XC7VX690T-1FFG1157C - Virtex-7 XT FPGA 693K Cells | AMD
MPN： XC7VX690T-1FFG1157C ✓ 啟用中XC7VX690T-1FFG1157C 概覽
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. FPGAs sit within the broader category of programmable logic devices (PLDs), which also includes CPLDs, and are a key component in the semiconductor industry for prototyping, low-volume production, and applications requiring hardware reconfigurability.
Key features of the XC7VX690T-1FFG1157C include its 693K logic cells, 600 user I/Os, and 54.19 Mb of block RAM. The device operates at a core voltage of 1V and supports a wide range of I/O standards. It includes 80 DSP48E1 slices for high-performance digital signal processing, and up to 80 GTX transceivers for high-speed serial communication. The -1 speed grade indicates a balanced performance level, suitable for a wide range of applications.
Technically, the Virtex-7 XT family is optimized for high-bandwidth and high-capacity applications. The 28nm HPL (High-Performance, Low-Power) process technology provides a good balance between performance and power consumption. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the FPGA. It also features advanced clock management tiles (CMTs) with PLLs and MMCMs for precise clock generation and distribution.
Typical applications include high-performance computing, data center acceleration, wired and wireless communications, aerospace and defense systems, and medical imaging. The high logic density and transceiver count make it ideal for implementing complex algorithms, protocol processing, and high-throughput data paths. The 600 I/Os provide ample connectivity for external memory interfaces, high-speed ADCs/DACs, and other peripherals.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) with proper sequencing and filtering. A robust PCB layout with adequate ground planes and decoupling capacitors is essential for reliable operation at high speeds. The FC-BGA package requires a reflow profile compatible with lead-free soldering.
直接替換替代品，適用於 XC7VX690T-1FFG1157C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7VX690T-1FFG1157C （相同外形與佔位） — 差異在於 Operating Temperature, Package, Speed Grade, Temperature Grade.
XC7VX690T-2FFG1157I
✅ 直接替換聯絡詢價
查看資料表 →XC7VX690T-1FFG1157I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7VX690T-2FFG1157C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7VX690T-1FFG1157C
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XC7VX690T-1FFG1157C
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XC7VX690T-1FFG1157C 最大額定值與電氣特性
| Family | Virtex-7 XT |
| Logic Cells | 693120 |
| Block RAM | 54190080 bits |
| Number of I/Os | 600 |
| 封裝 | 1157-pin FC-BGA (FFG1157) |
| Technology | 28nm |
| Core Voltage | 1V |
| Speed Grade | -1 |
| Temperature Grade | C (Commercial, 0C to +85C) |
| DSP Slices | 3600 |
| GTX Transceivers | 80 |
| Configuration | SRAM-based |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| 工作溫度 | 0C to +85C |
XC7VX690T-1FFG1157C 腳位配置
| 腳位 A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| 腳位 A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| 腳位 B1 | VCCINT — Internal core voltage 1V |
| 腳位 B2 | GND — Ground |
| 腳位 C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| 腳位 C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| 腳位 D1 | VCCAUX — Auxiliary voltage 1.8V |
| 腳位 D2 | GND — Ground |
| 腳位 E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| 腳位 E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| 腳位 F1 | VCCO_0 — I/O bank 0 supply voltage |
| 腳位 F2 | GND — Ground |
典型應用
XC7VX690T-1FFG1157C 適用於 6 應用s: High-Performance Computing, Wired Communications, Aerospace and Defense, Medical Imaging, Data Center Acceleration, Test and Measurement.
High-Performance Computing
The XC7VX690T-1FFG1157C is ideal for high-performance computing applications such as data center acceleration and scientific computing. Its 693K logic cells and 3600 DSP slices enable complex algorithms and parallel processing. The 80 GTX transceivers provide high-speed connectivity for inter-chip and inter-board communication, making it suitable for compute-intensive workloads.
推薦
Wired Communications
In wired communications, the XC7VX690T-1FFG1157C excels in implementing high-throughput packet processing, protocol conversion, and network security. Its 80 GTX transceivers support 10G/40G/100G Ethernet and other high-speed serial standards. The large block RAM (54.19 Mb) enables deep packet buffering and flow tables, essential for routers and switches.
推薦
Aerospace and Defense
The XC7VX690T-1FFG1157C is suitable for aerospace and defense applications like radar, electronic warfare, and secure communications. Its high logic density and DSP capabilities support complex signal processing algorithms. The commercial temperature grade (0C to +85C) is adequate for many ground-based systems, while the industrial-grade variant is available for harsher environments.
推薦
Medical Imaging
For medical imaging systems like CT scanners and ultrasound machines, the XC7VX690T-1FFG1157C provides the computational power needed for real-time image processing and reconstruction. Its 3600 DSP slices accelerate filtering and transform operations, while the 600 I/Os interface with high-speed ADCs and DACs. The device's reliability and long-term availability are critical for medical equipment.
推薦
Data Center Acceleration
The XC7VX690T-1FFG1157C is used in data center acceleration for applications like network function virtualization (NFV), storage acceleration, and AI inference. Its high logic density and transceiver count enable offloading of compute-intensive tasks from CPUs. The device supports partial reconfiguration, allowing dynamic updates to acceleration functions without system downtime.
推薦
Test and Measurement
In test and measurement equipment, the XC7VX690T-1FFG1157C enables high-speed data acquisition, signal generation, and real-time analysis. Its 600 I/Os connect to high-speed ADCs and DACs, while the DSP slices handle complex waveform processing. The device's reconfigurability allows the same hardware to support multiple test standards and protocols.
推薦
推薦產品摘要
工程參考資料，適用於 XC7VX690T-1FFG1157C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7VX690T-2FFG1157I | XC7VX690T-1FFG1157I | XC7VX690T-2FFG1157C |
|---|---|---|---|---|
| Package | 1157-pin FC-BGA (FFG1157) | 1157-pin FC-BGA (FFG1157) | 1157-pin FC-BGA (FFG1157) | 1157-pin FC-BGA (FFG1157) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 693120 | 693120 | 693120 | 693120 |
| Block RAM | 54190080 bits | 54190080 bits | 54190080 bits | 54190080 bits |
| Number of I/Os | 600 | 600 | 600 | 600 |
| Speed Grade | -1 | -2 | -1 | -2 |
| Temperature Grade | C (0C to +85C) | I (-40C to +100C) | I (-40C to +100C) | C (0C to +85C) |
| Core Voltage | 1V | 1V | 1V | 1V |
主要差異化特點
- Higher speed grade option (對比XC7VX690T-1FFG1157C)
- Industrial temperature range (對比XC7VX690T-1FFG1157C)
- Cost-effective baseline (對比XC7VX690T-2FFG1157I)
設計說明
The XC7VX690T-1FFG1157C requires multiple power rails: VCCINT at 1V, VCCAUX at 1.8V, and VCCO for each I/O bank. Proper power sequencing is essential to avoid latch-up or damage. Use a dedicated power management IC to ensure correct sequencing and monotonic ramp-up. Decouple each rail with a combination of bulk and high-frequency ceramic capacitors placed close to the FPGA pins.
The XC7VX690T-1FFG1157C can dissipate significant power, especially when using many transceivers and logic resources. A thermal solution, such as a heatsink or active cooling, is required to keep the junction temperature within the specified range (0C to +85C for commercial grade). Use thermal vias under the package to improve heat transfer to the PCB ground plane.
For high-speed signals, maintain controlled impedance traces and minimize stub lengths. Use a solid ground plane and avoid splitting it under the FPGA. Place decoupling capacitors as close as possible to the power pins. For the FC-BGA package, ensure the PCB pad pattern matches the recommended land pattern from AMD to avoid solder joint reliability issues.
合規資訊
RoHS compliance is indicated by distributor listings. Other compliance details are not specified in the provided data.
