XCZU7EV-1FFVC1156E - Zynq UltraScale+ MPSoC EV | AMD
MPN： XCZU7EV-1FFVC1156E ✓ 啟用中XCZU7EV-1FFVC1156E 概覽
A Zynq UltraScale+ MPSoC is a multiprocessor system-on-chip that combines a hardened processing system (PS) with programmable logic (PL) on a single device. This architecture enables designers to implement complex embedded systems with both software flexibility and hardware acceleration. The EV variant specifically targets video codec applications, providing hardware-accelerated H.264/H.265 encoding and decoding capabilities.
Key features of the XCZU7EV-1FFVC1156E include the 504K+ logic cells for extensive programmable logic, the quad-core A53 application processor for high-performance computing, and the Mali-400 MP2 GPU for graphics acceleration. The device also supports a wide range of high-speed serial transceivers and memory interfaces, making it suitable for demanding applications.
The device is built on TSMC's 16nm process technology, offering a balance of performance and power efficiency. The programmable logic is based on the UltraScale+ architecture, which provides advanced features such as integrated block RAM, DSP slices, and high-speed transceivers. The processing system includes a comprehensive set of peripherals, including USB, PCIe, and Ethernet controllers.
Typical applications for the XCZU7EV-1FFVC1156E include video processing and surveillance systems, 5G wireless infrastructure, industrial automation, and automotive ADAS. The combination of high-performance processing and programmable logic makes it ideal for applications requiring both software flexibility and hardware acceleration.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO, etc.) require proper sequencing to ensure reliable operation. Additionally, the high-speed transceivers require careful PCB layout to maintain signal integrity.
直接替換替代品，適用於 XCZU7EV-1FFVC1156E — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XCZU7EV-1FFVC1156E （相同外形與佔位） — 差異在於 Package, Speed Grade.
XCZU7EV-2FFVC1156E
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU7EV-1FFVC1156I
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU7EV-2FFVC1156I
✅ 直接替換聯絡詢價
查看資料表 →XCZU7CG-1FFVC1156I
⚡ 相同封裝📋 參考替代品（不在目錄中）
XCZU9EG-2FFVB1156E
⚡ 相同封裝📋 參考替代品（不在目錄中）
XCZU7EV-1FFVC1156E 最大額定值與電氣特性
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Logic Cells | 504K+ |
| 封裝 | 1156-FCBGA (35x35) |
| Core Voltage | 0.85V |
| Speed Grade | -1 |
| Temperature Grade | E (Commercial, 0C to +100C) |
| 安裝類型 | Surface Mount |
| Terminal Form | BALL |
| Number of Terminals | 1156 |
| Package Code | BGA |
| Package Shape | RECTANGULAR |
| Process Technology | 16nm |
| Family | Zynq UltraScale+ MPSoC |
XCZU7EV-1FFVC1156E 腳位配置
| 腳位 A1 | GND — Ground |
| 腳位 A2 | VCCO_0 — I/O bank 0 supply voltage |
| 腳位 B1 | IO_L1P_T0L_N0_D00 — User I/O, differential pair |
| 腳位 B2 | IO_L1N_T0L_N0_D01 — User I/O, differential pair |
| 腳位 C1 | VCCINT — Internal core supply voltage |
| 腳位 C2 | GND — Ground |
| 腳位 D1 | IO_L2P_T0L_N2_D02 — User I/O, differential pair |
| 腳位 D2 | IO_L2N_T0L_N2_D03 — User I/O, differential pair |
| 腳位 E1 | VCCAUX — Auxiliary supply voltage |
| 腳位 E2 | GND — Ground |
| 腳位 F1 | IO_L3P_T0L_N4_D04 — User I/O, differential pair |
| 腳位 F2 | IO_L3N_T0L_N4_D05 — User I/O, differential pair |
典型應用
XCZU7EV-1FFVC1156E 適用於 6 應用s: Video Processing and Surveillance, 5G Wireless Infrastructure, Industrial Automation, Automotive ADAS, Aerospace and Defense, Medical Imaging.
Video Processing and Surveillance
The XCZU7EV-1FFVC1156E is ideal for video processing and surveillance systems due to its hardware-accelerated H.264/H.265 video codec blocks. The quad-core A53 processor can handle video analytics algorithms, while the programmable logic can implement custom image processing pipelines. The Mali-400 GPU can accelerate video rendering and display. This combination enables real-time video encoding, decoding, and analysis in a single device, reducing system complexity and power consumption compared to multi-chip solutions.
推薦
5G Wireless Infrastructure
The XCZU7EV-1FFVC1156E is well-suited for 5G wireless infrastructure, including baseband processing and beamforming. The programmable logic can implement custom DSP algorithms for signal processing, while the A53 cores handle protocol stack processing. The high-speed transceivers support CPRI/eCPRI interfaces to RF front-ends. The device's 504K+ logic cells provide ample resources for implementing complex MIMO and beamforming algorithms, enabling high-throughput 5G base station designs.
推薦
Industrial Automation
The XCZU7EV-1FFVC1156E is ideal for industrial automation applications such as robotics, machine vision, and motion control. The dual-core Cortex-R5 processor provides real-time control capabilities, while the programmable logic can implement custom motor control algorithms and sensor interfaces. The A53 cores can run Linux for HMI and network communication. The device's robust feature set and industrial temperature grade options make it suitable for factory floor environments.
推薦
Automotive ADAS
The XCZU7EV-1FFVC1156E is suitable for automotive ADAS applications, including sensor fusion, camera processing, and driver assistance. The programmable logic can implement custom image processing and sensor fusion algorithms, while the A53 cores handle high-level decision making. The Mali-400 GPU can accelerate graphics for driver displays. The device's high-performance processing capabilities enable real-time object detection and tracking, enhancing vehicle safety.
推薦
Aerospace and Defense
The XCZU7EV-1FFVC1156E is used in aerospace and defense applications such as radar, electronic warfare, and secure communications. The programmable logic can implement custom signal processing and encryption algorithms, while the A53 cores handle system control and communication. The device's high-reliability packaging and wide temperature range options make it suitable for harsh environments. The combination of processing power and programmable logic enables flexible, upgradeable defense systems.
推薦
Medical Imaging
The XCZU7EV-1FFVC1156E is well-suited for medical imaging applications such as ultrasound, CT, and MRI systems. The programmable logic can implement custom image reconstruction and processing algorithms, while the A53 cores handle system control and user interface. The Mali-400 GPU can accelerate 3D rendering for visualization. The device's high-performance processing enables real-time imaging, improving diagnostic capabilities and patient care.
推薦
推薦產品摘要
工程參考資料，適用於 XCZU7EV-1FFVC1156E — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XCZU7EV-2FFVC1156E | XCZU7EV-1FFVC1156I | XCZU7EV-2FFVC1156I | XCZU7CG-1FFVC1156I | XCZU9EG-2FFVB1156E |
|---|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -2 | -1 | -2 |
| Temperature Grade | E (Commercial) | E (Commercial) | I (Industrial) | I (Industrial) | I (Industrial) | E (Commercial) |
| Logic Cells | 504K+ | 504K+ | 504K+ | 504K+ | 504K+ | 599K+ |
| Video Codec | Yes (EV) | Yes (EV) | Yes (EV) | Yes (EV) | No (CG) | No (EG) |
| Core Processor | Quad A53, Dual R5, Mali-400 | Quad A53, Dual R5, Mali-400 | Quad A53, Dual R5, Mali-400 | Quad A53, Dual R5, Mali-400 | Quad A53, Dual R5, Mali-400 | Quad A53, Dual R5, Mali-400 |
| Core Voltage | 0.85V | 0.85V | 0.85V | 0.85V | 0.85V | 0.85V |
主要差異化特點
- Hardware video codec (對比XCZU7CG-1FFVC1156I)
- Lower speed grade for power efficiency (對比XCZU7EV-2FFVC1156E)
- Commercial temperature grade for cost (對比XCZU7EV-1FFVC1156I)
設計說明
The XCZU7EV-1FFVC1156E requires multiple power rails (VCCINT, VCCAUX, VCCO, etc.) with proper sequencing. Refer to the AMD Zynq UltraScale+ MPSoC power supply requirements in DS891. Use a dedicated power management IC to ensure correct power-up and power-down sequencing. Decouple each power rail with appropriate capacitors close to the device pins.
The 1156-FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Follow AMD's PCB design guidelines for Zynq UltraScale+ devices. Ensure adequate ground planes and via stitching for signal integrity. Place decoupling capacitors as close as possible to the power pins.
The XCZU7EV-1FFVC1156E can dissipate significant power, especially when using high-speed transceivers and heavy programmable logic utilization. Use a heatsink and ensure adequate airflow in the system enclosure. Consider the thermal resistance of the package and the ambient temperature when designing the cooling solution.
合規資訊
Compliance information not explicitly provided in the verified web data. Check AMD's official documentation for RoHS and REACH compliance details.
