XCZU7EV-1FFVC1156E - Zynq UltraScale+ MPSoC EV | AMD
MPN: XCZU7EV-1FFVC1156E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1295 | $1,295.00 |
| 10 | $1195 | $11,950.00 |
| 100 | $1095 | $109,500.00 |
| 500 | $995 | $497,500.00 |
| 1,000 | $895 | $895,000.00 |
Drop-in alternatives for XCZU7EV-1FFVC1156E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU7EV-2FFVC1156E
β Drop-Inπ Reference alternative (not in catalog)
XCZU7EV-1FFVC1156I
β Drop-Inπ Reference alternative (not in catalog)
XCZU7EV-2FFVC1156I
β Drop-Inβ In Stock
$895 / Unit
View Datasheet βXCZU7CG-1FFVC1156I
β‘ Same Packageπ Reference alternative (not in catalog)
XCZU9EG-2FFVB1156E
β‘ Same Packageπ Reference alternative (not in catalog)
XCZU7EV-1FFVC1156E Maximum Ratings & Electrical Characteristics
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Logic Cells | 504K+ |
| Package | 1156-FCBGA (35x35) |
| Core Voltage | 0.85V |
| Speed Grade | -1 |
| Temperature Grade | E (Commercial, 0C to +100C) |
| Mounting Type | Surface Mount |
| Terminal Form | BALL |
| Number of Terminals | 1156 |
| Package Code | BGA |
| Package Shape | RECTANGULAR |
| Process Technology | 16nm |
| Family | Zynq UltraScale+ MPSoC |
| RoHS Status | [DATA_NEEDED: RoHS Status] |
XCZU7EV-1FFVC1156E Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCO_0 β I/O bank 0 supply voltage |
| Pin B1 | IO_L1P_T0L_N0_D00 β User I/O, differential pair |
| Pin B2 | IO_L1N_T0L_N0_D01 β User I/O, differential pair |
| Pin C1 | VCCINT β Internal core supply voltage |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L2P_T0L_N2_D02 β User I/O, differential pair |
| Pin D2 | IO_L2N_T0L_N2_D03 β User I/O, differential pair |
| Pin E1 | VCCAUX β Auxiliary supply voltage |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L3P_T0L_N4_D04 β User I/O, differential pair |
| Pin F2 | IO_L3N_T0L_N4_D05 β User I/O, differential pair |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU7EV-1FFVC1156E is suitable for 6 applications: Video Processing and Surveillance, 5G Wireless Infrastructure, Industrial Automation, Automotive ADAS, Aerospace and Defense, Medical Imaging.
Video Processing and Surveillance
The XCZU7EV-1FFVC1156E is ideal for video processing and surveillance systems due to its hardware-accelerated H.264/H.265 video codec blocks. The quad-core A53 processor can handle video analytics algorithms, while the programmable logic can implement custom image processing pipelines. The Mali-400 GPU can accelerate video rendering and display. This combination enables real-time video encoding, decoding, and analysis in a single device, reducing system complexity and power consumption compared to multi-chip solutions.
Recommended
5G Wireless Infrastructure
The XCZU7EV-1FFVC1156E is well-suited for 5G wireless infrastructure, including baseband processing and beamforming. The programmable logic can implement custom DSP algorithms for signal processing, while the A53 cores handle protocol stack processing. The high-speed transceivers support CPRI/eCPRI interfaces to RF front-ends. The device's 504K+ logic cells provide ample resources for implementing complex MIMO and beamforming algorithms, enabling high-throughput 5G base station designs.
Recommended
Industrial Automation
The XCZU7EV-1FFVC1156E is ideal for industrial automation applications such as robotics, machine vision, and motion control. The dual-core Cortex-R5 processor provides real-time control capabilities, while the programmable logic can implement custom motor control algorithms and sensor interfaces. The A53 cores can run Linux for HMI and network communication. The device's robust feature set and industrial temperature grade options make it suitable for factory floor environments.
Recommended
Automotive ADAS
The XCZU7EV-1FFVC1156E is suitable for automotive ADAS applications, including sensor fusion, camera processing, and driver assistance. The programmable logic can implement custom image processing and sensor fusion algorithms, while the A53 cores handle high-level decision making. The Mali-400 GPU can accelerate graphics for driver displays. The device's high-performance processing capabilities enable real-time object detection and tracking, enhancing vehicle safety.
Recommended
Aerospace and Defense
The XCZU7EV-1FFVC1156E is used in aerospace and defense applications such as radar, electronic warfare, and secure communications. The programmable logic can implement custom signal processing and encryption algorithms, while the A53 cores handle system control and communication. The device's high-reliability packaging and wide temperature range options make it suitable for harsh environments. The combination of processing power and programmable logic enables flexible, upgradeable defense systems.
Recommended
Medical Imaging
The XCZU7EV-1FFVC1156E is well-suited for medical imaging applications such as ultrasound, CT, and MRI systems. The programmable logic can implement custom image reconstruction and processing algorithms, while the A53 cores handle system control and user interface. The Mali-400 GPU can accelerate 3D rendering for visualization. The device's high-performance processing enables real-time imaging, improving diagnostic capabilities and patient care.
Recommended
Recommended Products Summary
Engineering reference data for XCZU7EV-1FFVC1156E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU7EV-2FFVC1156E | XCZU7EV-1FFVC1156I | XCZU7EV-2FFVC1156I | XCZU7CG-1FFVC1156I | XCZU9EG-2FFVB1156E |
|---|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -2 | -1 | -2 |
| Temperature Grade | E (Commercial) | E (Commercial) | I (Industrial) | I (Industrial) | I (Industrial) | E (Commercial) |
| Logic Cells | 504K+ | 504K+ | 504K+ | 504K+ | 504K+ | 599K+ |
| Video Codec | Yes (EV) | Yes (EV) | Yes (EV) | Yes (EV) | No (CG) | No (EG) |
| Core Processor | Quad A53, Dual R5, Mali-400 | Quad A53, Dual R5, Mali-400 | Quad A53, Dual R5, Mali-400 | Quad A53, Dual R5, Mali-400 | Quad A53, Dual R5, Mali-400 | Quad A53, Dual R5, Mali-400 |
| Core Voltage | 0.85V | 0.85V | 0.85V | 0.85V | 0.85V | 0.85V |
Key Differentiators
- Hardware video codec (vs XCZU7CG-1FFVC1156I)
- Lower speed grade for power efficiency (vs XCZU7EV-2FFVC1156E)
- Commercial temperature grade for cost (vs XCZU7EV-1FFVC1156I)
Design Notes
The XCZU7EV-1FFVC1156E requires multiple power rails (VCCINT, VCCAUX, VCCO, etc.) with proper sequencing. Refer to the AMD Zynq UltraScale+ MPSoC power supply requirements in DS891. Use a dedicated power management IC to ensure correct power-up and power-down sequencing. Decouple each power rail with appropriate capacitors close to the device pins.
The 1156-FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Follow AMD's PCB design guidelines for Zynq UltraScale+ devices. Ensure adequate ground planes and via stitching for signal integrity. Place decoupling capacitors as close as possible to the power pins.
The XCZU7EV-1FFVC1156E can dissipate significant power, especially when using high-speed transceivers and heavy programmable logic utilization. Use a heatsink and ensure adequate airflow in the system enclosure. Consider the thermal resistance of the package and the ambient temperature when designing the cooling solution.
Compliance Information
Compliance information not explicitly provided in the verified web data. Check AMD's official documentation for RoHS and REACH compliance details.
