RS512M16Z2DD-62DT - 8Gbit DDR4 SDRAM 512Mx16 | Rayson
料号： RS512M16Z2DD-62DT ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $42.44 | $42.44 |
| 10 | $38.2 | $382.00 |
| 100 | $34.2 | $3,420.00 |
| 500 | $32.5 | $16,250.00 |
| 1,000 | $30.8 | $30,800.00 |
RS512M16Z2DD-62DT 概述
DDR4 SDRAM is the fourth generation of double data rate synchronous dynamic random-access memory, succeeding DDR3. It achieves higher speed and lower power consumption through a prefetch of 8n, a lower operating voltage of 1.2V, and improved signal integrity features such as on-die termination (ODT) and write leveling. DDR4 is a key component in modern computing systems, serving as the main memory for processors, and is also used in networking equipment, servers, and high-performance embedded designs.
Key features of the RS512M16Z2DD-62DT include an operating temperature range of 0°C to +95°C, a supply voltage of 1.14V to 1.26V for VDD and 2.375V to 2.75V for VDDQ, and a clock frequency of 1.6GHz. It supports auto self-refresh, auto precharge, asynchronous reset, data mask, CRC, dynamic on-chip termination, ZQ calibration, and write leveling functions. These features ensure reliable operation and data integrity in demanding environments.
The device utilizes advanced DDR4 architecture with a 16-bit I/O interface, enabling high-bandwidth data transfer. The FBGA-96 package provides excellent thermal and electrical performance, with a ball pitch that supports high-density PCB routing. The 512Mx16 organization is ideal for applications requiring large memory capacity with a moderate bus width, balancing density and pin count.
Typical applications include industrial automation controllers, telecommunications infrastructure, edge computing gateways, and embedded systems that require high-speed, reliable memory. The wide temperature range and robust feature set make it suitable for harsh environments where standard commercial memory might fail.
When designing with this DDR4 device, ensure proper termination and signal integrity practices are followed, including controlled impedance traces and appropriate on-die termination settings. The ZQ calibration pin must be connected to a 240-ohm resistor to ground for proper calibration.
直接替换替代料： RS512M16Z2DD-62DT ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MT40A512M16TB-062E
✓ 有现货
$60 / 个
查看数据手册 →K4A8G165WC-BCRC
✓ 有现货
$23 / 个
查看数据手册 →H5AN8G6NCJR-VKC
✓ 有现货
$60 / 个
查看数据手册 →MT40A512M16JY-075E
✓ 有现货
$30.5 / 个
查看数据手册 →K4A8G165WB-BCWE
✓ 有现货
$6.55 / 个
查看数据手册 →RS512M16Z2DD-62DT 最大额定值与电气特性
| 存储器类型 | DDR4 SDRAM |
| 存储组织 | 512M x 16 |
| Total Density | 8 Gbit |
| 数据速率 | 3200 Mb/s/pin |
| CAS 延迟 | 22 |
| tRCD (min) | 13.75 ns |
| tRP (min) | 13.75 ns |
| tRAS (min) | 32 ns |
| tRC (min) | 45.75 ns |
| tCK (min) | 0.625 ns |
| 工作温度范围 | 0°C to +95°C |
| Supply Voltage (VDD) | 1.14V to 1.26V |
| Supply Voltage (VDDQ) | 2.375V to 2.75V |
| Clock Frequency | 1.6 GHz |
| 封装 | FBGA-96 (7.5x13 mm) |
| RoHS 状态 | Compliant |
RS512M16Z2DD-62DT 引脚配置
| 引脚 A1 | VDD — Power supply |
| 引脚 A2 | DQ0 — Data input/output 0 |
| 引脚 A3 | DQ1 — Data input/output 1 |
| 引脚 A4 | VSS — Ground |
| 引脚 A5 | DQ2 — Data input/output 2 |
| 引脚 A6 | DQ3 — Data input/output 3 |
| 引脚 A7 | VDD — Power supply |
| 引脚 A8 | DQ4 — Data input/output 4 |
| 引脚 A9 | DQ5 — Data input/output 5 |
| 引脚 A10 | VSS — Ground |
| 引脚 A11 | DQ6 — Data input/output 6 |
| 引脚 A12 | DQ7 — Data input/output 7 |
| 引脚 B1 | VDDQ — Power supply for output buffers |
| 引脚 B2 | DQ8 — Data input/output 8 |
| 引脚 B3 | DQ9 — Data input/output 9 |
| 引脚 B4 | VSSQ — Ground for output buffers |
| 引脚 B5 | DQ10 — Data input/output 10 |
| 引脚 B6 | DQ11 — Data input/output 11 |
| 引脚 B7 | VDDQ — Power supply for output buffers |
| 引脚 B8 | DQ12 — Data input/output 12 |
| 引脚 B9 | DQ13 — Data input/output 13 |
| 引脚 B10 | VSSQ — Ground for output buffers |
| 引脚 B11 | DQ14 — Data input/output 14 |
| 引脚 B12 | DQ15 — Data input/output 15 |
典型应用
RS512M16Z2DD-62DT 适用于 6 应用s: Industrial Automation, Telecommunications, Edge Computing, Embedded Systems, Networking Equipment, Server and Storage.
Industrial Automation
The RS512M16Z2DD-62DT provides high-density, high-speed memory for industrial controllers and PLCs. Its 8Gbit capacity and DDR4-3200 speed enable fast data processing and real-time control. The 0°C to +95°C temperature range ensures reliable operation in factory environments. With features like CRC and write leveling, it maintains data integrity in noisy industrial settings. It can be paired with industrial-grade microcontrollers like STM32F767BGT6 for control logic.
推荐
Telecommunications
In telecommunications infrastructure, the RS512M16Z2DD-62DT offers the bandwidth and reliability needed for network processing. Its 3200 Mb/s/pin data rate supports high-throughput packet processing and buffering. The auto self-refresh and dynamic on-chip termination features help maintain signal integrity in high-speed systems. It is suitable for use in routers, switches, and base stations, where consistent performance is critical. Companion devices like the XC7Z020 FPGA can manage data flow.
推荐
Edge Computing
Edge computing devices require high-capacity, low-latency memory to process data locally. The RS512M16Z2DD-62DT's 8Gbit density and DDR4-3200 speed enable efficient handling of AI inference and data analytics at the edge. Its wide temperature range supports deployment in outdoor or remote locations. The device's low power consumption (1.2V VDD) is beneficial for power-constrained edge nodes. It can be paired with processors like the STM32MP1 series for compute-intensive tasks.
推荐
Embedded Systems
For embedded systems requiring large memory footprints, the RS512M16Z2DD-62DT provides 8Gbit of DDR4 in a compact FBGA-96 package. Its 512Mx16 organization is ideal for applications needing high density with a moderate bus width. The device supports features like data mask and asynchronous reset, which are useful in embedded designs. It operates reliably over 0°C to +95°C, making it suitable for various embedded applications. It can be used with MCUs like the STM32F429IIT6 for high-performance embedded designs.
推荐
Networking Equipment
Networking equipment such as routers and switches require high-speed memory for packet buffering and forwarding tables. The RS512M16Z2DD-62DT's 3200 Mb/s/pin data rate and 8Gbit capacity provide ample bandwidth and storage. Its CRC and write leveling features ensure data integrity in high-speed data paths. The FBGA-96 package allows for compact board designs. It can be paired with network processors or FPGAs like the XC7A100T for data plane processing.
推荐
Server and Storage
In server and storage applications, the RS512M16Z2DD-62DT provides high-density, high-speed memory for caching and buffering. Its 8Gbit capacity and DDR4-3200 speed enable fast data access and improved system performance. The device's low power consumption helps reduce overall system power. It is suitable for use in entry-level servers, network attached storage (NAS), and storage arrays. It can be used with server-class processors or high-performance MCUs like the STM32H743BGT6.
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推荐产品汇总
工程参考数据： RS512M16Z2DD-62DT ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MT40A512M16TB-062E | K4A8G165WC-BCRC | H5AN8G6NCJR-VKC |
|---|---|---|---|---|
| Package | FBGA-96 (7.5x13) | FBGA-96 (7.5x13) | FBGA-96 (7.5x13) | FBGA-96 (7.5x13) |
| Brand | Rayson | Micron | Samsung | SK Hynix |
| Memory Density | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Data Rate | 3200 Mb/s/pin | 3200 Mb/s/pin | 3200 Mb/s/pin | 3200 Mb/s/pin |
| CAS Latency | 22 | 22 | 22 | 22 |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| Supply Voltage (VDD) | 1.14V to 1.26V | 1.14V to 1.26V | 1.14V to 1.26V | 1.14V to 1.26V |
关键差异点
- Higher data rate than some alternatives （对比 MT40A512M16JY-075E)
- Wide temperature range （对比 K4A8G165WB-BCWE)
- Cost-effective alternative to major brands （对比 MT40A512M16TB-062E)
设计说明
For DDR4 routing, maintain controlled impedance of 40-50 ohms for single-ended signals and 80-100 ohms differential for DQS and clock pairs. Keep trace lengths matched within +/- 0.5mm for data and address/command groups. Use ground planes beneath the memory area to minimize noise and ensure signal integrity.
Decouple VDD and VDDQ with 0.1uF and 1uF ceramic capacitors placed as close as possible to each power pin. Use a 10uF bulk capacitor near the memory power input. Ensure the power supply can handle transient currents during refresh and active operations. Follow the datasheet's power-up sequence requirements.
The RS512M16Z2DD-62DT operates up to +95°C, but ensure adequate airflow or heatsinking in high-temperature environments. The FBGA-96 package has a thermal resistance that benefits from a solid ground plane and thermal vias. Monitor junction temperature to avoid exceeding the maximum rating.
合规信息
RoHS compliant per LCSC and JLCPCB listings. No AEC-Q100 qualification for this memory component.
