XC7A35T-2FGG484I - Artix-7 FPGA 33K Logic Cells | AMD
MPN: XC7A35T-2FGG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $34.3 | $34.30 |
| 10 | $31.5 | $315.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $24.1 | $24,100.00 |
Drop-in alternatives for XC7A35T-2FGG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7A35T-2FGG484C
✅ Drop-In✓ In Stock
$16.9 / Unit
View Datasheet →XC7A35T-1FGG484I
✅ Drop-In✓ In Stock
$15.1 / Unit
View Datasheet →XC7A50T-2FGG484I
✅ Drop-In✓ In Stock
$27.5 / Unit
View Datasheet →XC7A35T-2FGG484I Maximum Ratings & Electrical Characteristics
| Family | Artix-7 |
| Logic Cells | 33280 |
| Number of I/O | 250 |
| Block RAM | 1843200 bits |
| DSP Slices | 90 |
| Clock Management Tiles | 5 (with MMCM and PLL) |
| Package | 484-BBGA (FBGA) |
| Core Voltage | 1.0 V |
| Operating Temperature | -40°C to +100°C (industrial) |
| Process Technology | 28nm |
| Speed Grade | -2 |
| Configuration | SRAM-based |
| Supported I/O Standards | LVCMOS, LVDS, HSTL, SSTL |
| Memory Support | DDR3 |
| RoHS Status | Compliant |
XC7A35T-2FGG484I Pin Configuration
| Pin A1 | IO_L1P_T0_AD0P_35 — User I/O bank 35, differential pair P |
| Pin A2 | IO_L1N_T0_AD0N_35 — User I/O bank 35, differential pair N |
| Pin B1 | IO_L2P_T0_AD8P_35 — User I/O bank 35, differential pair P |
| Pin B2 | IO_L2N_T0_AD8N_35 — User I/O bank 35, differential pair N |
| Pin C1 | IO_L3P_T0_DQS_P_35 — User I/O bank 35, differential pair P, DQS |
| Pin C2 | IO_L3N_T0_DQS_N_35 — User I/O bank 35, differential pair N, DQS |
| Pin D1 | IO_L4P_T0_35 — User I/O bank 35, differential pair P |
| Pin D2 | IO_L4N_T0_35 — User I/O bank 35, differential pair N |
| Pin E1 | IO_L5P_T0_AD13P_35 — User I/O bank 35, differential pair P |
| Pin E2 | IO_L5N_T0_AD13N_35 — User I/O bank 35, differential pair N |
| Pin F1 | IO_L6P_T0_35 — User I/O bank 35, differential pair P |
| Pin F2 | IO_L6N_T0_35 — User I/O bank 35, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7A35T-2FGG484I is suitable for 6 applications: Industrial Motor Control, Software-Defined Radio, Medical Imaging, Video Processing, Aerospace and Defense, IoT and Edge Computing.
Industrial Motor Control
The XC7A35T-2FGG484I is ideal for industrial motor control due to its 90 DSP slices and 250 I/O pins, enabling high-speed PWM generation, encoder feedback processing, and field-oriented control (FOC) algorithms. Its low power consumption and industrial temperature range (-40°C to +100°C) make it suitable for factory automation and robotics. The device's 28nm process ensures high performance per watt, critical for heat-sensitive environments. With support for various I/O standards, it can interface directly with motor drivers and sensors, reducing external logic. The FPGA's parallel processing capability allows simultaneous control of multiple axes, improving system throughput and reliability.
Recommended
Software-Defined Radio
The XC7A35T-2FGG484I is well-suited for software-defined radio (SDR) applications, offering 90 DSP slices and 1,843,200 bits of block RAM for digital up/down conversion, filtering, and modulation. Its 250 I/O pins can interface with high-speed ADCs and DACs, while the 5 clock management tiles provide flexible clocking for various frequency plans. The device's low power consumption is advantageous for portable and battery-operated SDRs. The Artix-7 family's cost-effectiveness makes it a popular choice for amateur radio and educational SDR platforms. The FPGA's reconfigurability allows over-the-air updates and multi-mode operation, enhancing flexibility in dynamic RF environments.
Recommended
Medical Imaging
The XC7A35T-2FGG484I is used in medical imaging systems such as ultrasound and CT scanners, where high-speed data processing and parallel computation are essential. Its 90 DSP slices and 250 I/O pins enable real-time image filtering, beamforming, and data acquisition. The device's low power consumption helps manage thermal constraints in compact medical devices. The industrial temperature range ensures reliable operation in clinical environments. The FPGA's reconfigurability allows algorithm updates without hardware changes, extending product lifespan. With support for DDR3 memory, it can buffer large image frames, and its 1,843,200 bits of block RAM provide on-chip storage for intermediate results, reducing latency.
Recommended
Video Processing
The XC7A35T-2FGG484I is suitable for video processing applications such as video surveillance, broadcasting, and display controllers. Its 250 I/O pins can interface with HDMI, MIPI, and LVDS interfaces, while the 90 DSP slices handle color space conversion, scaling, and filtering. The device's block RAM can store line buffers for real-time processing. The low power consumption is beneficial for fanless embedded systems. The FPGA's parallel architecture enables simultaneous processing of multiple video streams, making it ideal for multi-camera systems. With support for various I/O standards, it can directly connect to image sensors and displays, reducing component count and system cost.
Recommended
Aerospace and Defense
The XC7A35T-2FGG484I is used in aerospace and defense applications such as avionics, radar, and secure communications. Its industrial temperature range and 28nm process ensure reliability in harsh environments. The device's 90 DSP slices and 250 I/O pins enable complex signal processing and sensor interfacing. The FPGA's reconfigurability allows in-field updates for evolving mission requirements. The low power consumption is critical for airborne systems where power and cooling are limited. The device supports various I/O standards, including LVDS and HSTL, for high-speed data links. Its 1,843,200 bits of block RAM provide on-chip storage for radar data, and the 5 clock management tiles ensure precise timing for coherent processing.
Recommended
IoT and Edge Computing
The XC7A35T-2FGG484I is used in IoT gateways and edge computing devices where low power and high performance are required. Its 33,280 logic cells and 90 DSP slices enable on-device AI inference, sensor fusion, and protocol processing. The device's low power consumption is ideal for battery-powered or energy-harvesting devices. The FPGA's reconfigurability allows over-the-air updates for new algorithms and protocols. With 250 I/O pins, it can interface with a wide range of sensors and communication modules. The Artix-7 family's cost-effectiveness makes it suitable for high-volume IoT deployments. The device's small form factor (484-BBGA) enables compact designs, and its industrial temperature range ensures operation in outdoor environments.
Recommended
Recommended Products Summary
Engineering reference data for XC7A35T-2FGG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7A35T-2FGG484C | XC7A35T-1FGG484I | XC7A35T-2FTG256I | XC7A50T-2FGG484I |
|---|---|---|---|---|---|
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 256-BBGA | 484-BBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 33280 | 33280 | 33280 | 33280 | 52160 |
| Number of I/O | 250 | 250 | 250 | 170 | 300 |
| Block RAM (bits) | 1843200 | 1843200 | 1843200 | 1843200 | 2700000 |
| DSP Slices | 90 | 90 | 90 | 90 | 120 |
| Speed Grade | -2 | -2 | -1 | -2 | -2 |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) |
Key Differentiators
- Industrial temperature grade (vs XC7A35T-2FGG484C)
- Higher speed grade (vs XC7A35T-1FGG484I)
- More I/O and larger package (vs XC7A35T-2FTG256I)
Design Notes
The XC7A35T-2FGG484I requires multiple supply voltages: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (bank-specific, typically 1.5V-3.3V). Proper power sequencing is critical: VCCINT and VCCAUX should ramp up before VCCO. Use low-ESR ceramic capacitors (100nF and 10uF) placed close to each power pin. Refer to the Artix-7 datasheet for detailed decoupling recommendations.
For high-speed I/O, maintain controlled impedance traces (e.g., 50 ohm single-ended, 100 ohm differential) and minimize trace length. Use ground planes beneath the FPGA to reduce noise. The 484-BBGA package requires a multi-layer PCB (at least 6 layers) for proper routing and power distribution. Follow AMD's PCB design guidelines in UG475 for pinout and layout.
The XC7A35T-2FGG484I can dissipate up to 2-3W depending on utilization. The 484-BBGA package has a thermal resistance (theta_JA) of approximately 20°C/W without airflow. For industrial temperature range, ensure adequate airflow or a heatsink if power exceeds 1.5W. Use thermal vias under the package to improve heat transfer to the PCB.
Compliance Information
RoHS compliance is indicated by distributor listings. Other compliance data not explicitly provided in the verified data.
