XC7A35T-1FGG484I - Artix-7 FPGA, 250 I/O | AMD
MPN： XC7A35T-1FGG484I ✓ 啟用中XC7A35T-1FGG484I 概覽
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks, configurable I/O, and routing resources that allow designers to implement complex digital systems in hardware. The Artix-7 family sits between the low-cost Spartan-7 and the higher-performance Kintex-7 in AMD's 7-series portfolio, targeting applications where cost and power efficiency are paramount.
Key features of the XC7A35T-1FGG484I include 250 user I/O pins, 2,600 Configurable Logic Blocks (CLBs), 33,280 logic cells, and 1,843,200 total RAM bits. The device integrates five Clock Management Tiles (CMTs) with MMCM and PLL blocks for flexible clock generation, and supports multiple I/O standards including LVCMOS, LVDS, and HSTL. The 484-ball FBGA package provides a compact 23x23mm footprint with 0.8mm ball pitch, enabling dense PCB layouts.
The Artix-7 architecture is built on a 28nm high-k metal gate (HKMG) process technology, delivering up to 50% lower power consumption compared to previous generations. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. With support for AMD Vivado Design Suite, designers can implement complex designs using a mature and comprehensive toolchain.
Typical applications include industrial motor control, medical imaging, software-defined radio, video processing, and automotive driver assistance systems. The industrial temperature grade makes it suitable for harsh environments where reliability is critical.
When designing with this device, ensure adequate decoupling capacitors on all power rails and follow the PCB layout guidelines in UG475 for the 484-FBGA package to maintain signal integrity.
直接替換替代品，適用於 XC7A35T-1FGG484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7A35T-1FGG484I （相同外形與佔位） — 差異在於 Package, Process Technology, Core Voltage, Logic Cells, Speed Grade.
XC7A35T-2FGG484I
✅ 直接替換聯絡詢價
查看資料表 →XC7A35T-1FGG484C
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A50T-3FGG484E
⚡ 相同封裝📋 參考替代品（不在目錄中）
XC7A100T-1FGG484I
⚡ 相同封裝聯絡詢價
查看資料表 →XC7A35T-1FGG484I 最大額定值與電氣特性
| Family | Artix-7 |
| Number of Logic Elements/Cells | 33280 |
| Number of LABs/CLBs | 2600 |
| Total RAM Bits | 1843200 |
| Number of I/O | 250 |
| Number of CMTs (Clock Management Tiles) | 5 |
| Number of MMCMs | 5 |
| Number of PLLs | 5 |
| 封裝 | 484-FBGA (23x23) |
| 安裝類型 | Surface Mount (SMD) |
| 工作溫度範圍 | -40°C to +100°C (TJ) |
| 供應電壓 | 1.0V (core) |
| Process Technology | 28nm HKMG |
| RoHS 狀態 | Compliant |
| 生命週期狀態 | Active |
XC7A35T-1FGG484I 腳位配置
| 腳位 A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| 腳位 A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| 腳位 B1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| 腳位 B2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| 腳位 C1 | VCCINT — Internal core supply voltage (1.0V) |
| 腳位 C2 | GND — Ground |
| 腳位 D1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| 腳位 D2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| 腳位 E1 | VCCAUX — Auxiliary supply voltage (1.8V) |
| 腳位 E2 | GND — Ground |
| 腳位 F1 | IO_L4P_T0 — User I/O bank 0, differential pair P |
| 腳位 F2 | IO_L4N_T0 — User I/O bank 0, differential pair N |
典型應用
XC7A35T-1FGG484I 適用於 6 應用s: Industrial Motor Control, Software-Defined Radio, Medical Imaging, Video Processing, Automotive Driver Assistance, Aerospace and Defense.
Industrial Motor Control
The XC7A35T-1FGG484I is ideal for industrial motor control applications due to its 250 I/Os and 33,280 logic cells, enabling implementation of multiple PWM channels, encoder interfaces, and safety logic. The industrial temperature range (-40°C to +100°C) ensures reliable operation in factory environments. With 5 CMTs, designers can generate precise clock domains for high-speed control loops. The 28nm process provides low power consumption, reducing heat dissipation in enclosed cabinets. Typical designs include field-oriented control (FOC) for AC motors, where the FPGA handles real-time current sensing and PWM generation.
推薦
Software-Defined Radio
The XC7A35T-1FGG484I is well-suited for software-defined radio (SDR) applications, offering 250 I/Os for interfacing with high-speed ADCs and DACs, and 1,843,200 RAM bits for buffering IQ samples. The 5 MMCM/PLLs enable generation of multiple clock domains for digital down/up conversion. The 28nm technology provides the DSP bandwidth needed for filtering and modulation while maintaining low power for portable radios. Designers can implement DDC/DUC chains, FFT engines, and protocol processing in the FPGA fabric. The industrial temperature grade supports deployment in field-deployed communication systems.
推薦
Medical Imaging
The XC7A35T-1FGG484I is used in medical imaging systems such as ultrasound and X-ray machines, where its 33,280 logic cells handle real-time image processing algorithms like filtering and edge detection. The 250 I/Os connect to image sensors and display interfaces, while the 1,843,200 RAM bits store frame buffers. The industrial temperature range ensures reliable operation in clinical environments. The low power consumption of the 28nm process is critical for portable devices. Designers can implement beamforming, image enhancement, and compression in the FPGA, offloading the host processor.
推薦
Video Processing
The XC7A35T-1FGG484I is suitable for video processing applications, offering 250 I/Os for interfacing with video sources and displays, and 33,280 logic cells for implementing scalers, color space converters, and overlays. The 5 CMTs generate pixel clocks for various resolutions up to 1080p. The 1,843,200 RAM bits provide line buffers for video processing pipelines. The 28nm technology enables low-latency processing for real-time video. Designers can implement HDMI, DisplayPort, or MIPI interfaces using the FPGA's high-speed I/O capabilities.
推薦
Automotive Driver Assistance
The XC7A35T-1FGG484I is used in automotive driver assistance systems (ADAS) for sensor fusion and pre-processing. Its 250 I/Os interface with cameras, radar, and LiDAR sensors, while 33,280 logic cells implement image pre-processing and object detection algorithms. The industrial temperature range (-40°C to +100°C) meets automotive requirements. The 28nm process provides the performance needed for real-time processing while meeting automotive power budgets. Designers can implement lane detection, pedestrian detection, and sensor fusion in the FPGA, reducing the load on the main processor.
推薦
Aerospace and Defense
The XC7A35T-1FGG484I is suitable for aerospace and defense applications such as avionics, radar, and secure communications. The industrial temperature range and 28nm technology ensure reliable operation in harsh environments. With 250 I/Os and 33,280 logic cells, designers can implement custom protocols, encryption, and signal processing. The 5 CMTs provide robust clock management for high-reliability systems. The FPGA's reconfigurability allows for field updates and adaptive processing. Designers can implement beamforming, target tracking, and secure data links in the FPGA fabric.
推薦
推薦產品摘要
工程參考資料，適用於 XC7A35T-1FGG484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7A35T-2FGG484I | XC7A35T-1FGG484C | XC7A50T-3FGG484E |
|---|---|---|---|---|
| Package | 484-FBGA (23x23) | 484-FBGA (23x23) - same | 484-FBGA (23x23) - same | 484-FBGA (23x23) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 33,280 | 33,280 | 33,280 | 52,160 |
| Number of I/Os | 250 | 250 | 250 | 250 |
| RAM Bits | 1,843,200 | 1,843,200 | 1,843,200 | 2,764,800 |
| Speed Grade | -1 | -2 | -1 | -3 |
| Temperature Range | -40°C to +100°C | -40°C to +100°C | 0°C to +85°C | 0°C to +100°C |
| Pin Compatibility | Reference | Pin-compatible | Pin-compatible | Not pin-compatible |
主要差異化特點
- Industrial temperature grade (對比XC7A35T-1FGG484C)
- Cost-effective logic density (對比XC7A50T-3FGG484E)
- Standard speed grade (對比XC7A35T-2FGG484I)
設計說明
The XC7A35T-1FGG484I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCO for each I/O bank. Use dedicated power regulators with adequate decoupling. Place 100nF ceramic capacitors close to each power pin and 10uF bulk capacitors on each rail. Follow the power sequencing requirements in DS181 to avoid latch-up or damage.
The 484-FBGA package has a 0.8mm ball pitch, requiring careful PCB design. Use microvias or blind vias for routing. Ensure the thermal pad is connected to a solid ground plane for heat dissipation. Follow the layout guidelines in UG475 for the 484-FBGA package to maintain signal integrity and manufacturability.
Do not exceed the maximum input voltage on any I/O pin. Ensure all unused I/O pins are configured properly in the Vivado design to avoid floating inputs. When migrating between speed grades, re-verify timing closure as the -2 grade may require different constraints. Always check the device pinout file for the specific package before layout.
合規資訊
RoHS compliant per distributor data. AEC-Q100 not applicable for FPGA devices.
