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R5F74504KBG

R5F74504KBG - 240MHz SH-4A 32-Bit MCU | Renesas | Embedded

The Renesas Electronics R5F74504KBG is a 32-bit RISC microcontroller built around the high-performance SH-4A CPU core, with a maximum operating frequency of 240 MHz and CPU performance exceeding 432 MIPS. The device supports single- and double-precision floating-point arithmetic and is supplied in a 292-pin FBGA package. These characteristics position it for embedded multimedia, communications, industrial control, and other compute-intensive systems requiring a high-throughput 32-bit architecture. A microcontroller is a programmable system-on-chip that integrates a CPU core, memory, peripherals, and interface functions into one package. The SH-4A belongs to the RISC microcontroller hierarchy and combines a compact instruction set with a high clock rate. For the R5F74504KBG, this architecture supports demanding real-time control tasks while retaining a broad embedded peripheral integration. The verified product information identifies a maximum operating frequency of 240 MHz and performance above 432 MIPS. Single- and double-precision floating-point support accelerates mathematical workloads without requiring a separate numerical processor. This makes the MCU relevant to applications involving signal processing, multimedia data handling, graphics, control loops, and connected embedded equipment. The SH7450 and SH7451 groups share the R5F74504KBG family designation. Renesas positions the SH7450 and SH7451 devices as high-performance RISC microcontrollers. Their floating-point capabilities provide a clear distinction from fixed-point-only controllers, while the 240 MHz operating point supports workloads with demanding instruction throughput. Exact memory configuration, peripheral inventory, electrical limits, and operating-temperature boundaries must be confirmed in the manufacturer datasheet before a design is released. Typical application areas include industrial automation, network-connected embedded control, multimedia terminals, audio and signal processing, consumer equipment, and communications infrastructure. The processor performance is useful where deterministic control and floating-point computation must coexist, although firmware and system-level timing still require careful validation. Design planning should begin with the manufacturer pin assignment, supported memory interfaces, peripheral multiplexing, and clock requirements. Because this is a 292-pin FBGA device, careful PCB escape routing, controlled-impedance design, and adequate via and fanout planning are necessary. This page synthesizes verified family specifications, sourcing links, application guidance, and qualification limits for faster engineering review.

询价有现货

R5S72690W266FP#V0

R5S72690W266FP#V0 - SH7269 32-Bit MCU 266MHz 2.5MB SRAM 256-LQFP | Renesas

The Renesas Electronics R5S72690W266FP#V0 is a high-performance 32-bit microcontroller from the SH7268/SH7269 Group that integrates an SH2A-FPU core running at 266 MHz and 2.5 MB of on-chip SRAM in a 256-pin LQFP package. It is designed for industrial-grade applications with an operating temperature range of -20 °C to +85 °C and a single 3.0 V to 3.6 V supply rail. The device is supplied as ROMless, allowing external program memory and supporting large firmware images for graphics-rich embedded systems. A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit CPU core, RAM, peripherals, and interrupt logic. Within the broader taxonomy, the SH7269 belongs to the SuperH family of RISC microcontrollers -> embedded processor -> microcontroller -> integrated circuit. The SH2A-FPU core extends the original SuperH architecture with an integrated floating-point unit and dual-issue pipeline, delivering a significant performance uplift over earlier SH-2 cores for signal-processing workloads. Key features include 2.5 MB on-chip SRAM (1.7× the capacity of the prior SH7266), an SH2A-FPU 32-bit RISC core with hardware floating-point, and a 266 MHz maximum CPU clock. The 256-LQFP package with 0.8 mm pitch provides 133 I/O ports for ample connectivity, and integrated peripherals include DMA, POR, PWM, and a watchdog timer (WDT). The wide 17 mm × 17 mm body with 0.8 mm pitch supports PCB manufacturing at standard line/space rules. Technically, the SH7269 supports sub-clock (13.33 MHz) and main-oscillator modes for low-power standby and high-performance operation, and it embeds a TFT LCD controller suited for WVGA (800 × 480) displays. Hardware floating-point and dedicated DSP extensions make the core efficient at audio decoding and graphics rendering, while the 2.5 MB SRAM allows full-frame buffering without external memory. Typical applications include industrial human-machine interfaces (HMIs), audio processing equipment, TFT-LCD display controllers, motor control, factory automation controllers, and portable medical instrumentation. The combination of large SRAM and an FPU makes the SH7269 well suited to graphics and signal-processing tasks where external memory access would otherwise bottleneck performance. When designing with this device, allocate board space for the 256-LQFP footprint (17 × 17 mm) and provide a clean 3.3 V rail because the on-chip PLL is sensitive to supply noise. A 5.6 kΩ ±1 % reference resistor is required for USB PHY bias per the SH7268/SH7269 hardware manual. This page synthesizes distributor pricing, drop-in alternatives, and design considerations that go beyond the manufacturer datasheet, giving engineers a consolidated view for sourcing and second-sourcing decisions.

USD $24.00 有现货

R7F7010133AFP#KA4

R7F7010133AFP#KA4 - RH850/F1L 32-Bit 80MHz MCU 512KB Flash | Renesas

The Renesas R7F7010133AFP#KA4 is a 32-bit automotive microcontroller from the RH850/F1L series built on the RH850G3K core, delivering 80 MHz CPU performance with 512 KB of on-chip Flash and housed in a 64-pin LFQFP (10x10 mm) surface-mount package. It is positioned as a low-pin-count member of the RH850/F1x family targeted at chassis, body, and powertrain-adjacent ECUs where ASIL-B/D functional safety and CAN/LIN connectivity are required. What is an RH850 microcontroller? The RH850 is Renesas' 32-bit automotive RISC architecture designed around a multi-core, lockstep-capable pipeline with tightly coupled ECC-protected SRAM and hardware safety hooks (ECC, MBIST, voltage/clock monitors). It sits in the broader automotive MCU hierarchy as: automotive MCU -> 32-bit MCU -> RH850 family -> RH850/F1L sub-family. The RH850/F1L variant trades higher pin counts and larger Flash for cost-sensitive body and chassis applications. Key features include 512 KB of code Flash, 80 MHz maximum operating frequency, integrated CAN/LIN/UART communication peripherals typical of the F1L series, on-chip debugger support, and AEC-Q100 qualification. The 64-LFQFP (10x10) package offers a 0.5 mm pitch footprint suitable for reflow-compatible automotive PCB assembly. The R7F7010133AFP#KA4 uses the RH850G3K 32-bit RISC core with single-precision FPU support and a tightly coupled instruction/data memory hierarchy. Built on a low-power automotive process, the device integrates multiple analog and digital peripherals including 12-bit ADC, timers, and communication channels directly on-die, reducing external component count and BOM cost in body control modules. Typical applications include automotive body control modules (BCM), door/window/seat controllers, HVAC climate control, instrument cluster sub-MCUs, lighting ECUs, and small sensor-hub nodes in zonal architectures. The RH850/F1L is commonly co-deployed with a higher-pin-count F1K/F1M device for communication gateway or domain controller roles. When designing with this part, plan for an RH850-specific toolchain (Green Hills MULTI, IAR EW for RH850, or Renesas CS+) and the E1/E20/E2 emulator for debug. Verify pinout against the specific F1L datasheet revision because the F1L family has multiple Flash/RAM variants sharing the same 64-LFQFP outline. This page synthesizes verified distributor stock, parametric compatibility data, and practical design considerations for engineers evaluating the R7F7010133AFP#KA4 as a drop-in part or a fresh design selection.

USD $5.40 有现货

R7F7010283AFE#KA4

R7F7010283AFE#KA4 - RH850/F1L 32-Bit MCU, 768KB Flash, 144-LFQFP | Renesas

The Renesas R7F7010283AFE#KA4 is a 32-bit microcontroller from the RH850/F1L family built around the RH850G3K core, delivering 768 KB of embedded flash and packaged in a 144-pin LFQFP. The part is qualified for automotive chassis and body applications, supporting single-core operation up to 80 MHz with automotive-grade peripherals including CAN, LIN, and timer units optimized for motor control. A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/RAM), and programmable peripherals onto one silicon die. Within the broader semiconductor taxonomy, an MCU belongs to the embedded microcontroller family, which sits under microcontrollers -> microprocessors -> logic ICs -> integrated circuits -> semiconductors. The RH850/F1L series further specializes in automotive real-time control, offering lockstep cores, ECC flash, and functional-safety documentation for ASIL-B/D systems. Key features of this part include 768 KB code flash, 80 MHz maximum operating frequency, on-chip CAN/LIN/UART/SPI/I2C interfaces, 12-bit ADC, and a wide operating voltage range. The 144-LFQFP package exposes a generous pin count for parallel sensor acquisition and PWM outputs, which is essential for chassis domain controllers and integrated cockpit modules. ECC on flash and RAM supports ISO 26262 functional-safety targets. The RH850G3K core uses a 32-bit RISC architecture with hardware multiply/divide and a tightly coupled interrupt controller for deterministic low-latency response. Automotive peripherals include a Multi-Function Timer Pulse Unit (MTU-V7), A/D converter with scan-group support, and a hardware crypto accelerator on selected derivatives. Compared with generic Cortex-M parts, the RH850/F1L offers superior EMC tolerance and AEC-Q100 Grade 1/2 qualification. Typical applications include automotive body control modules (BCM), chassis ECUs such as ABS/ESC, electric power steering (EPS), and HVAC controllers. The integrated CAN FD interface and large pin count also suit gateway ECUs and zone architectures in modern vehicles. Designers value this part for its ASIL software library, hardware safety manual, and long-term automotive supply stability. Design consideration: at 80 MHz and full peripheral activity, supply current can reach tens of milliamperes; decoupling the four VDD/VSS pairs with 100 nF X7R ceramics within 3 mm of each pin pair is required. A 4.7 µF bulk cap on each analog/digital supply rail is recommended to suppress MCU-injected noise on ADC results. This page synthesizes distributor stock data, same-family RH850/F1L drop-in alternatives, and practical chassis-ECU design notes not bundled in the manufacturer datasheet, giving engineers a faster path to BOM selection and PCB bring-up.

USD $9.95 有现货

R7F7010323AFP

R7F7010323AFP - 32-bit 80MHz 768KB Flash Automotive MCU | Renesas

The Renesas R7F7010323AFP is a 32-bit RH850G3K RH850/F1L automotive microcontroller built around a 80MHz CPU core with 768KB of embedded flash memory and packaged in a 176-pin LFQFP (24x24 mm). It targets in-vehicle body applications with on-chip peripherals designed for CAN/LIN communication, motor control and sensor interfacing. An automotive microcontroller (MCU) is a ruggedized 32-bit microprocessor with tightly integrated flash, RAM, analog peripherals and communication interfaces qualified for the -40C to +125C automotive temperature range. The RH850 family uses a Harvard-style V850-derived core with multi-layer AHB bus, dedicated hardware for functional safety (ECC on flash/SRAM, lockstep, watchdog) and timers tuned for automotive PWM and capture. Within the broader hierarchy, the R7F7010323AFP sits at MCU -> microcontroller -> embedded processor -> semiconductor. Key features include 768KB program flash, 80MHz maximum CPU clock, integrated CAN/LIN/UART peripherals, multi-channel 12-bit ADCs, programmable timer arrays and hardware CRC. Memory protection, error correction code and a window watchdog support ISO 26262 functional safety integration. The 176-pin LFQFP package provides sufficient I/O count (typically >120 GPIO pins) and excellent thermal performance for body domain ECUs. Technical depth: the RH850G3K core uses a 32-bit RISC architecture with single-cycle multiply, hardware divide and tightly-coupled interrupt controller. The flash macro supports background programming and ECC single-bit correction with double-bit detection. The peripheral bus is split across AHB-Lite and APB bridges to balance DMA and CPU access latency. Power management integrates a low-power timer, standby RAM retention and multiple run/idle/stop modes for quiescent current reduction when the vehicle bus is asleep. Typical applications include body control modules, HVAC door-zone controllers, lighting ECUs, instrument clusters and gateway nodes where CAN-FD connectivity and ASIL-B functional safety are required. The on-chip motor timer/PWM blocks also support small BLDC and brushed-DC loads such as seat or mirror actuators. When designing with this part, plan the flash programming sequence against the 80MHz instruction budget and verify LIN/CAN transceivers separately. ECC initialization must be run before first code execution and the watchdog serviced in the locked window to remain ASIL-B compliant. This page synthesizes distributor pricing, same-family drop-in variants and practical design notes not found in the manufacturer datasheet.

USD $12.75 有现货

R7F7010323AFP#AA3

R7F7010323AFP#AA3 - 32-Bit 80MHz RH850/F1L 768KB MCU | Renesas

The Renesas R7F7010323AFP#AA3 is a 32-bit automotive microcontroller from the RH850/F1L product line, part of Renesas' RH850/F1x series designed specifically for in-vehicle body applications. The device is built on the RH850G3K core, executes instructions at up to 80 MHz, integrates 768 KB of on-chip Flash memory (768K x 8 organization), and is housed in a 176-pin LFQFP package measuring 24 x 24 mm. It targets automotive body electronic control units that demand high functional safety, real-time responsiveness, and robust electromagnetic compatibility. A microcontroller (MCU) is a single-chip computer containing a CPU, RAM, non-volatile program memory, and a rich set of peripherals such as timers, ADCs, communication controllers, and GPIO. The RH850 family extends this concept with a 32-bit RISC architecture, on-chip hardware safety mechanisms, and an ecosystem tuned for ASIL-D-capable automotive systems. Within that family, the F1L sub-series is the cost- and feature-optimized derivative for body applications such as body control modules, BCMs, HVAC controllers, lighting ECUs, door modules, and instrument clusters. It scales between 256 KB and 2 MB of Flash and comes in 48- to 176-pin packages, positioning F1L between the simpler F1K and the more feature-rich F1M/F1H/F1S variants. Key features of the R7F7010323AFP#AA3 include the RH850G3K core with hardware multiply/divide and DSP-style extensions, single-power-supply operation, on-chip debug and trace via the Renesas E1/E20 emulator, and a comprehensive motor-control timer (MTU3) plus GTM-compatible peripherals depending on sub-line. The device integrates multiple CAN and LIN/UART channels typical of body-domain networking, a 12-bit ADC with up to roughly two dozen channels, and a hardware security module with lock-bit Flash protection. Its 80 MHz core clock is supported by hardware CRC, ECC on critical memories, and self-diagnostic libraries. The R7F7010323AFP#AA3 is offered in the automotive-grade AEC-Q100 qualified temperature range, with ECC on SRAM and Flash to satisfy ASIL-B and, with software libraries, ASIL-D target systems. The 176-LFQFP package provides ample GPIO count for body-control functions with one or more LIN and CAN networks. Designers migrating from older RH850/F1x devices can preserve software compatibility while taking advantage of the larger 768 KB Flash region. Typical applications include body control modules, HVAC control units, automotive lighting ECUs, instrument clusters, and gateway/mid-end body-domain controllers. The combination of 80 MHz performance, 768 KB code space, and the F1L peripheral set makes the part well suited for OEM-grade body applications that require deterministic real-time response and long-term automotive reliability. When developing with this MCU, allocate the Flash budget such that bootloader, application code, and calibration data fit within 768 KB while leaving room for A/B swap or OTA staging. Use the hardware ECC features together with Renesas self-test libraries to satisfy ASIL targets. Lock-bit and access window protection should be enabled before locking the device for production.

USD $10.85 有现货

R7F7010333AFP#KA3

R7F7010333AFP#KA3 - RH850/F1L 32-Bit MCU, 1MB Flash, 176-LFQFP | Renesas

The Renesas R7F7010333AFP#KA3 is a 32-bit microcontroller from the RH850/F1L family, featuring a 1 MB on-chip Flash memory, 80 MHz CPU clock, and a 176-pin LFQFP (24x24 mm) package. Built on the RH850G3K core, it is designed for automotive body and chassis applications requiring high reliability, real-time control, and CAN/LIN communication peripherals. The device integrates a single-power-supply on-chip Flash, hardware security module, and timer/counter resources tuned for motor control and sensor interfacing. An automotive microcontroller (MCU) is a specialized microcontroller optimized for the harsh electrical and thermal environment of a vehicle. The RH850/F1L family sits within the broader Renesas RH850 family, which itself belongs to the 32-bit automotive MCU category — a segment that also includes Freescale/NXP MPC56xx, Infineon Aurix TC2xx, and Texas Instruments TMS570. RH850 cores are based on the V850E2M architecture extended with an FPU and lockstep dual-core options for ASIL-D applications. Key features of the R7F7010333AFP#KA3 include 1 MB of code Flash, 80 MHz maximum CPU clock, hardware multiplier and divider, multiple 16-bit timers, A/D converters, and a multi-channel CAN controller compliant with ISO 11898. The 176-pin LFQFP exposes the full peripheral set, supporting simultaneous operation of multiple serial interfaces and PWM outputs required in body control modules and HVAC systems. The RH850G3K core uses a 32-bit RISC architecture with 5-stage pipeline and hardware multiply-accumulate unit, delivering deterministic interrupt response. The on-chip Flash is single-voltage programmable and supports background operation (BGOP) and rewrite-in-rewrite without CPU stall — important for OBD-II compliant boot loaders. Typical applications include automotive BCM (body control modules), HVAC control, instrument clusters, electric power steering (EPS) sensor nodes, transmission ECUs, and battery management slaves. The automotive-grade temperature range and CAN connectivity make it well suited to chassis networks. Design consideration: when migrating from previous F1L variants, verify peripheral pinout mapping and ECLK/EMCLK clock source assignments against the user manual. The internal regulator requires careful VDD/VSS decoupling layout — at least four 0.1 µF X7R ceramic capacitors placed symmetrically around the package. This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the Renesas datasheet itself.

USD $8.12 有现货

R7F7016493AFP-C#BA1

R7F7016493AFP-C#BA1 - RH850/F1KM-S4 240MHz 4MB MCU | Renesas

The Renesas R7F7016493AFP-C#BA1 is a 32-bit automotive microcontroller from the RH850/F1KM-S4 group, integrating a single-core RH850G3KH CPU running at 240 MHz, 4 MB of on-chip Flash (4M x 8), and a 176-pin LFQFP package rated for +105 °C operation. It is positioned in the upper end of the RH850/F1K family and is widely used in automotive body and chassis ECUs. A 32-bit MCU (microcontroller) is a single-chip processor that integrates CPU core, volatile and non-volatile memory, peripherals, and analog interfaces on one die. The RH850 family is Renesas' mainstream automotive-grade 32-bit architecture built around a Harvard-style RISC core with hardware-assisted safety features. Within the family hierarchy, the RH850/F1KM-S4 sits under RH850/F1K -> RH850/F1x -> RH850 -> Renesas 32-bit automotive MCU. Compared with consumer-grade ARM Cortex-M MCUs, RH850 devices emphasize functional safety (lockstep, ECC, MPU) and automotive qualification to AEC-Q100. Key features include a 240 MHz core, 4 MB Flash with background operation support, 12-bit ADC, multiple CAN-FD controllers, LIN/UART/SPI/I2C, PWM timers for motor control, and integrated safety mechanisms such as ECC on Flash/SRAM, watchdog timers, and a memory protection unit. The wide supply range 3.0 V to 5.5 V makes it tolerant of automotive 12 V battery transients when paired with a system-basis chip. Architecturally, the RH850/F1KM-S4 uses the RH850G3KH core with variable-length instructions, dedicated DSP extensions, and a low-latency interrupt controller. The 4 MB Flash uses dual-bank layout to support in-field firmware updates without downtime. The 176-pin LFQFP exposes the full peripheral set including up to 6 CAN channels, multiple SENT interfaces, and motor-control PWMs. Typical applications include automotive body control modules (BCM), power sliding doors, tailgate/liftgate controllers, seat control units, and electric power steering (EPS) peripherals. It is also used in HVAC blowers and lighting ECUs where real-time deterministic control and AEC-Q100 qualification are required. When designing with this part, budget enough PCB area for the 176-pin LFQFP and route all decoupling capacitors close to VDD/VSS pairs. Plan firmware size with headroom for OTA-capable dual-bank operation and reserve one CAN-FD channel for diagnostics. This page synthesizes distributor availability across Mouser, DigiKey, Octopart, and LCSC, plus a Renesas cross-reference result and a comparison with other RH850/F1KM members, to help sourcing engineers quickly qualify substitutes and confirm pin/pin replacements.

USD $11.05 有现货

R7F7016844AFP-C#BA1

R7F7016844AFP-C#BA1 - 32-bit 120MHz 3MB Flash Automotive MCU | Renesas

The Renesas R7F7016844AFP-C#BA1 is a 32-bit single-core automotive microcontroller from the RH850/F1KM-S1 family, operating at up to 120 MHz on the RH850G3KH CPU core, with 3 MB of embedded flash memory, housed in a 100-pin LFQFP (14 x 14 mm) package and qualified to AEC-Q100 for automotive use. A microcontroller (MCU) is a single-chip integrated circuit that combines a processor core, memory, and peripherals into one device, forming the lowest tier of embedded processing hierarchy: MCU -> embedded processor -> application processor -> semiconductor. The RH850/F1KM-S1 group is a member of the RH850/F1x series, which Renesas designed specifically for automotive electrical body applications such as body control modules, chassis systems, and gateway nodes. Key features of this device include the 120 MHz RH850G3KH single-core CPU, 3 MB (3M x 8) on-chip flash memory for code storage, an integrated CAN FD interface for modern in-vehicle networking, and low power consumption typical of the F1KM family. Package options across the F1KM-S1 series span 48 to 100 pins, with flash densities from 512 KB to 3 MB, allowing designers to scale a single design across multiple cost tiers. The RH850 architecture provides automotive-grade functional safety support, and the AEC-Q100 qualification ensures reliability over the automotive temperature range. The CAN FD peripheral enables higher data throughput than classical CAN while preserving backward compatibility with existing vehicle networks. Typical applications include automotive body control units, chassis control units, door modules, lighting control, and driver assistance support nodes. The combination of 3 MB flash and CAN FD makes this part suitable for software-rich body domain controllers. Design consideration: verify the exact flash density and option-byte suffix (#BA1 vs #AA1) against the Renesas datasheet before layout, as family members share the same footprint but differ in memory. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

USD $9.20 有现货

R7F7016903AFP-C

R7F7016903AFP-C - 32-Bit MCU 120MHz 1MB Flash | Renesas

The R7F7016903AFP-C is a high-end automotive microcontroller from Renesas Electronics, part of the RH850/F1KM-S1 series, designed for body control applications. It features a 32-bit RH850G3KH CPU core running at up to 120 MHz, with 1MB (1M x 8) of internal flash memory and 64-LFQFP (10x10) package. This MCU is engineered for low power consumption while delivering robust performance for automotive electrical body systems. A microcontroller (MCU) is a compact integrated circuit designed to govern a specific operation in an embedded system. It contains a processor core, memory (flash and RAM), and programmable input/output peripherals. In the automotive domain, MCUs like the RH850/F1KM-S1 series are essential for body control modules, gateway modules, and motor control, providing real-time control and communication capabilities. The RH850/F1x series is a family of 32-bit automotive microcontrollers from Renesas, known for their high reliability and functional safety features. Key features of the R7F7016903AFP-C include a 120 MHz RH850G3KH core, 1MB flash memory, and a 64-pin LFQFP package. It supports a wide operating temperature range of -40°C to +125°C, making it suitable for harsh automotive environments. The device is AEC-Q100 qualified, ensuring compliance with automotive quality standards. It also includes a variety of communication interfaces such as CAN, LIN, and SPI, enabling seamless integration into vehicle networks. Technically, the RH850/F1KM-S1 series is built on Renesas' advanced 40nm process technology, offering a balance of performance and power efficiency. The MCU features a floating-point unit (FPU) for enhanced mathematical processing, and a memory protection unit (MPU) for safety-critical applications. It also supports on-chip debugging and flash programming, facilitating development and field updates. Typical applications include automotive body control modules (BCM), central gateway modules, and motor control for power windows, seats, and mirrors. The MCU's robust communication interfaces and low power consumption make it ideal for always-on systems in vehicles. When designing with this MCU, ensure proper decoupling of power supply pins and consider thermal management for high-temperature environments. The 64-LFQFP package requires careful PCB layout to minimize noise and ensure reliable operation.

USD $12.00 有现货

R7FA6M2AF3CFP#AA0

R7FA6M2AF3CFP#AA0 - 120MHz Arm Cortex-M4 MCU, 1MB Flash, 100-LFQFP | Renesas

The Renesas R7FA6M2AF3CFP#AA0 is a 32-bit microcontroller from the RA6M2 group, integrating an Arm Cortex-M4 core with FPU and DSP extensions running at 120 MHz, 1 MB of flash memory and 384 KB of SRAM, housed in a 100-pin LFQFP (14x14 mm) package. According to Renesas product page data, the device combines Ethernet MAC with DMA, USB 2.0 Full-Speed, CAN FD, and a 12-bit ADC, targeting connected industrial and IoT edge nodes. An Arm Cortex-M4 microcontroller is a 32-bit MCU class member of the ARM Cortex-M family, characterized by a Harvard architecture, hardware single-precision floating-point unit, DSP extensions, deterministic interrupt handling via NVIC, and low power modes. Within the hierarchy, Cortex-M4 sits between Cortex-M3 (no FPU) and Cortex-M7 (higher performance); the broader family lineage covers Cortex-M0/M0+/M3/M4/M7/M23/M33, and ultimately belongs to the semiconductor > integrated circuit > microcontroller > 32-bit MCU > ARM-based MCU product type tree. Key specifications of this part include a 120 MHz maximum CPU clock, 1 MB code flash, 384 KB SRAM, a 12-bit A/D converter with multiple channels, Ethernet MAC, USB 2.0 FS, CAN FD, multiple serial interfaces (SCI/SPI/I2C), and a wide operating voltage range typically from 2.7 V to 3.6 V. According to the Renesas RA6M2 group datasheet, this device also features security extensions, capacitive touch sensing, and a low-power RTC. The R7FA6M2AF3CFP#AA0 is built on a low-power CMOS process and uses the Armv7E-M architecture with a 3-stage pipeline. Its integration of Ethernet and USB on-chip reduces external component count for connected products. The peripheral set is software- and pin-compatible with other RA6 series devices, enabling scalability across the Renesas RA family platform. Typical applications include industrial sensor hubs, building automation controllers, IoT edge gateways with Ethernet, HMI panels, and motor-control auxiliary MCUs. The Ethernet MAC plus CAN FD combination supports Industry 4.0 nodes bridging fieldbus and corporate networks. When designing with this device, ensure the 100-LFQFP land pattern is properly cooled via copper pour; the on-chip Ethernet PHY interface requires a reference clock and magnetics. Use Renesas e2 studio IDE and the RA Flexible Software Package (FSP) for firmware development. This page synthesizes distributor pricing, parametric tables, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate and source the R7FA6M2AF3CFP#AA0 for production designs.

USD $7.45 有现货

R7FS3A37A3A01CFM#BA0

R7FS3A37A3A01CFM#BA0 - 48MHz Cortex-M4 512KB Flash MCU | Renesas

The Renesas R7FS3A37A3A01CFM#BA0 is a 32-bit ARM Cortex-M4 microcontroller from the Synergy S3A3 platform group, integrating 512 KB of flash memory and 96 KB of SRAM, housed in a 64-pin LFQFP (10x10 mm) package. Operating at up to 48 MHz, the part belongs to the S3A3 MCU group optimized for portable medical and fitness devices with smart connected sensors, balancing low power consumption with Cortex-M4 class performance including single-precision FPU and DSP extensions. What is a Synergy S3A3 MCU? The Renesas Synergy Platform is a complete embedded solution combining microcontrollers, software APIs, and development tools. The S3 series represents the mainstream tier; the S3A3 sub-group targets low-power connected IoT endpoints. As a microcontroller (MCU), this device is a system-on-chip containing CPU, memory, and peripherals on a single die. MCUs hierarchically sit within microcontrollers -> embedded processors -> semiconductors -> integrated circuits. The Cortex-M4 core supports the Thumb-2 instruction set and is tailored for deterministic real-time control in resource-constrained applications. Key features of the R7FS3A37A3A01CFM#BA0 include 512 KB on-chip flash (512K x 8 organization), 96 KB SRAM (96K x 8 organization), 48 MHz maximum CPU clock, integrated single-precision FPU, and a rich peripheral set spanning multiple serial interfaces, timers, and ADC channels typical of the Synergy S3A3 group. The 64-LFQFP package provides an exposed pad option, simplifying PCB thermal dissipation for industrial-grade operation across the -40C to +105C temperature range. Architecturally, the S3A3 leverages ARM Cortex-M4 with hardware acceleration for DSP and floating-point math, paired with Renesas proprietary peripheral IP shared across the Synergy family for code portability. The flash/SRAM ratio favors embedded applications requiring larger firmware images but modest working memory, suiting connected sensor hubs and HMI subsystems. Typical applications span portable medical and fitness devices, smart connected sensor nodes, industrial IoT endpoints, low-power wireless gateways, consumer health monitors, and battery-powered HMI panels. The combination of low active power, Cortex-M4 performance, and the Synergy software ecosystem shortens time-to-market for connected embedded products. When designing with this MCU, verify the LFQFP-64 land pattern matches your PCB footprint and ensure the Synergy Software Package (SSP) version is compatible with your toolchain. For migration to pin-compatible variants, check the same-family MPNs in the alternatives section below. This page synthesizes distributor stock data, parametric specifications, drop-in alternatives from the same Synergy S3A3 family, and practical design considerations not consolidated on a single manufacturer page.

USD $3.32 有现货

R7S721000VCFP#AA1

R7S721000VCFP#AA1 - ARM Cortex-A9 RZ/A1H 400MHz MPU | Renesas

The Renesas R7S721000VCFP#AA1 is a high-performance ARM Cortex-A9 microprocessor from the RZ/A1H family, featuring a single 32-bit core running at 400 MHz, 10 MB of on-chip SRAM, and housed in a 256-pin LQFP package measuring 28x28 mm. The device targets embedded human-machine interface (HMI) and graphics applications where external memory bus design and procurement are major pain points for product longevity. A microprocessor (MPU) is an integrated circuit that integrates a CPU core, memory controllers, and a rich set of peripheral interfaces onto a single die. The RZ/A1H belongs to the broader taxonomy of application processors (CPU core -> application processor -> microprocessor -> embedded processing IC -> semiconductor), sitting above microcontrollers (MCUs) by combining higher CPU frequency with extensive multimedia-oriented peripherals. The on-chip 10 MB SRAM eliminates the need for external SDRAM, simplifying PCB layout and BOM for compact HMI designs. Key features of the RZ/A1H include dual-display support up to WXGA resolution (1280x800), integrated 2D graphics accelerator, parallel camera interface for image sensor input, hardware JPEG codec, and a wide range of connectivity peripherals including USB 2.0 Host/Function, Ethernet MAC, I2C, SPI, and UART. The single-core Cortex-A9 at 400 MHz delivers approximately 1.0 DMIPS/MHz while keeping power consumption compatible with industrial temperature ranges. The device architecture pairs the Cortex-A9 core with 32 KB instruction and 32 KB data L1 caches, plus a NEON SIMD engine and a Floating Point Unit (FPU). Its internal bus matrix (AXI/AHB/APB) routes traffic to memory and peripherals with low latency. The 10 MB on-chip SRAM is organized for frame buffer use, supporting two simultaneous displays without external DRAM. Typical applications include industrial HMI panels, building automation touchscreens, medical patient interface displays, home appliance control panels, point-of-sale (POS) terminals, and portable information terminals. The combination of graphics, camera, and rich connectivity peripherals makes the RZ/A1H ideal for any design that needs a crisp visual interface without external memory complexity. When designing with this MPU, ensure the PCB thermal pad and power rails deliver stable 3.3 V core/IO supply with adequate decoupling. Designers should reserve sufficient PCB area for the 256-pin LQFP fanout and follow Renesas reference designs to avoid signal-integrity issues on high-speed display and memory interfaces. This page synthesizes distributor pricing, drop-in alternatives drawn from the same RZ/A1 family, and practical design notes not collected in a single place on the manufacturer datasheet, giving engineers an immediate snapshot for sourcing and reuse.

USD $25.40 有现货

R7S721021VCFP#AA1

R7S721021VCFP#AA1 - RZ/A1L 400MHz ARM Cortex-A9 MPU 3MB SRAM

The Renesas R7S721021VCFP#AA1 is an ARM Cortex-A9 microprocessor from the RZ/A1L group, operating at 400 MHz with 3 MB of on-chip SRAM, packaged in a 208-pin LFQFP (28x28 mm). Designed for compact embedded designs, it integrates rich peripherals including Ethernet, USB 2.0 host/function, CAN, LIN, SCI, SPI, I2C, UART, and an external bus interface, and is ROMless so external flash is required for code storage. A microprocessor (MPU) is an integrated circuit containing a full CPU core plus system logic, distinguished from a microcontroller (MCU) by higher processing throughput, external memory addressing, and complex peripheral integration. The RZ/A1L sits in the hierarchy: MPU -> application processor -> SoC -> RISC ARM Cortex-A family -> Renesas RZ/A1L product line. With 3 MB of embedded SRAM, the part targets graphical HMI applications where eliminating external DRAM reduces BOM cost and EOL risk. Key features of the R7S721021VCFP#AA1 include single-core 32-bit ARM Cortex-A9 at 400 MHz, 3 MB on-chip SRAM, integrated TFT LCD controller supporting up to 2x WVGA (800x480) or one WSVGA (1024x600) display, 10/100 Ethernet MAC, USB 2.0 host/function with PHY, multiple CAN/LIN/SPI/I2C interfaces, 12-bit ADC, timers, PWM, real-time clock, and watchdog timer. Architecture-wise, the Cortex-A9 core is paired with NEON SIMD and a dual-issue pipeline. The 3 MB unified SRAM can serve as frame buffer and code execution area without external DRAM, lowering system cost. The integrated TFT LCD controller with hardware-accelerated 2D graphics (raster engine) simplifies HMI design. Typical applications include industrial HMI panels, building automation control displays, home appliances with graphical UI, point-of-sale terminals, and medical device interfaces. The chip's high memory bandwidth plus display controller make it suited for graphics-rich embedded products. When designing, note that this is a ROMless device, so external NOR/NAND flash is mandatory. Power sequencing and decoupling per the Renesas hardware manual are critical for reliable boot. Use the Renesas e2studio IDE and Smart Configurator for pin and clock setup. This page synthesizes distributor stock status, drop-in alternatives, thermal/PCB guidance, and pricing benchmarks from multiple sources - engineering content complementing the manufacturer datasheet.

USD $16.35 有现货

RA8T2

RA8T2 - 1GHz Arm Cortex-M85 Motor Control MCU | Renesas

The Renesas RA8T2 is a high-performance ASSP microcontroller featuring a 1 GHz Arm Cortex-M85 core paired with a 250 MHz Arm Cortex-M33 core, up to 1 MB of code MRAM, and 2 MB of SRAM with ECC, engineered specifically for industrial motor control applications requiring high real-time performance and high-precision control. A microcontroller (MCU) is a single-chip integrated circuit that combines a processor core, memory, and peripherals to execute dedicated control tasks. Within the hierarchy of embedded processors, the RA8T2 sits at the top of Renesas' RA family of Arm-based MCUs, above general-purpose Cortex-M4/M33 parts, and competes with high-end digital signal controllers in the industrial automation domain. Key features include over 7,000 CoreMark performance enabled by an advanced 22 nm process, advanced-function PWM and high-resolution PWM timers for precise motor drive waveforms, and high integration with a Layer 3 Ethernet Switch Module, USB 2.0 Full-Speed, CAN FD, SDHI, I3C, and Octal SPI with decryption on-the-fly. MRAM code storage provides fast, reliable non-volatile memory with high endurance compared to conventional Flash. Technically, the dual-core architecture separates high-speed field-oriented control (FOC) loops on the 1 GHz Cortex-M85 from communication stacks and supervisory tasks on the 250 MHz Cortex-M33, delivering deterministic real-time behavior. Hardware ECC on the 2 MB SRAM and functional-safety-oriented peripherals support demanding industrial equipment requirements. Typical applications include industrial servo drives, brushless DC (BLDC) and permanent magnet synchronous motor (PMSM) control, robotics, and high-end factory automation equipment where sub-microsecond control-loop latency is essential. EtherCAT-class industrial networking is supported via the Ethernet switch module. Design consideration: choose the correct speed-grade orderable part number (e.g., 1 GHz vs 600 MHz variants such as R7KA8T2LFLCAB#UC0 vs R7KA8T2AFECAB#BC1) and validate thermal design at full 1 GHz operation, as 22 nm high-frequency operation demands attention to power dissipation and PCB thermal relief. This page synthesizes distributor data, datasheet highlights, orderable-part variants, and practical design guidance not consolidated in the manufacturer datasheet alone.

询价有现货

RC28F128P33B85B

RC28F128P33B85B - 128Mbit NOR Flash, 52MHz, 85ns, 64-EasyBGA | Intel/Altera

The Intel/Altera RC28F128P33B85B is a 128-Mbit parallel NOR Flash memory device organized as 8M x 16, built on Intel's StrataFlash Embedded Memory technology and housed in a 64-ball EasyBGA (8x10 mm) package. It supports 2.5V/3.3V dual-voltage operation, offers 52 MHz CFI (Common Flash Interface) read throughput with 85 ns initial access time, and provides hardware-accelerated 33-bit ECC for reliable code and data storage. A NOR Flash memory is a non-volatile storage technology that provides random read access at byte or word granularity, in contrast to NAND Flash which is read in large pages. NOR Flash retains code directly executable in-place (XIP), making it the historical choice for boot ROM, firmware storage, and embedded systems where deterministic read latency matters. Within the memory hierarchy, NOR Flash sits above NAND Flash and below SRAM/DRAM, trading higher density for fast random reads and long-term data retention. Key features of the RC28F128P33B85B include 128 Mbit (16 Mbyte) density, x16 data bus, Common Flash Interface (CFI) for vendor-independent identification, 33-bit hardware ECC, and a uniform 64-Kbyte symmetric block architecture with configurable read-while-write (RWW) capability. The P33 process technology delivers lower power consumption and faster program/erase times than earlier Numonyx/Intel P30 devices. This part supports simultaneous read-while-write operations, allowing the host CPU to fetch instructions from one bank while another bank is being programmed or erased. The EasyBGA-64 (8x10 mm) package offers a compact footprint suitable for space-limited embedded designs while exposing the full multiplexed address/data bus needed for legacy parallel interfaces. Typical applications include embedded boot ROM for networking equipment, industrial control firmware storage, automotive telematics and infotainment code storage, and legacy parallel-interface designs that require deterministic read latency. The 52 MHz synchronous burst-read mode also enables higher-throughput data streaming. When designing with this device, ensure the host platform supports the legacy CFI query protocol and the 33-bit hardware ECC engine for production-grade reliability. Designers transitioning from older Numonyx/Intel P30 devices must verify pinout compatibility, as the EasyBGA ball map differs from earlier TSOP packaging. This page synthesizes distributor pricing from LCSC, DigiKey Marketplace and Octopart, drop-in package-compatible alternatives from the same P33 family, and practical design considerations not consolidated in the manufacturer datasheet.

USD $1.10 有现货

RH4Z2501BJ3GNM#HD0

RH4Z2501BJ3GNM#HD0 - IO-Link PHY Transceiver | Renesas

The Renesas RH4Z2501BJ3GNM#HD0 is a single-channel IO-Link physical layer master/device transceiver with enhanced protection, housed in a 12-pin DFN (3x3 mm) package with the #HD0 tape-and-reel suffix. It functions as a line driver and level shifter IC for IO-Link communication, integrating push-pull output drivers with RDS(ON) below 2.5 ohm and tolerating supply voltage transients up to 60 V. The part supports both IO-Link master and device roles, making it suitable for sensor/actuator nodes and master-side communication. An IO-Link physical layer (PHY) transceiver is a dedicated interface IC that implements the IEC 61131-9 single-drop digital communication interface for industrial sensors and actuators. The PHY sits between the microcontroller UART/IO-Link stack and the 3-wire sensor cable (L+, L-, CQ), handling 24 V line drive levels, reverse-polarity protection, surge suppression, and the 8 mA / 16 mA / 24 mA current-sinking modes defined by the IO-Link standard. It belongs to the hierarchy: IO-Link PHY -> industrial transceiver -> interface IC -> integrated circuit -> semiconductor. Key features include configurable CQ output stages (push-pull, high-side, low-side), integrated reverse-polarity blocking on the supply pin, 60 V transient robustness on L+, an OWI (One-Wire Interface) configuration channel for parameter storage, and CMOS mixed-signal technology that supports 4.5 V to 30 V supply operation. The 12-DFN package offers a compact 3x3 mm footprint for space-constrained sensor heads. The RH4Z2501 includes internal protection features that simplify the external TVS/Schottky network typically required by IO-Link designs: over-temperature shutdown, under-voltage lockout, and reverse-polarity handling. The OWI channel allows the MCU to write configuration and identification data to on-chip non-volatile memory during end-of-line commissioning. Typical applications include IO-Link sensor signal conditioning in factory automation, IO-Link master communication modules, 24 V industrial valve and actuator drivers, and PLC digital I/O cards implementing single-drop IO-Link ports. When designing with this part, place the decoupling capacitor (10 V on L+) as close to the pin as possible and keep the CQ trace short to minimize radiated EMI. Configure the OWI address during manufacturing only - do not reconfigure OWI in the field without a controlled procedure. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the RH4Z2501BJ3GNM#HD0 that are not found in the manufacturer datasheet alone.

USD $2.91 有现货

RK3168

RK3168 - Dual-Core Cortex-A9 SoC | Rockchip | Mobile/Embedded

The Rockchip RK3168 is a low-power, high-performance dual-core ARM Cortex-A9 SoC for smartphones, tablets, personal mobile internet devices, and digital multimedia applications. The RK3168 integrates two Cortex-A9 cores with separate NEON and FPU coprocessors, a PowerVR SGX540 GPU clocked at 400 MHz, and a hardware video decoder supporting up to 1080p H.264/MJPEG/VC-1/MPEG-4, all in a low-power BGA package. A SoC (System-on-Chip) is an integrated circuit that consolidates CPU cores, GPU, video codecs, display controllers, and peripheral interfaces on a single silicon die. Within the broader taxonomy, the RK3168 belongs to the application processor family, sitting between a microcontroller (no display/multimedia capability) and a full multimedia SoC. The Cortex-A9 microarchitecture places the RK3168 in the mid-2010s generation of ARMv7 application processors, which succeeded the Cortex-A8 and was later overtaken by Cortex-A53/A55 designs. Key features include dual-core 1.2 GHz Cortex-A9 with out-of-order execution, PowerVR SGX540 graphics, integrated HDMI/LVDS display controllers, USB 2.0 OTG, MIPI CSI camera interface, multiple SDIO/EMAC/SD card controllers, and a hardware crypto block. The SoC is fabbed on a low-power process with typical smartphone power dissipation below 1 W, enabling fanless designs in tablets and set-top boxes. Architecturally, the RK3168 uses a dual-core Cortex-A9 with NEON SIMD for media acceleration and a separate VPU (Video Processing Unit) that offloads 1080p decode from the CPU. This hardware partitioning delivers the multimedia performance of higher-priced application processors while maintaining the power profile of mobile devices. The SGX540 GPU provides OpenGL ES 2.0 and OpenVG 1.1 support suitable for 3D UI and casual gaming. Typical applications include Android smartphones and tablets in the 7-10 inch class, Miracast/dongle wireless display adapters, low-cost media players and set-top boxes, in-vehicle infotainment (IVI) systems, and industrial HMI panels. The Miracast reference design (RK3168 + Wi-Fi companion chip) became a $10 retail adapter form factor in 2013. When designing with this part, ensure the PCB stack-up meets the BGA escape routing requirements and provide adequate thermal relief on the package substrate. Designers should pair the RK3168 with LPDDR2 or DDR3 memory validated by Rockchip's hardware reference manual to avoid boot issues. This page synthesizes distributor pricing, datasheet details, and Rockchip family alternatives not available on a single manufacturer datasheet, helping procurement engineers and engineering teams source the part with confidence.

USD $5.10 有现货

RK3288

RK3288 - Quad-Core Cortex-A17 SoC | Rockchip | BGA-636

The Rockchip RK3288 is a low-power, high-performance 32-bit quad-core application processor built around four ARM Cortex-A17 cores with a separately clocked NEON SIMD coprocessor and an ARM Mali-T764 GPU, packaged in a 636-ball BGA. It is designed for mobile phones, personal mobile internet devices (PMID), and other digital multimedia applications, integrating CPU, GPU, multimedia, memory controller, and peripheral I/O into a single SoC. A quad-core application processor (AP) is a system-on-chip that integrates multiple CPU cores, a graphics processor, memory interfaces, display controllers, and standard peripherals (USB, SDIO, I2C, SPI, UART, Ethernet, HDMI, LVDS, MIPI) on a single die. In a system architecture, the AP sits between power management ICs (PMICs), DRAM (LPDDR2/LPDDR3/DDR3), and the display/camera subsystems. The RK3288 belongs to a broader family of Rockchip ARM APs and is part of the Cortex-A17 generation that targeted Android tablets, set-top boxes, Chromebooks, and digital signage during the mid-2010s. Key features include quad-core ARM Cortex-A17 up to 1.8 GHz, Mali-T764 GPU with OpenGL ES 3.1 support, hardware-accelerated 4K H.264/H.265 video decode, HDMI 2.0 output up to 4K@60Hz, dual-channel 32-bit LPDDR3/DDR3/LPDDR2 interface, MIPI DSI and LVDS display outputs, USB 2.0, SD/MMC, eMMC 5.0 support, and integrated audio codec with SPDIF/I2S. The chip supports Android 5.x/6.x and Linux kernels, making it a versatile multimedia AP for consumer and embedded OEMs. The RK3288 uses a 28 nm HKMG CMOS process, which balances performance with reasonable power consumption. Its quad-core Cortex-A17 out-of-order design delivers significantly higher single-threaded performance than the Cortex-A9 predecessor (RK3188) and enables efficient multitasking. The Mali-T764 GPU supports modern graphics APIs, while the 4K hardware codec block offloads video decode from the CPU cores. Typical applications include Android tablets, Chromebooks, digital signage, smart home control panels, set-top boxes, industrial HMI terminals, and embedded kiosks. Designers choose the RK3288 when they need a mature quad-core Cortex-A17 SoC with strong multimedia capabilities and broad Linux/Android BSP support. When designing with the RK3288, pay attention to PCB layout for the BGA-636 footprint - it requires microvia / HDI PCB technology for reliable BGA escape routing. Thermal management is critical because the SoC can dissipate 2 to 5 W under full CPU+GPU+4K decode load. Use a multi-layer PCB with a continuous ground plane under the BGA and provide adequate copper thermal relief around the package. Validate the PMIC compatibility (e.g., RK808 or ACT8846 family) and DRAM timing margins before committing to volume production. This page synthesizes distributor pricing, drop-in same-package Rockchip SoC variants, application pairings, and practical PCB/system design notes not typically consolidated in the manufacturer datasheet.

USD $11.25 有现货

RK3368

RK3368 - Octa-Core 64-bit ARM Cortex-A53 SoC | Rockchip

The Rockchip RK3368 is a low-power, high-performance 64-bit application processor integrating an octa-core ARM Cortex-A53 CPU cluster with separately clocked NEON coprocessors and an ARM Mali-T720MP2 GPU, targeted at smart TV boxes, OTT streaming devices, set-top boxes, and personal mobile internet devices. The part is manufactured in a 28 nm HPC process, supports up to 1.5 GHz core frequency, integrates 4K H.265/H.264 hardware decoding, HDMI 2.0 output up to 4K@60 Hz, and dual-channel DDR3/DDR3L/LPDDR2/LPDDR3 memory controllers. The RK3368 ships in a 19 mm x 19 mm BGA-453 package (0.8 mm pitch) and is specified for commercial-grade operation at 0 C to +80 C ambient. What is an application processor SoC? An application processor SoC (System-on-Chip) integrates the CPU, GPU, memory controller, video decoder/encoder, display pipeline, and connectivity peripherals onto a single silicon die. In the broader taxonomy: SoC -> application processor -> microprocessor unit (MPU) -> semiconductor. Rockchip positions the RK3368 in its 64-bit octa-core family below the RK3399 (big.LITTLE A72+A53) and above the entry-level RK3328 (quad-core A53). Key features include 64-bit ARMv8 instruction set with full AArch64 execution, hardware H.265 Main Profile decoding up to 4K@60 Hz with H.265 Main10 support, OpenGL ES 3.1 / OpenCL 1.2 capable Mali-T720MP2 GPU running at up to 600 MHz, USB 2.0 host and OTG ports, Gigabit Ethernet MAC, and a flexible VOP (Video Output Processor) supporting HDMI 2.0, eDP, and MIPI-DSI. The integrated Cortex-A53 cores provide 2-3x the performance-per-watt of the previous-generation Cortex-A7 used in the RK3288. The RK3368 architecture uses a single homogeneous octa-core cluster with coherent L2 cache, simplifying software scheduling compared to big.LITTLE designs. The 28 nm process keeps idle power low, while the integrated LPDDR3 controller with 32-bit width and 800 MHz clock provides up to 6.4 GB/s memory bandwidth suitable for 4K video decode. Typical applications include 4K Android TV boxes, OTT streaming sticks, smart signage players, industrial HMI panels, and education tablets. The Cortex-A53's power efficiency also makes the part suitable for fanless enclosures. Design consideration: the RK3368 requires careful 4-layer or 6-layer PCB stack-up with matched-length DDR3 traces and a robust PMIC (RK806 or compatible). LPDDR3 routing demands 100 ohm differential impedance; deviations will cause read/write errors at high temperatures. This page synthesizes distributor pricing, drop-in Rockchip alternatives (same BGA-453 family where applicable), and design notes not consolidated in the public RK3368 datasheet.

USD $5.45 有现货

RMLV0816BGSD-4S2

RMLV0816BGSD-4S2 - 8Mb Low-Power SRAM 512Kx16 45ns TSOP | Renesas

The Renesas RMLV0816BGSD-4S2 is an 8-Mbit Advanced Low-Power Static RAM organized as 524,288-word x 16-bit (512K x 16), fabricated on Renesas' high-performance Advanced LPSRAM process technology. The device is offered in a 52-pin TSOP-II package and delivers 45 ns parallel access time, making it suitable for low-power embedded systems that require fast random read/write cycles. An LPSRAM (Low-Power SRAM) is a class of asynchronous static random-access memory that retains data without refresh and is optimized for ultra-low standby current consumption. LPSRAMs occupy a distinct position in the memory hierarchy: faster than NOR flash, lower pin-count than DRAM (no refresh controller required), and dramatically lower quiescent current than legacy SRAM - typically in the microamp range. They are widely used as working RAM, data buffers, and backup-memory companions to MCUs in industrial and consumer designs. Key features of the RMLV0816BGSD-4S2 include a single 2.7 V to 3.6 V supply, 45 ns address access time, fully static asynchronous operation (no clock required), TTL-compatible I/O, three-state outputs, and an operating temperature range of -40 C to +85 C for the industrial grade variant. The device supports byte-wise control via /LB and /UB pins for 8-bit/16-bit flexible access, plus standard /CS, /OE, and /WE control signals. Advanced LPSRAM technology achieves low standby current while maintaining fast access, suitable for battery-backed applications. Architecturally, the RMLV0816BGSD-4S2 employs a 6-transistor (6T) CMOS memory cell array with on-chip sense amplifiers and self-timed write circuitry. The advanced LPSRAM process allows smaller cell size while preserving the low-leakage characteristics that define the family. Internal address latches and a common I/O bus enable efficient 8-bit (byte) and 16-bit (word) access without external logic. Typical applications include industrial controls, factory automation PLCs, networking line cards, portable instrumentation, medical devices, POS terminals, and any battery-backed data-logging system requiring reliable byte-wide or word-wide buffering. Designers often pair this LPSRAM with low-power MCUs such as Renesas RX or RA families for energy-harvesting or sleep-mode designs. A key design consideration is the decoupling strategy: place a 0.1 uF ceramic bypass capacitor within 5 mm of the VCC pin and a 10 uF bulk capacitor on the supply rail. Avoid driving the I/O bus faster than the rated access time to prevent bus contention during read/write transitions. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

USD $2.50 有现货

RMLV0816BGSD-4S2#AC0

RMLV0816BGSD-4S2#AC0 - 8Mb Advanced LPSRAM | Renesas | TSOP-II 52

The Renesas RMLV0816BGSD-4S2#AC0 is an 8-Mbit advanced low-power static RAM organized as 524,288-word × 16-bit (or 1M × 8), fabricated on Renesas's high-performance Advanced LPSRAM process. The device operates from a single 2.4V to 3.6V supply, provides 45 ns access time, and ships in a 52-pin TSOP-II surface-mount package. It is part of the RMLV0816BGSD family aimed at embedded systems that need byte-wide or word-wide battery-backed memory. A low-power SRAM (LPSRAM) is a type of volatile static random-access memory that retains data without refresh cycles and consumes very low standby current, making it the preferred choice for battery-powered or always-on subsystems. Within the broader memory hierarchy, LPSRAM sits between small on-chip MCU SRAM and larger DRAM, filling the role of fast, byte-addressable working memory. Compared to DRAM, LPSRAM eliminates the need for periodic refresh, simplifies board design, and improves immunity to bit errors caused by particle hits, at the cost of lower density per die. Key features of the RMLV0816BGSD-4S2 include a wide 2.4V–3.6V single-supply range, 45 ns access time, byte-control via UB#/LB# pins for x16 operation, support for x8 / x16 bus width selection, and very low standby current. The 52-TSOP II footprint is the industry-standard pinout for 8-Mbit word-wide SRAM, allowing it to replace legacy parallel SRAMs from Cypress, ISSI, and Alliance on existing PCB layouts. The Advanced LPSRAM cell technology keeps active current low while delivering fast read/write cycles for data logging or boot-loader scratchpad use. Internally, the die uses a six-transistor (6T) SRAM cell with CMOS I/O, including a chip-enable (CE#), write-enable (WE#), output-enable (OE#), and upper/lower byte select (UB#/LB#) for flexible bus sizing. The wide voltage range is achieved through on-chip charge-pump-free regulation, so no external VCCQ or VPP rail is required. The 45 ns access time is sufficient for direct connection to most microcontrollers and low-end microprocessors without wait-state insertion at ≤33 MHz, which covers typical MCU-class applications. Typical applications for the RMLV0816BGSD-4S2 include industrial control data buffers, metering and instrumentation scratch memory, networking router packet buffers, automotive infotainment working memory, and battery-backed data retention when paired with an external supercapacitor or coin cell. The wide 2.4V–3.6V range also suits USB, Bluetooth, and Zigbee module working memory. When designing with this part, ensure that decoupling (0.1 µF + 10 µF bulk) is placed within 5 mm of VCC, and respect the data retention voltage (typically 2.0V) if you intend to operate from a battery backup rail. UB# and LB# must be tied low for full 16-bit access; leaving them floating introduces bus contention and increases standby current. This page synthesizes Renesas datasheet parameters, distributor pricing as of 2026-10-10, same-package Renesas drop-in alternatives, and cross-package notes not found in the manufacturer datasheet.

USD $3.78 有现货

RMWV3216AGBG-5S2#AC0

RMWV3216AGBG-5S2#AC0 - 32Mb Advanced LPSRAM, 2Mx16, 55ns | Renesas

The Renesas Electronics RMWV3216AGBG-5S2#AC0 is a 32-Mbit Advanced Low-Power SRAM (LPSRAM) organized as 2,097,152 words × 16 bits, fabricated in Renesas's high-performance Advanced LPSRAM CMOS technology. It is offered in a 48-ball TFBGA package measuring 7.5 mm × 8.5 mm, operates from a single 2.7 V to 3.6 V supply, and delivers a 55 ns fast access time in parallel mode. The I-temperature grade (-40 °C to +85 °C) makes it suitable for industrial environments. An LPSRAM (Low-Power SRAM) is a class of asynchronous static random-access memory that retains data without refresh and offers dramatically lower active and standby current than conventional SRAM. LPSRAM sits in the broader memory hierarchy between volatile DRAM (which needs refresh and is dense) and true non-volatile memory (Flash/EEPROM, which is slow to write). Within Renesas's portfolio, Advanced LPSRAM targets battery-backed and energy-harvesting applications where every microwatt of quiescent current matters, while still delivering the byte-level random access that Flash cannot. Key features include very low standby current for battery-backup retention, a wide 2.7 V to 3.6 V single-rail supply range that simplifies power-tree design, common parallel SRAM interface pinout (CS, OE, WE, UB/LB byte enables) for drop-in replacement of legacy async SRAMs, and 3-STATE outputs for bus-sharing. The 48-ball TFBGA footprint is also substantially smaller than TSOP or SOJ packaging used by older 32-Mbit parallel SRAMs. Technically, the device uses a six-transistor (6T) CMOS memory cell array with on-chip address decoding and sense amplifiers, plus internal voltage generation for the memory core. The die is organized as 2M × 16 with separate upper-byte and lower-byte write enables (UB, LB), which simplifies 8-bit and 16-bit bus designs in the same socket. Power-saving features include automatic power-down when CS is deselected, plus data-retention modes down to 2.0 V for coin-cell backup. Typical applications include industrial metering and data loggers, factory automation controllers, point-of-sale terminals, automotive infotainment buffers, medical handheld instruments, networking line cards requiring fast read/write buffers, and battery-backed equipment such as e-meter or PLC retentive memory. The low standby current makes it attractive as a shadow RAM for systems that must preserve state through power loss. When designing with this part, follow the datasheet's decoupling guideline of a 0.1 µF ceramic capacitor placed within 5 mm of each VCC ball, plus a bulk 10 µF tantalum or ceramic on the supply rail. Place the device close to the host controller to keep the address/data bus traces short, since the 55 ns access time assumes modest capacitive loading. This page synthesizes distributor pricing and stock, drop-in alternative comparisons across Renesas's own RMWV3216A speed-grade family and competing 48-ball TFBGA LPSRAMs, and practical design notes not consolidated in the manufacturer datasheet.

USD $2.65 有现货

RS512M16Z2DD-62DT

RS512M16Z2DD-62DT - 8Gbit DDR4 SDRAM 512Mx16 | Rayson

The Rayson RS512M16Z2DD-62DT is a high-performance DDR4 SDRAM (Double Data Rate Fourth Generation Synchronous Dynamic Random-Access Memory) device organized as 512M words by 16 bits, providing a total density of 8Gbit. It operates at a data rate of 3200 Mb/s/pin (DDR4-3200) with a CAS latency of 22, and is housed in a compact FBGA-96 package measuring 7.5x13 mm. This memory component is designed for mission-critical applications in industrial automation, telecommunications, edge computing, and embedded systems that require robust memory performance across extended temperature ranges. DDR4 SDRAM is the fourth generation of double data rate synchronous dynamic random-access memory, succeeding DDR3. It achieves higher speed and lower power consumption through a prefetch of 8n, a lower operating voltage of 1.2V, and improved signal integrity features such as on-die termination (ODT) and write leveling. DDR4 is a key component in modern computing systems, serving as the main memory for processors, and is also used in networking equipment, servers, and high-performance embedded designs. Key features of the RS512M16Z2DD-62DT include an operating temperature range of 0°C to +95°C, a supply voltage of 1.14V to 1.26V for VDD and 2.375V to 2.75V for VDDQ, and a clock frequency of 1.6GHz. It supports auto self-refresh, auto precharge, asynchronous reset, data mask, CRC, dynamic on-chip termination, ZQ calibration, and write leveling functions. These features ensure reliable operation and data integrity in demanding environments. The device utilizes advanced DDR4 architecture with a 16-bit I/O interface, enabling high-bandwidth data transfer. The FBGA-96 package provides excellent thermal and electrical performance, with a ball pitch that supports high-density PCB routing. The 512Mx16 organization is ideal for applications requiring large memory capacity with a moderate bus width, balancing density and pin count. Typical applications include industrial automation controllers, telecommunications infrastructure, edge computing gateways, and embedded systems that require high-speed, reliable memory. The wide temperature range and robust feature set make it suitable for harsh environments where standard commercial memory might fail. When designing with this DDR4 device, ensure proper termination and signal integrity practices are followed, including controlled impedance traces and appropriate on-die termination settings. The ZQ calibration pin must be connected to a 240-ohm resistor to ground for proper calibration.

USD $30.80 有现货

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