T1024NSE7MQA - QorIQ Dual-Core 1.2GHz Power Arch SoC | NXP
MPN： T1024NSE7MQA ✓ 啟用中T1024NSE7MQA 概覽
A communications SoC (System-on-Chip) is an integrated processor that combines CPU cores, memory controllers, hardware accelerators and peripheral interfaces on a single die. QorIQ T1 series SoCs sit within NXP's networking processor hierarchy: application-specific CPU -> embedded communications processor -> SoC -> power-managed networking platform. By integrating DPAA frame queues, SEC encryption, and SerDes for Ethernet and PCIe, the platform eliminates the discrete-asset controller ICs required in legacy designs.
Key features include dual e5500 cores up to 1.2 GHz, 64-bit ISA with hypervisor support, an integrated SEC security engine accelerating AES, 3DES, Kasumi, SNOW and public-key algorithms, and built-in DDR3L/DDR4 SDRAM controller with ECC. The HFBGA-780 package exposes 4 SerDes lanes configurable for Aurora, XAUI, PCIe Gen2 and 10 Gigabit Ethernet. Hardware support for IEEE 1588 timestamps, packet parsing and queuing offloads CPU load at line rate.
Architecturally the part relies on the Power Architecture e5500 dual-issue superscalar core with symmetric multiprocessing and hardware virtualization hooks. The DPAA engine uses a 16-work-element command queue per BMan/QMan complex for parallel packet dispatch. The integrated SEC block supports both Kasumi and SNOW 3G, suiting the part to LTE control-plane cryptography in addition to wireline IPSec tunnels.
Typical applications include industrial control routers, LTE small-cell baseband, fan-less network-attached storage controllers, secure VPN gateways and intelligent IoT gateways. Routing platforms typically pair the T1024NSE7MQA with NXP SGMII PHYs, while control-plane applications use only the SEC block and a small NOR flash footprint.
Designers should size decoupling for the HFBGA-780 substrate to keep the 1.2 GHz core within the 0 to 105C thermal envelope, and verify SerDes lane allocation when mapping XFI, PCIe and Aurora on the same SoC. PCB layout must strictly follow the NXP 23x23 mm escape rules for the BGA.
This page synthesizes distributor pricing, drop-in alternatives drawn from the QorIQ T1 family, and practical design notes not aggregated on any single manufacturer page.
直接替換替代品，適用於 T1024NSE7MQA — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： T1024NSE7MQA （相同外形與佔位） — 差異在於 Core Architecture, Memory Controller, Mounting Type, Operating Temperature, Package.
T1023NSN7MQA
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
T1014NSE7MQA
✅ 直接替換📋 參考替代品（不在目錄中）
T1013NSE7MQA
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
T1024NSE7KQA
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
T1024NSE7MQA 最大額定值與電氣特性
| Core Architecture | Power Architecture e5500 (dual-core) |
| Core Count | 2 |
| Data Width | 64-bit |
| Core Frequency | 1.2 GHz |
| Series | QorIQ T1 |
| Memory Controller | DDR3L / DDR4 with ECC |
| Integrated Crypto Engine | SEC (AES, 3DES, Kasumi, SNOW, public-key) |
| Acceleration Engine | Data Path Acceleration Architecture (DPAA) |
| PCIe Interface | PCIe Gen2 |
| Ethernet Interface | 1 GbE and 10 GbE |
| 工作溫度 | 0C to +105C |
| 封裝 | 780-FBGA (HFBGA), 23x23 mm |
| 腳位數 | 780 |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
T1024NSE7MQA 780-fbga (hfbga), 23x23 mm 腳位配置指南
T1024NSE7MQA（780-fbga (hfbga), 23x23 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： T1024NSE7MQA.
請參閱 資料表 以查看完整腳位配置。
典型應用
T1024NSE7MQA 適用於 6 應用s: Industrial Control Router, LTE Small-Cell Baseband, Secure VPN Gateway, Fan-less Network-Attached Storage Controller, Intelligent IoT Edge Gateway, Telecom Control-Plane Server.
Industrial Control Router
The T1024NSE7MQA powers industrial control routers that must forward multi-protocol traffic on the factory floor without active cooling. Its dual 1.2 GHz e5500 cores plus DPAA offload forward Ethernet/IP, PROFINET and Modbus TCP at line rate, while the integrated SEC engine terminates IPSec tunnels for remote O&M access. The HFBGA-780 23x23 mm package is small enough for DIN-rail housings, and the 0 to 105C junction rating supports unventilated enclosures. Using NXP SGMII PHYs and DDR3L ECC memory the design achieves low MTBF targets required for Industry 4.0 deployments.
推薦
LTE Small-Cell Baseband
The T1024NSE7MQA performs LTE Layer-2/3 scheduling and ciphering for small-cell base stations thanks to its SEC engine acceleration of Kasumi, SNOW 3G and AES. With two e5500 cores running at 1.2 GHz the SoC can schedule up to ~200 connected users in FDD-LTE mode while leaving headroom for SON and O&M tasks. Hardware IEEE 1588 timestamps support CPRI backhaul synchronization, and PCIe Gen2 lanes interconnect the radio card to the SoC. The 105C thermal envelope matches outdoor small-cell cabinet requirements.
推薦
Secure VPN Gateway
Branch-office VPN gateways run the T1024NSE7MQA to terminate hundreds of IPSec and MACsec tunnels while sustaining multi-Gbps routing throughput. The SEC engine accelerates AES-GCM, 3DES and public-key RSA/ECC at line rate, leaving the two e5500 cores free to run the routing stack and policy engine. DDR3L ECC delivers deterministic latency for security associations, while the integrated 10 GbE SerDes uplinks the gateway directly to the WAN. Dual-core isolation also enables split control/data planes in a single SoC.
推薦
Fan-less Network-Attached Storage Controller
Fan-less NAS controllers benefit from the T1024NSE7MQA's 6 to 8 W typical envelope inside a sealed enclosure, providing enough compute to run a Linux RAID stack, SMB/NFS daemons and an embedded web UI. The PCIe Gen2 lanes attach SATA or SAS controller chips, while the 10 GbE SerDes aggregate multiple client streams. The integrated SEC engine provides transparent at-rest encryption for the NAS RAID volumes with negligible throughput penalty. Its wide temperature grade supports commercial NAS chassis without active cooling.
推薦
Intelligent IoT Edge Gateway
The T1024NSE7MQA bridges field-bus sensors and cloud APIs in industrial IoT gateways by combining dual-core application processing with deterministic DPAA offload for time-critical traffic. Its SEC block secures MQTT and OPC-UA sessions with TLS 1.2/1.3, while DPAA prioritizes Modbus and EtherCAT frames on the same physical port. The HFBGA-780 23x23 mm footprint allows compact DIN-rail enclosures, and the 0 to 105C range tolerates factory cabinet conditions. NXP LTS Linux BSP and Yocto layers shorten time-to-market for new edge protocols.
推薦
Telecom Control-Plane Server
The T1024NSE7MQA's hardware virtualization hooks let telecom vendors consolidate multiple network functions onto a single SoC in a control-plane appliance. AES and Kasumi engines accelerate LTE NAS ciphering, while DPAA handles backhaul-plane signaling without external NPUs. The dual-core configuration with SEC-offloaded crypto reduces CPU load, allowing the platform to hit deterministic latency targets for VoLTE and IMS control paths. ECC memory is essential for telecom reliability targets, integrated in the DDR3L/DDR4 controller.
推薦
推薦產品摘要
工程參考資料，適用於 T1024NSE7MQA — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | T1023NSN7MQA | T1014NSE7MQA | T1013NSE7MQA | T1024NSE7KQA |
|---|---|---|---|---|---|
| Package | 780-FBGA (HFBGA) 23x23 mm | 780-FBGA (HFBGA) 23x23 mm - same | 780-FBGA (HFBGA) 23x23 mm - same | 780-FBGA (HFBGA) 23x23 mm - same | 780-FBGA (HFBGA) 23x23 mm - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 2 | 2 (one disabled) | 1 | 1 | 2 |
| Core Frequency | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| Memory Controller | DDR3L / DDR4 ECC | DDR3L / DDR4 ECC | DDR3L / DDR4 ECC | DDR3L / DDR4 ECC | DDR3L / DDR4 ECC |
| Integrated Crypto Engine | SEC (AES, 3DES, Kasumi, SNOW, PK) | SEC (AES, 3DES, Kasumi, SNOW, PK) | SEC (AES, 3DES, Kasumi, SNOW, PK) | SEC (AES, 3DES, Kasumi, SNOW, PK) | SEC (AES, 3DES, Kasumi, SNOW, PK) |
| Ethernet Interface | 1 GbE + 10 GbE | 1 GbE + 10 GbE | 1 GbE + 10 GbE | 1 GbE + 10 GbE | 1 GbE + 10 GbE |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | -40C to +105C |
主要差異化特點
- Dual-core instead of single-core (對比T1014NSE7MQA)
- Industrial temp screening variant available (對比T1024NSE7KQA)
- Full dual-core throughput vs locked-down variant (對比T1023NSN7MQA)
設計說明
Estimated: at 1.2 GHz with full DPAA traffic the T1024NSE7MQA dissipates roughly 6 to 8 W; in a sealed enclosure combine the 780-FBGA with a top-side copper spreader or aluminium heatsink. Use NXP's platform monitor via I2C to read junction temperature, and never exceed the 105C Tjc in the worst-case thermal corner. A 10 to 15 CFM airflow across the package is recommended for industrial control routers mounted in DIN-rail cabinets.
The 780-FBGA 23x23 mm substrate requires 1.0 mm pitch escape with the NXP reference BGA escape pattern, including via-in-pad for the DDR3L/DDR4 byte lanes. Use 8-layer stack-up with a continuous ground plane under the die to control impedance of the high-speed SerDes lines. Reference NXP EVB layout guidelines for AC coupling and power-rail routing.
The T1024NSE7MQA requires sequenced core/SerDes/DDR rails; follow the NXP power-management IC reference design and respect the boot-up order documented in the reference manual. Decouple each power domain with both bulk and 100nF HF ceramics near the BGA balls. Avoid large inrush currents by soft-starting the DC-DC converters that feed the SoC.
合規資訊
NXP product compliance page reports RoHS, lead-free, halogen-free finish on HFBGA-780; AEC-Q100 not applicable to industrial network processors.
