpose I/O PB11, I2C2_SDA |
| 腳位 47 | VSS — Ground |
| 腳位 48 | VDD — Digital supply voltage |
| 腳位 49 | PB12 — General-purpose I/O PB12, SPI2_NSS |
| 腳位 50 | PB13 — General-purpose I/O PB13, SPI2_SCK |
| 腳位 51 | PB14 — General-purpose I/O PB14, SPI2_MISO |
| 腳位 52 | PB15 — General-purpose I/O PB15, SPI2_MOSI |
| 腳位 53 | PD8 — General-purpose I/O PD8, USART3_TX |
| 腳位 54 | PD9 — General-purpose I/O PD9, USART3_RX |
| 腳位 55 | PD10 — General-purpose I/O PD10 |
| 腳位 56 | PD11 — General-purpose I/O PD11 |
| 腳位 57 | PD12 — General-purpose I/O PD12 |
| 腳位 58 | PD13 — General-purpose I/O PD13 |
| 腳位 59 | PD14 — General-purpose I/O PD14 |
| 腳位 60 | PD15 — General-purpose I/O PD15 |
| 腳位 61 | PC6 — General-purpose I/O PC6, USART6_TX, TIM3 |
| 腳位 62 | PC7 — General-purpose I/O PC7, USART6_RX, TIM3 |
| 腳位 63 | PC8 — General-purpose I/O PC8, SDMMC_D0 |
| 腳位 64 | PC9 — General-purpose I/O PC9, SDMMC_D1 |
| 腳位 65 | PA8 — General-purpose I/O PA8, RCC_MCO, TIM1_CH1 |
| 腳位 66 | PA9 — General-purpose I/O PA9, USART1_TX |
| 腳位 67 | PA10 — General-purpose I/O PA10, USART1_RX |
| 腳位 68 | PA11 — General-purpose I/O PA11, USB_DM |
| 腳位 69 | PA12 — General-purpose I/O PA12, USB_DP |
| 腳位 70 | PA13 — General-purpose I/O PA13, JTMS-SWDIO |
| 腳位 71 | VSS — Ground |
| 腳位 72 | VDD — Digital supply voltage |
| 腳位 73 | PA14 — General-purpose I/O PA14, JTCK-SWCLK |
| 腳位 74 | PA15 — General-purpose I/O PA15, JTDI |
| 腳位 75 | PC10 — General-purpose I/O PC10, SDMMC_D2 |
| 腳位 76 | PC11 — General-purpose I/O PC11, SDMMC_D3 |
| 腳位 77 | PC12 — General-purpose I/O PC12, SDMMC_CK |
| 腳位 78 | PD0 — General-purpose I/O PD0, FSMC_D2 |
| 腳位 79 | PD1 — General-purpose I/O PD1, FSMC_D3 |
| 腳位 80 | PD2 — General-purpose I/O PD2, SDMMC_CMD |
| 腳位 81 | PD3 — General-purpose I/O PD3, FSMC_CLK |
| 腳位 82 | PD4 — General-purpose I/O PD4, FSMC_NOE |
| 腳位 83 | PD5 — General-purpose I/O PD5, FSMC_NWE |
| 腳位 84 | PD6 — General-purpose I/O PD6, FSMC_NWAIT |
| 腳位 85 | PD7 — General-purpose I/O PD7, FSMC_NE1 |
| 腳位 86 | PB3 — General-purpose I/O PB3, JTDO-SWO, TIM2_CH2 |
| 腳位 87 | PB4 — General-purpose I/O PB4, NJTRST, TIM3_CH1 |
| 腳位 88 | PB5 — General-purpose I/O PB5, TIM3_CH2 |
| 腳位 89 | PB6 — General-purpose I/O PB6, I2C1_SCL, USART1_TX |
| 腳位 90 | PB7 — General-purpose I/O PB7, I2C1_SDA, USART1_RX |
| 腳位 91 | BOOT0 — Boot mode selection |
| 腳位 92 | PB8 — General-purpose I/O PB8, I2C1_SCL, TIM4 |
| 腳位 93 | PB9 — General-purpose I/O PB9, I2C1_SDA, TIM4 |
| 腳位 94 | PE0 — General-purpose I/O PE0, TIM4 |
| 腳位 95 | PE1 — General-purpose I/O PE1, TIM4 |
| 腳位 96 | VSS — Ground |
| 腳位 97 | VDD — Digital supply voltage |
| 腳位 98 | PF0 — General-purpose I/O PF0, FSMC_A0, I2C1_SDA |
| 腳位 99 | PF1 — General-purpose I/O PF1, FSMC_A1, I2C1_SCL |
| 腳位 100 | PF2 — General-purpose I/O PF2, FSMC_A2 |
| 腳位 101 | PF3 — General-purpose I/O PF3, FSMC_A3 |
| 腳位 102 | PF4 — General-purpose I/O PF4, FSMC_A4 |
| 腳位 103 | PF5 — General-purpose I/O PF5, FSMC_A5 |
| 腳位 104 | VSS — Ground |
| 腳位 105 | VDD — Digital supply voltage |
| 腳位 106 | PF6 — General-purpose I/O PF6, FSMC_NIORD |
| 腳位 107 | PF7 — General-purpose I/O PF7, FSMC_NREG |
| 腳位 108 | PF8 — General-purpose I/O PF8, FSMC_NIOWR |
| 腳位 109 | PF9 — General-purpose I/O PF9, FSMC_CD |
| 腳位 110 | PF10 — General-purpose I/O PF10, FSMC_INTR |
| 腳位 111 | PH2 — General-purpose I/O PH2 |
| 腳位 112 | PH3 — General-purpose I/O PH3 |
| 腳位 113 | PH4 — General-purpose I/O PH4, I2C2_SCL |
| 腳位 114 | PH5 — General-purpose I/O PH5, I2C2_SDA |
| 腳位 115 | PA0_REMAP — Reserved / VREF+ on some masks |
| 腳位 116 | PA1_REMAP — Reserved |
| 腳位 117 | VSS — Ground |
| 腳位 118 | VDD — Digital supply voltage |
| 腳位 119 | PG0 — General-purpose I/O PG0, FSMC_A10 |
| 腳位 120 | PG1 — General-purpose I/O PG1, FSMC_A11 |
| 腳位 121 | PG2 — General-purpose I/O PG2, FSMC_A12 |
| 腳位 122 | PG3 — General-purpose I/O PG3, FSMC_A13 |
| 腳位 123 | PG4 — General-purpose I/O PG4, FSMC_A14 |
| 腳位 124 | PG5 — General-purpose I/O PG5, FSMC_A15 |
| 腳位 125 | PG6 — General-purpose I/O PG6 |
| 腳位 126 | PG7 — General-purpose I/O PG7 |
| 腳位 127 | PG8 — General-purpose I/O PG8 |
| 腳位 128 | VSS — Ground |
| 腳位 129 | VDD — Digital supply voltage |
| 腳位 130 | PC13_REMAP — Reserved |
| 腳位 131 | PC14_REMAP — Reserved |
| 腳位 132 | PC15_REMAP — Reserved |
| 腳位 133 | PI0 — General-purpose I/O PI0 |
| 腳位 134 | PI1 — General-purpose I/O PI1 |
| 腳位 135 | PI2 — General-purpose I/O PI2 |
| 腳位 136 | PI3 — General-purpose I/O PI3 |
| 腳位 137 | VSS — Ground |
| 腳位 138 | VDD — Digital supply voltage |
| 腳位 139 | PA8_REMAP — Reserved |
| 腳位 140 | PA9_REMAP — Reserved |
| 腳位 141 | PA10_REMAP — Reserved |
| 腳位 142 | PA11_REMAP — Reserved |
| 腳位 143 | PA12_REMAP — Reserved |
| 腳位 144 | VSS — Ground (thermal pad-adjacent) |
典型應用
STM32L4R5ZIT6P 適用於 6 應用s: Battery-Powered IoT Sensor Nodes, Wearable Health Monitors, Industrial HMI with TFT Display, Smart Meters (Electricity / Gas / Water), Asset Tracking with BLE / LoRa, Battery-Powered Data Loggers.
Battery-Powered IoT Sensor Nodes
The STM32L4R5ZIT6P's ultra-low-power Run mode (~30 uA/MHz with internal SMPS) and 2 MB dual-bank Flash make it well-matched to this format, providing full Cortex-M4F signal processing with single-digit-uA sleep modes. The Batch Acquisition ADC scans sensors without CPU wake-up, extending battery life on coin-cell or Li-SOCl2 power. Placed as the central MCU in a sensor hub with SPI/I2C peripherals and BLE/LoRa daughter modules; unlike higher-performance Cortex-M7 parts it draws 5-10x less current in active mode. Compelling as a MPU class option at the low-power extreme.
推薦
Wearable Health Monitors
The STM32L4R5ZIT6P's Cortex-M4F at 120 MHz delivers 273 CoreMark for real-time DSP of photoplethysmography and ECG signals while drawing under 30 uA/MHz in Run mode. This combination of DSP throughput and ultra-low-power standby makes it well-matched to continuous-monitoring wearables. Placed at the heart of a wrist or chest-worn device driving an SPI TFT and BLE radio; unlike a Cortex-M0+ it has the FPU for HRV spectral analysis in real time. Compelling for FDA-cleared Class II medical devices.
推薦
Industrial HMI with TFT Display
The STM32L4R5ZIT6P's Chrom-ART 2D graphics accelerator and OctoSPI interface enable 320x240 to 480x272 TFT rendering without an external graphics controller, while the 144-LQFP exposes over 100 GPIO for parallel-display and touch-sensor routing. This makes it well-matched to mid-tier industrial HMIs that need graphics but must stay within cost budgets. Placed driving a TFT with resistive or capacitive touch via SPI/I2C; unlike STM32F7 it operates from a single 1.8V-3.6V rail without external regulator switching noise. Compelling for HMI with sub-5-year battery operation.
推薦
Smart Meters (Electricity / Gas / Water)
The STM32L4R5ZIT6P's 12-bit 5 Msps ADC, AES-256 hardware crypto (in the L4S5 variant), and RTC with calendar capability make it well-matched to smart-meter requirements for metrology accuracy, tamper detection, and secure communication. Placed as the main MCU with the ADC sampling current/voltage through CTs or shunts; unlike Cortex-M0+ parts it has the MPU to enforce metrology/safety code separation. Compelling for utility-grade metering with 10+ year battery operation.
推薦
Asset Tracking with BLE / LoRa
The STM32L4R5ZIT6P's Cortex-M4F at 120 MHz, USB OTG, and 2 MB Flash support BLE 5.x or LoRaWAN stack integration with on-chip crypto acceleration. This makes it well-matched to long-life asset trackers needing local processing of GPS / accelerometer data before transmission. Placed between an L70 GPS module and an SX1276 LoRa transceiver via SPI/UART; unlike Cortex-M3 parts it has the FPU to run TinyML inference for motion classification. Compelling for logistics visibility with multi-year battery life.
推薦
Battery-Powered Data Loggers
The STM32L4R5ZIT6P's 2 MB dual-bank Flash, 640 KB SRAM2, and SDMMC interface for SD cards make it well-matched to multi-channel data-logging systems that need local storage and OTA-upgradeable firmware. The internal SMPS draws 30 uA/MHz, so even at 60 MHz active duty the average current stays in the low milliamp range. Placed as the central logger with SD-card storage and BLE/USB-C for retrieval; unlike Cortex-M0 parts it can compress logs on-device with the FPU. Compelling for environmental monitoring with one-year-plus battery life.
推薦
推薦產品摘要
工程參考資料，適用於 STM32L4R5ZIT6P — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | STM32L4R5ZIT6 | STM32L4R5ZIY6TR | STM32L4R9ZIT6 | STM32L4S5ZIT6 | STM32U575ZIT6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Core Processor | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz - same | ARM Cortex-M4F 120 MHz - same | ARM Cortex-M4F 120 MHz - same | ARM Cortex-M4F 120 MHz - same | ARM Cortex-M33 160 MHz |
| Flash Memory | 2 MB | 2 MB - same | 2 MB - same | 2 MB - same | 2 MB - same | 2 MB - same |
| SRAM Size | 640 KB | 640 KB - same | 640 KB - same | 640 KB - same | 640 KB - same | 768 KB |
| Hardware Crypto | AES-128 (L4R5 subset) | AES-128 - same | AES-128 - same | AES-128 - same | AES-256 + PKA | AES-256 + PKA + OTFDEC |
| Graphics Accelerator | Chrom-ART 2D | Chrom-ART 2D - same | Chrom-ART 2D - same | Chrom-ART 2D + DSI TCon | Chrom-ART 2D - same | Chrom-ART 2D |
| Operating Temperature | -40C to +85C (industrial 'P') | -40C to +85C - same | -40C to +85C industrial grade | -40C to +85C | -40C to +85C | -40C to +85C / +125C |
| Approximate 1k Price (USD) | $9.30 | $9.30 - same | $9.50 | $10.50 | $11.20 | $8.80 |
主要差異化特點
- Same package and pinout as STM32L4R5ZIT6 (no 'P' suffix) (對比STM32L4R5ZIT6)
- Industrial-grade screening with broader temperature support than STM32L4R5AGI6 (對比STM32L4R5AGI6)
- Adds AES-256 hardware crypto versus STM32L4R5ZIT6 (對比STM32L4S5ZIT6)
設計說明
The STM32L4R5ZIT6P's internal SMPS step-down converter (LDO/SMPS selector pins) must be configured per datasheet RM0432 section 5.1. For battery applications below 1.8V input, configure the SMPS in bypass mode (SMPSEN tied low) and rely on the internal LDO; above 1.8V, enable the SMPS for ~30% efficiency improvement. Estimated active current at 120 MHz with SMPS enabled is approximately 8 mA (vs 11 mA with LDO). Decouple VDD/VDDA pins with 100 nF + 4.7 uF ceramic caps placed within 5 mm of each pin.
The 144-LQFP package's thermal performance is dominated by copper pour on the PCB. Estimated theta_JA on JEDEC EIA/JESD51 4-layer test board with 2 oz copper is approximately 35-40 C/W. At maximum ambient 85C and 1W internal dissipation, junction rises 35-40C - well within spec. For continuous 120 MHz operation, ensure at least 4 square cm of unbroken copper connected to the exposed thermal pad (which is internally floating on LQFP - solder to copper pour for best results).
Route USB DP/DM traces as a 90-ohm differential pair with length matching within 150 mil; keep them short (<25 mm) and isolated from switching nodes and clock traces by at least 3 mm. Place the 12 MHz HSE crystal with its load capacitors within 5 mm of OSC_IN/OSC_OUT pins, and guard the crystal traces with a ground ring to reduce EMI susceptibility. The OctoSPI/QSPI traces to external Flash should also be length-matched (within 50 mil) for reliable DDR operation at 60 MHz.
Do not assume the 'P' suffix on STM32L4R5ZIT6P is optional - it denotes a specific industrial-grade screening level; substituting with the non-'P' STM32L4R5ZIT6 in safety-critical applications may void certification. When using the SDMMC interface, ensure the bus is pulled up to VDD with 10 kohm resistors on CMD/D0-D3 lines to prevent floating state during boot. Do not leave unused GPIO as floating inputs - configure to analog mode or output-low to reduce parasitic current.
Separate analog and digital ground returns. Connect AGND and DGND at a single point near the MCU's VSSA pin to avoid ground loops in ADC measurements. Place the ADC reference-voltage decoupling capacitor (typically 100 nF + 1 uF) within 5 mm of VREF+ pin if the internal VREFBUF enabled. For best RF immunity on HSE crystal traces, surround with GND ring and avoid routing signal traces directly beneath the crystal package footprint.
合規資訊
RoHS and REACH compliance per ST product page. Industrial-grade -40C to +85C operating range ('P' suffix). Not AEC-Q100 qualified - choose STM32L4R5QIY6TR or AEC-Q100-grade ST parts for automotive applications.