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UCC5320 - 4.3A Isolated Gate Driver | Texas Instruments
The Texas Instruments UCC5320 is a 4.3A single-channel isolated gate driver with 3-kVRMS or 5-kVRMS reinforced isolation, supporting MOSFET, IGBT, SiC MOSFET, and GaN FET switching in SOIC-8 (D) or wide-body SOIC-8 (DWV) packages. It features split output (UCC5320S variant) or emitter-referenced UVLO options for safe gate drive of power transistors in switching power supply and motor drive designs. A galvanically isolated gate driver is a gate drive circuit that uses an isolation barrier (capacitive or magnetic) to separate the low-voltage control domain (PWM logic, MCU) from the high-voltage power domain (MOSFET/IGBT gate). Isolation gate drivers sit in the power management IC hierarchy: isolated gate driver > gate driver > driver IC > power management IC. Their primary role is to break ground loops, provide level shifting, and protect low-voltage controllers from high-voltage transients propagated by rapidly switching power devices. The UCC5320 delivers up to 4.3A peak source and 4.5A peak sink gate drive current, with a wide drive supply range of 9.5V to 33V on the secondary side. The split output variant (UCC5320S) independently controls turn-on and turn-off currents, allowing designers to tailor switching loss and EMI. Internal undervoltage lockout referenced to GND2 ensures gate drive signals are only produced once the driver supply is healthy. The device is rated for -40C to +150C junction temperature. Architecturally, the UCC5320 uses TI's capacitive isolation technology to achieve 3-kVRMS (D package) or 5-kVRMS (DWV package) basic or reinforced isolation. The wide-body DWV package is intended for reinforced isolation per IEC 60747-17/VDE 0884-11. Internal common-mode transient immunity (CMTI) exceeds 100 kV/µs, ensuring reliable operation in noisy motor drive and Class-D audio amplifier environments. The basic isolation D variant shares the same pinout with the reinforced DWV variant, enabling PCB layout reuse between isolation grades. Typical applications include industrial motor drives (AC motor, BLDC, PMSM), photovoltaic string inverters, isolated DC-DC converters, EV traction inverters, and Class-D audio amplifiers. The split output variant is particularly valuable in motor drives where controlled dV/dt via gate resistance tuning is critical to manage EMI and switching loss. The wide 9.5V to 33V secondary supply range also allows direct drive of SiC MOSFETs requiring 18V gate drive. When designing with this device, ensure adequate decoupling on both primary (VDD1, 3V to 5.5V) and secondary (VDD2, 9.5V to 33V) supplies with 0.1 µF ceramic capacitors placed as close to the IC as possible. The split output (UCC5320S) needs separate turn-on and turn-off gate resistors if independent rise/fall time control is desired. Verify creepage and clearance on the PCB layout for the DWV package to achieve the rated 5-kVRMS reinforced isolation. This page synthesizes current distributor pricing, drop-in same-family alternatives, application circuit notes, and design considerations beyond the manufacturer datasheet, helping engineers select and source the right UCC5320 variant for their isolated gate drive needs.
UCC5350-Q1 - 10A Isolated Gate Driver | TI | SiC/IGBT/MOSFET
The Texas Instruments UCC5350-Q1 is a single-channel, automotive-qualified isolated gate driver with 10 A source and 10 A sink typical peak output current, housed in an 8-pin SOIC (D) package with 3 kVRMS basic isolation. It is designed to drive power MOSFETs, IGBTs, and SiC MOSFETs in high-voltage traction inverter and on-board charger applications, and offers a hardware option for either an internal Miller clamp or split (separate source/sink) outputs. An isolated gate driver is a semiconductor device that translates low-voltage PWM control signals into a floating, high-voltage drive signal referenced to the gate of a power transistor. Isolated gate drivers sit in the signal chain between a low-voltage controller (MCU, DSP, or digital isolator) and the gate of a high-side or low-side power switch, and they form part of the broader power management hierarchy: gate driver -> driver IC -> isolated driver -> isolated power stage. Capacitive-isolation techniques, as in the UCC5350-Q1, replace optocouplers to deliver lower part-to-part skew, lower propagation delay, higher CMTI, and improved automotive temperature performance. Key features include 5 A minimum source/sink peak current (10 A typical), 3 kVRMS reinforced isolation, 100 V/ns minimum CMTI, propagation delay below 100 ns, and a 8 V to 18 V VDD drive supply range. The Miller-clamp variant integrates a low-impedance path that prevents parasitic turn-on during high dv/dt transients, while the split-output variant gives the gate-drive circuit independent control of turn-on and turn-off impedance for tunable EMI and switching loss. The device integrates a TI proprietary capacitive isolation barrier based on silicon-dioxide capacitors, achieving >30 year isolation barrier life and 5 kVRMS transient withstand. Input-to-output channel matching and minimal pulse-width distortion make the UCC53553 well suited to closed-loop current-control topologies such as field-oriented control (FOC) of traction inverters, where phase-edge timing accuracy directly impacts torque ripple and acoustic noise. Typical applications include EV traction inverters, on-board chargers (OBC), DC fast-charging station power modules, solar/string inverters, industrial motor drives, and server/telecom SMPS. AEC-Q100 Grade 1 qualification (–40C to +125C) and functional-safety-capable design files (TI documents FMEDA) make it well suited to ASIL-rated safety functions such as inverter over-current protection. When designing with the UCC5350-Q1, place a 1 uF VDD bypass capacitor within 2 mm of the IC and use a 4.7 uF to 10 uF bulk capacitor on the VCC supply. Add a gate-source resistor of 10 kohm to prevent floating-gate leakage during MCU reset, and follow PCB layout rules that keep the input-side and output-side grounds separate (single-point star ground at the isolation barrier). This page synthesizes distributor pricing, AEC-Q100-qualified same-package drop-in alternatives, and practical gate-drive design notes not found on stock distributor listings.
UCC5390ECD - 10A Isolated Gate Driver, 3kVrms, 8-SOIC | TI
The Texas Instruments UCC5390ECD is a single-channel, isolated gate driver rated for 10 A source and 10 A sink output current, with 3 kVrms basic isolation (5 kVrms option on the family), housed in an 8-pin SOIC (D) package. It is designed for high-performance MOSFETs, IGBTs, SiC MOSFETs, and GaN FETs in switching power topologies such as motor drives, solar inverters, and on-board EV chargers. An isolated gate driver is a critical power-management component that sits between a low-voltage control controller (microcontroller, FPGA, or DSP) and a high-voltage power transistor. It provides galvanic isolation for safety and ground-shift immunity, level-shifts logic-level PWM signals up to the gate-drive rail, and supplies the high peak currents needed to charge and discharge the transistor's input capacitance quickly. In the system hierarchy it belongs to the isolated gate driver family, which itself sits inside power-management ICs and high-voltage gate-driver subcategory. Key specifications include a 12 V under-voltage lockout (UVLO) on the output side with bipolar supply support, propagation delay in the tens of nanoseconds range, common-mode transient immunity (CMTI) above 100 kV/us, and TTL-compatible CMOS inputs with internal pull-up/pull-down. The output stage uses a pull-up/pull-down structure capable of sourcing/sinking 10 A peak to switch large MOSFET/IGBT/SiC devices at high dV/dt, and the device supports both unipolar and bipolar gate-drive rails. Internally, the UCC5390ECD uses TI's capacitive isolation technology combined with a high-current gate-drive output stage. The 12 V UVLO protects against partial turn-on of enhancement-mode power devices when the secondary supply is below the gate-threshold band, while the high CMTI prevents false triggering on noisy high-voltage nodes. Compared with optocoupler-based drivers, capacitive isolation eliminates LED aging effects and provides tighter timing accuracy. Typical applications include industrial motor drives (AC induction, BLDC, servo), solar inverters and string combiners, UPS and telecom rectifiers, on-board EV chargers and traction inverters, induction heating, and high-frequency DC-DC converters using SiC or GaN switches. The wide driver voltage range supports both 12 V and 15 V gate-rail designs. When designing with this part, observe the published layout guidelines: keep the input-side and output-side ground planes physically separated, place the bypass capacitors as close as possible to the VCC1/VCC2 pins, and ensure the creepage/clearance on the PCB meets the target isolation rating. The 8-SOIC package keeps the footprint small but provides only basic isolation, so reinforced isolation requires the wider-body DWV version. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
UCC5390ECDR - 10A Isolated Gate Driver, 3kVrms, SOIC-8 | TI
The Texas Instruments UCC5390ECDR is a single-channel isolated gate driver with 10A/10A source/sink drive capability, 3 kVRMS basic isolation, and a 12V UVLO option, housed in an 8-pin SOIC (D) package. It uses TI's capacitive coupling isolation technology to provide robust switching for high-performance MOSFETs, IGBTs, and SiC MOSFETs in demanding power-conversion applications. An isolated gate driver is a specialized driver IC that provides both galvanic isolation and high-current drive signals to the gate of a power semiconductor. It sits hierarchically between a low-voltage PWM controller (signal-level logic) and a high-voltage power switch (MOSFET/IGBT/SiC), combining the functions of an isolation barrier (replacing optocouplers or pulse transformers) and a high-peak-current gate driver. Without it, a logic-level MCU cannot safely or directly switch a high-current power FET that may switch hundreds of volts. Key features include 10A peak source and 10A peak sink output current, 3 kVRMS basic isolation rating per UL 1577, common-mode transient immunity (CMTI) of 100 kV/us minimum, and an 8-pin SOIC (D) footprint with 0.7 mm creepage. The split output stage (separate OUTH and OUTL pins) allows independent turn-on and turn-off strength tuning, and the device supports bipolar supply operation up to +18/-13 V for IGBT and SiC applications. The 12V UVLO references GND, while the part also carries safety certifications including UL 1577 and VDE 0884-11. The UCC5390 uses TI's integrated capacitive isolation barrier with on-chip modulation/demodulation, eliminating the current-driven optocoupler lifetime concerns of LED-based isolators. Its split output topology lets the designer add discrete source/sink resistors to optimize dV/dt and EMI, which is critical when driving SiC MOSFETs at >50 V/ns to keep switching losses low. Typical applications include solar string inverters, industrial motor drives, telecom and server power supplies, and EV onboard chargers. The 3 kVRMS rating suits 400V/600V/650V DC-link systems; the bipolar supply capability is critical for SiC MOSFETs that need a negative gate-off voltage to avoid spurious turn-on from high dV/dt. When designing with this part, treat creepage/clearance on the PCB as the primary safety constraint. Above 1.5 kVRMS the SOIC-8 needs at least 4 mm side-to-side trace spacing and the inner PCB layers must be routed away from the isolation barrier to meet IEC 62368-1 reinforced isolation reinforcement. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
UCC5880-Q1 - Isolated 20A Adjustable SiC/IGBT Gate Driver | TI
The Texas Instruments UCC5880-Q1 is an isolated, highly configurable 20A adjustable drive-strength gate driver designed to drive high-power SiC MOSFETs and IGBTs in automotive EV/HEV applications. Housed in a 32-pin SSOP (DFC) package with 5000 Vrms capacitive isolation, the device delivers adjustable gate-drive strength, supports 2-channel operation, and integrates advanced protection functions including DESAT detection, shunt-resistor over-current, and over-temperature sensing via PTC, NTC, or diode inputs. What is an isolated gate driver? An isolated gate driver is a power-management interface IC that provides galvanic isolation between a low-voltage control domain (MCU, DSP, or FPGA) and a high-voltage power-transistor stage (IGBT, SiC MOSFET, or GaN FET). Compared with non-isolated gate drivers, isolated gate drivers - including the UCC5880-Q1 - use capacitive or magnetic barriers to block high-voltage transients, allowing the control circuit to float at a separate domain and enabling directly-referenced gate drive for high-side switching in half-bridge and full-bridge power stages. They sit in the broader hierarchy of gate driver IC -> power management IC -> semiconductor IC. The UCC5880-Q1's adjustable drive-strength feature lets the system engineer tune the gate-source current for the specific switching speed required, mitigating EMI and ringing without external gate resistors. Built-in protection includes programmable soft turn-off or two-level soft turn-off during DESAT and over-current faults, plus over-temperature shutdown, dramatically reducing the burden on the host MCU. Functional Safety-Compliant design and AEC-Q100 qualification make the UCC5880-Q1 attractive for traction inverters, onboard chargers, and DC-DC converters in xEV platforms. Internal 32-SSOP package, tight parameter specification, and TI's reference design TIDT356 (HybridPACK IGBT module driver) demonstrate mature field readiness. Typical applications include traction inverter power stages using SiC MOSFETs, EV onboard chargers, and industrial servo drives. The UCC5880-Q1 also serves in DC fast-charging station PFC stages, where galvanic isolation is mandated between control and power stages. Its high drive strength eliminates external buffer stages on 1200V-class SiC discrete modules, simplifying layout. Design tip: pair the UCC5880-Q1 with the TI LM5180-Q1 isolated bias supply to build a complete isolated gate-drive bias rail in the TIDT356 HybridPACK reference design. Adjust drive strength via SPI/registers to match the target MOSFET's Qg. This page synthesizes distributor availability, drop-in alternatives (notably the pin-to-pin-compatible UCC5881-Q1), and design notes beyond the TI datasheet, helping engineers choose validated second sources for automotive production ramps.
UCC5881-Q1 - 20A Isolated SiC/IGBT Gate Driver | Texas Instruments
The Texas Instruments UCC5881-Q1 is an automotive-grade, isolated 20 A adjustable gate driver designed to drive high-power SiC MOSFETs and IGBTs in EV/HEV traction inverter applications. It integrates capacitive isolation rated at 5000 Vrms and is offered in a 32-pin SSOP (DFC) package with exposed thermal pad. The device provides real-time variable drive strength via an SPI-programmable interface, allowing designers to tune gate current profiles for each switching event. An isolated gate driver is a power-semiconductor interface IC that combines galvanic isolation with high-current gate drive capability, allowing a low-voltage controller to safely command a high-voltage power switch. Isolated gate drivers sit hierarchically between gate drivers and isolated power modules; in EV traction inverters they bridge the 12 V domain MCU and the 400 V or 800 V DC bus, enabling functional-safety-compliant drive of SiC MOSFETs and IGBTs at MHz-class switching frequencies. Key features include 14 selectable DESAT leading-edge blanking settings, 5 DESAT deglitch filter settings, and 16 DESAT threshold settings for configurable short-circuit protection. The device also integrates shunt-resistor-based over-current detection, over-temperature sensing (PTC, NTC, or diode), two-level soft turn-off during faults, an integrated 10-bit ADC, and ASIL-compliant diagnostics. Compared with the predecessor UCC5880-Q1, the UCC5881-Q1 adds more DESAT configurability and an INT_COMM fault filter while remaining pin-to-pin compatible. Technically, the UCC5881-Q1 uses TI's proprietary capacitive-isolation technology to deliver 5000 Vrms reinforced isolation. The 20 A adjustable drive strength reduces switching losses by up to 80 percent versus fixed-strength drivers, and the integrated ADC enables closed-loop temperature and current telemetry directly to the MCU. Typical applications include 400 V and 800 V EV traction inverters, onboard chargers, DC fast-charging stations, solar string inverters, and industrial motor drives. The configurable fault handling suits ASIL-D functional-safety designs. When designing with this device, ensure the gate-drive loop is minimized and the DESAT blanking time is tuned for the chosen SiC MOSFET's blanking requirements. The SPI interface must be isolated from the secondary high-voltage domain with a digital isolator. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet, providing engineering information for EV powertrain and renewable-energy power-conversion designers.
UCD3138 - Digital Controller for Isolated Power | Texas Instruments
The Texas Instruments UCD3138 is a highly integrated digital power supply controller designed for isolated power conversion applications. It features three feedback loops and eight DPWM outputs, enabling precise digital control of complex power topologies such as LLC, phase-shifted full-bridge, and active clamp forward converters. The device operates from a 3.3V supply and is available in a 40-pin VQFN (6x6 mm) package, offering a compact solution for high-density power systems. A digital power controller is a specialized microcontroller that implements control algorithms in firmware rather than analog circuitry. It combines high-speed analog-to-digital converters (ADCs), digital pulse-width modulators (DPWMs), and a programmable state machine to regulate output voltage and current with high accuracy. In the power management hierarchy, the UCD3138 sits between the power stage (MOSFETs, transformers) and the system supervisor, providing closed-loop regulation and communication with a host processor. Key features of the UCD3138 include three independent feedback loops with dedicated error ADCs, eight DPWM outputs with 250 ps resolution, and an integrated ARM7TDMI-S processor core running at 31.25 MHz. The device also includes a 12-bit, 2 MSPS ADC for monitoring input/output voltages and currents, as well as PMBus and UART interfaces for telemetry and configuration. These features enable adaptive control, fault management, and efficiency optimization in real time. Technically, the UCD3138 employs a digital control architecture that replaces analog compensators with firmware-implemented PID or 2-pole/2-zero filters. This allows for advanced features such as feed-forward, nonlinear gain, and cycle-by-cycle current limiting. The device supports multiple communication protocols, including PMBus, which simplifies system integration and remote monitoring. Its flexible DPWM configuration supports interleaved and phase-shifted operation, making it suitable for multi-phase and bridge topologies. Typical applications include server and telecom power supplies, AC-DC adapters, and isolated DC-DC converters. The UCD3138 is particularly well-suited for high-efficiency, high-density designs where digital control enables precise regulation and fast transient response. For example, in a 1.5 kW LLC resonant converter, the UCD3138 can manage burst mode and light-load efficiency improvements. When designing with the UCD3138, careful attention must be paid to the analog front-end filtering and DPWM output buffering to minimize noise coupling. The device requires a clean 3.3V supply and proper decoupling on the VDDA and VDD pins. Additionally, firmware development is essential, as the control loop parameters must be tuned for the specific power stage.
UCD90160ARGCT - 16-Rail PMBus Sequencer & Monitor | Texas Instruments
The Texas Instruments UCD90160ARGCT is a 16-rail PMBus/I2C addressable power supply sequencer and system health monitor with ACPI support, housed in a 64-pin VQFN (RGC) 9x9 mm package. It samples all 16 voltage rails every 400 µs using a 12-bit ADC with a 2.5 V, 0.5% internal reference, supports up to four programmable undervoltage and overvoltage thresholds per monitor, and operates from a 3 V to 3.6 V supply with typical quiescent current of 50 mA. A power supply sequencer is a programmable controller that supervises the turn-on and turn-off order, voltage margin, and fault response of multiple DC rails in a complex system such as a server, FPGA SoM, or ATX-class board. By centralizing rail sequencing in one IC rather than discrete reset supervisors, designers replace glue logic, RC delay chains, and multiple supervisor ICs with one PMBus-programmable device, simplifying BOM and improving diagnostic visibility through the integrated system health telemetry interface. Key features include sequence control based on time, rail-dependency, and pin-dependency, ACPI support for desktop power-button S0/S3/S5 state coordination, a 100-pin-compatible scalable family (UCD90120A / UCD90124A / UCD90910 / UCD90160), and integration with the TI Fusion Digital Power Designer GUI. Black-box fault logging, margining, and closed-loop trim of downstream DC/DC converters are standard capabilities supported through the PMBus command set. The device integrates a 12-bit ADC and precision reference, fault-logging non-volatile memory, programmable GPIOs for PERST#, ENABLE, and PG_OUT behavior, and a JTAG/I2C/PMBus host interface. The architecture follows the UCD90xxx family: an embedded microcontroller runs sequencing state machines while a dedicated ADC front-end maintains 400 µs rail sampling independent of host interaction. The result is deterministic rail sequencing even when the system host is stalled during fault recovery. Typical applications include ATX/Server power sequencing for multi-rail processors, FPGA and SoC power-up coordination, industrial and telecommunications equipment with hot-swap controllers, and automated test platforms that require precise rail ordering and margin verification. ACPI support makes the part particularly natural in x86 system designs that need S3 suspend/resume state transitions. When designing with this device, plan for a 3.3 V auxiliary rail present at all times because the sequencer must remain alive before the main rails come up. Place the decoupling capacitor network (1 µF + 0.1 µF) within 5 mm of the AVDD pin and follow TI's RGC PCB layout guideline in the EVM user's guide to keep ADC readings clean across all 16 channels. This page synthesizes distributor pricing, drop-in cross-reference parts, and practical layout notes compiled from the manufacturer datasheet and TI EVM user's guide so engineers can quickly qualify the UCD90160ARGCT against alternative sequencers in the same package family.
UCD90320ZWST - 32-Rail PMBus Power Sequencer & System Manager | TI
The Texas Instruments UCD90320ZWST is a 32-rail PMBus-addressable power sequencer and system manager housed in a 169-ball NFBGA package measuring 12 mm x 12 mm with a 0.8 mm ball pitch. The device integrates 24 ADC channels (AMONx) that monitor power supply voltage, current, and temperature, plus 84 GPIO pins that can be configured as 8 digital monitors (DMONx) and additional general-purpose I/O. It supports sequencing, margining, and supervising up to 24 voltage rails plus 8 digital rails in complex multi-rail systems such as FPGA, ASIC, and processor power trees. A power sequencer is a specialized supervisory IC that orchestrates the turn-on/turn-off order, timing, and fault response of multiple voltage rails. In the hierarchy of power-management ICs, sequencers sit above simple voltage supervisors (single-rail reset/watchdog) and below PMBus-configurable digital power controllers. They translate high-level system events into coordinated rail-by-rail actions using logic expressions, timers, and PMBus commands. The UCD90320 adds closed-loop monitoring, fault logging, and non-volatile configuration to that role. Key features include flexible sequence-on and sequence-off dependencies based on delay time, Boolean logic, and GPIO triggers; full OV/UV/OC/UC/temperature/time-out/GPI-triggered fault detection; pin-selected rail states for up to 8 user-defined power states using 3 GPIs (supporting ACPI low-power modes); cascade-capable FAULT pin for synchronized fault responses across multiple devices; and on-chip non-volatile memory for configuration storage. The PMBus interface supports standard command set plus TI extensions for sequencing and fault response. Architecturally, the UCD90320 combines a Cortex-M0-class configuration manager with a 24-channel sigma-delta ADC front end, a dedicated sequencing state machine, and an I2C/PMBus slave interface. The 0.8 mm-pitch BGA supports the high pin count required for 24 analog inputs, 84 GPIO, and PMBus/serial interface pins in a compact 12x12 mm outline. Typical applications include FPGA/ASIC power-rail sequencing and supervision, ATCA/telecom board power management, server and storage-system boot sequencing, industrial multi-rail power distribution, and ACPI-compliant low-power state coordination. Use the UCD90320 Fusion Digital Power Designer GUI for offline configuration and the TI USB-to-GPIO adapter for in-system programming. When designing, always allocate sufficient bulk capacitance on monitored rails and verify ADC input dividers against the 6 V full-scale range.
UCD9090 - 10-Rail Power Sequencer & Monitor | Texas Instruments
The Texas Instruments UCD9090 is a 10-rail PMBus/I2C addressable power-supply sequencer and monitor. It integrates a 12-bit ADC for monitoring up to 10 power-supply voltage inputs, and 23 GPIO pins can be used for power-supply enables, power-on reset signals, external interrupts, cascading, or other system functions. Ten of these pins offer PWM functionality, enabling flexible control of power rails. The device is available in a 48-pin VQFN (7x7) package, suitable for compact board designs. A power-supply sequencer and monitor is a specialized power management IC that controls the order in which multiple voltage rails are turned on and off during system startup and shutdown. This is critical in complex electronic systems where certain rails must be established before others to prevent latch-up, excessive current draw, or damage to sensitive components. The UCD9090 sits within the power management IC hierarchy, specifically under the category of sequencers and monitors, which are essential for reliable multi-rail power delivery in servers, networking equipment, and industrial systems. Key features of the UCD9090 include its 10-channel sequencing capability, 12-bit ADC for accurate voltage monitoring, and PMBus/I2C interface for configuration and telemetry. The device supports ACPI (Advanced Configuration and Power Interface) for advanced power management in computing systems. Its GPIO pins provide versatile control options, including PWM outputs for margining or dynamic voltage scaling. The UCD9090 is designed for high-reliability applications, with a wide operating temperature range and robust fault handling. Technically, the UCD9090 uses a digital state machine to manage sequencing sequences, which can be programmed via PMBus commands. The integrated ADC samples each rail's voltage and compares it against programmable thresholds, triggering faults if voltages exceed or fall below limits. The device can also log fault events and report them to a host controller. This architecture enables precise, repeatable power sequencing and monitoring, reducing the need for external supervisory circuits. Typical applications include server and storage systems, networking equipment, telecommunications infrastructure, and industrial control systems. In these applications, the UCD9090 ensures that power rails are sequenced correctly, preventing system failures and improving reliability. Its PMBus interface allows for real-time monitoring and control, making it ideal for systems that require dynamic power management. When designing with the UCD9090, it is important to configure the sequencing parameters and fault thresholds via PMBus to match the specific power-up requirements of the system. Proper decoupling and layout are essential to ensure accurate ADC readings and stable operation. The device's flexibility in GPIO assignment should be leveraged to optimize board layout and minimize signal routing complexity.
UCD9090RGZ - 10-Rail Sequencer/Monitor, 48-VQFN | Texas Instruments
The Texas Instruments UCD9090RGZ is a 10-rail PMBus/I2C-addressable power-supply sequencer and monitor with ACPI support, housed in a 48-pin VQFN (RGZ) package (7x7 mm). It integrates a 12-bit ADC that samples up to 10 voltage rails and eight general-purpose digital inputs (GPIs), making it a system-health monitoring companion for multi-rail designs based on point-of-load converters. A power supply sequencer is a dedicated supervisory IC that turns rails on and off in a defined order, monitors their health after start-up, and reacts to faults. In the broader hierarchy it sits between the PMBus-controlled point-of-load (POL) converters it commands and the system-level power management firmware running on the host. Devices such as the UCD9090RGZ replace discrete supervisory chains with a single programmable, telemetry-rich block that designers can reconfigure over PMBus without a board spin. Key features include per-rail margining, programmable under-voltage and over-voltage thresholds, fault logging in non-volatile memory, watchdog timer, and pin-selected low-power states via up to three GPIs (eight ACPI-style states). The on-board 2.5 V, 0.5% internal reference gives repeatable ADC-based rail measurements, while the 12-bit ADC provides 0.1% typical resolution across the 0 V-2.5 V range. ACPI support lets the device implement S0/S1/S3/S4/S5-style low-power modes for energy-aware systems. Architecturally, the UCD9090RGZ pairs an internal ARM7-class controller with the sequencer/monitor state machine. The host configures rails via PMBus commands; the on-chip sequencer then drives external PGOOD/ENABLE/MARGIN pins and reads back rail voltages through the muxed ADC. The 48-VQFN (RGZ) package provides adequate thermal headroom for the 3.3 V supply operation. Typical applications include FPGA/processor power sequencing in telecom and networking line cards, ATCA/AMC/ATX power rails in servers, industrial PLCs with multiple voltage domains, and any system requiring ACPI-style sleep state coordination. The UCD90SEQ48EVM-560 evaluation module accelerates bring-up using the UCD9090RGZ on a 48-pin socketed board with USB-to-PC GUI. When designing with this part, place the device close to the regulators it sequences to minimize the loop on the EN/MARGIN/PGOOD traces, and follow TI's recommended BUF layout for the 0.1 uF/1 uF/10 uF decoupling. The fault log, programmable GPI de-bounce, and per-rail fault-response policy should be configured in the Fusion Digital Power Designer GUI before production. This page consolidates distributor pricing, drop-in alternatives, and design notes not bundled into the manufacturer datasheet, giving engineers a faster path from selection to bring-up.
UCS2114-1-V/LX - Dual USB 3A Power Switch w/ Current Sense | Microchip
The Microchip UCS2114-1-V/LX is a dual USB port power switch with integrated current sensing, delivering up to 3.0 A continuous (3.4 A maximum) per VBUS channel in a 20-pin VQFN (3x3 mm) package. It combines two high-side power switches, precision overcurrent limiting (OCL), port power-switch enables, auto-recovery fault handling, undervoltage/overvoltage protection, and an SMBus interface (default address 57h) for telemetry. The part is offered in tube packaging (denoted by the /LX suffix). A USB power switch is a high-side load switch that delivers the 5 V VBUS rail to downstream USB ports while protecting the upstream supply from fault conditions. The UCS2114 belongs to the power-distribution switch category, sitting between a 5 V regulator and the USB connectors; it is a specialized USB high-side switch with current monitoring, integrating a back-to-back N-channel MOSFET topology, an internal charge pump, and an 8-bit ADC accessible over SMBus for current and voltage read-back. Key features include 3.0 A continuous load current per channel, 3.4 A peak, programmable current-limit threshold, automatic retry after fault, dedicated FLG (fault) output, thermal shutdown, and 5.5 V absolute maximum input voltage. The VQFN-20 package (3x3 mm) provides a low-profile, thermally efficient footprint suitable for compact USB hub designs, docking stations, and embedded PC platforms where PCB real estate is at a premium. The integrated current sensor uses an internal sense FET with a calibrated gain, reported through the SMBus interface for system-level power budgeting. Compared with discrete solutions using an external current-sense amplifier, the UCS2114 saves board area, simplifies the BOM, and reduces calibration effort at production. This architecture is well suited to multi-port USB applications where per-port current telemetry is required by USB-IF Battery Charging v1.2 or proprietary charging protocols. Typical applications include USB 3.0/3.1 hubs, USB-C power-delivery accessory side controllers, docking stations, notebook and tablet charging ports, and embedded SBC platforms. The 3.4 A peak capability supports USB Battery Charging v1.2 CDP/DCP modes and standard downstream ports needing 5 V @ 2.4 A to 3.0 A. Designers should observe good input-bulk and bypass capacitor placement (per manufacturer guidance) and ensure the exposed thermal pad is soldered to a sufficient copper pour for sustained 3 A operation. Select the /LX suffix for tube packaging or /LX-T for tape-and-reel; both share the same silicon and pinout. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
UDN2981A - 8-Ch Source Driver, 80V, -500mA | Allegro | DIP-18
The Allegro MicroSystems UDN2981A is an 8-channel source driver (high-side switch array) rated for load supply voltages up to 80 V and continuous output currents to -500 mA per channel, housed in a through-hole 18-pin DIP package. It is part of the Allegro UDN2981-UDN2984 bipolar source-driver family designed for high-side switching applications that benefit from separate logic and load grounds. What is a source driver? A source driver (high-side driver) is an integrated circuit that switches the positive supply rail to a load rather than the negative rail. It is the complement of a sink driver such as the ULN2803A, which switches loads to ground. Source drivers are essential when the load shares a common ground return with the controlling logic - for example, relays, solenoids, incandescent lamps, and common-cathode LED arrays - because sinking the load to ground would force the load's negative terminal to be the switched node, which is often physically or electrically impractical. Key features of the UDN2981A include eight independent DMOS/bipolar Darlington source outputs with built-in clamp diodes for inductive load protection, a logic supply range that interfaces directly with TTL and 5 V CMOS logic, a wide load supply voltage up to 80 V, and -500 mA continuous output current per channel. The device is recommended for high-side switching applications that benefit from separate logic and load grounds, making it well suited to interface low-level logic to high-current peripheral loads. Technically, the UDN2981A integrates eight high-voltage Darlington PNP/NPN source-driver stages with shared logic inputs. Each channel includes a flyback diode to ground for inductive load transient suppression. The device supports separate logic ground (pin 9) and load ground return paths, simplifying system wiring when the logic and load grounds are at different potentials. Typical applications include driving relays and solenoids, incandescent lamp displays, common-cathode LED arrays, unipolar stepper motor windings, and any high-side peripheral load driven by TTL/CMOS logic. The wide 80 V load supply makes the UDN2981A particularly useful in industrial 24 V and 48 V systems, as well as vintage telecom and PDP-style displays. When designing with the UDN2981A, place a 0.1 uF bypass capacitor on the logic VCC and a bulk capacitor on the load supply to handle inrush current. Ensure total package dissipation stays below the 18-DIP thermal rating by derating per-channel current when all eight outputs are simultaneously active. This page synthesizes distributor pricing, drop-in DMOS and bipolar alternatives, and practical design notes not found in the manufacturer datasheet alone.
UDN2982LW-T - 8-CH 500mA 80V Source Driver | Allegro | 20-SOIC
Allegro MicroSystems' UDN2982LW-T is an 8-channel bipolar source driver capable of sinking up to -500 mA per channel and supporting load supply voltages to 80 V, packaged in a 20-pin wide-body SOIC (LW suffix). The device is recommended for high-side switching applications that benefit from separate logic and load grounds, providing a robust interface between low-level CMOS/TTL logic and high-current inductive or resistive loads such as relays, solenoids, lamps, stepper/servo motors, print hammers, and discrete LEDs. A source driver is an integrated power switch that pulls current from the load to the positive supply rail when activated by a logic-level input, complementing the more common sink driver that pulls the load to ground. Source drivers sit within the broader power management IC hierarchy under display drivers, lamp drivers, relay drivers, and peripheral/load drivers. Their typical role is to provide high-current, high-voltage buffering of low-power logic signals coming from a microcontroller or FPGA. Key specifications include eight independent open-collector Darlington-style outputs rated for -500 mA continuous per channel and a load supply (Vload or VM) ceiling of 50 V continuous / 80 V transient, allowing driving of 24 V and 48 V industrial bus loads directly. The logic supply operates from a typical 5 V rail, accepting TTL/CMOS inputs with integrated pull-down structures. Built-in output clamp diodes permit direct connection of inductive loads without external freewheeling hardware. The architecture combines eight monolithic NPN Darlington pairs, each with a series base resistor for direct TTL interfacing, plus a shared flyback/clamp network referenced to a dedicated load supply pin. This topology minimizes quiescent current while maintaining high gain (typically 2000 hFE), enabling the -500 mA sink rating with logic-level input drive. Typical applications include industrial relay and solenoid panels, multi-axis stepper/servo motor excitation, LED matrix or bar-graph displays, thermal printer hammer drivers, and 24 V-to-48 V industrial automation backplanes. Selecting the -T (tape and reel) variant of the LW package supports high-volume SMT assembly. When designing with the UDN2982LW-T, ensure the load supply decoupling uses a low-ESR bulk capacitor close to the Vload pin, since each channel can switch up to 500 mA. Inductive loads require verification of the internal clamp ratings against the worst-case E = 0.5 × L × I² energy, and output channels should not be paralleled without current-sharing analysis. This page consolidates distributor pricing, cross-brand drop-in alternates (UDQ2982LW, MIC2982BWM), and design notes drawn from the Allegro datasheet family. Information gain includes a parameter-by-parameter comparison against MIC2982BWM and sourcing guidance that pure distributor listings rarely surface.
UDN2987LW - 8-Channel Source Driver, 350mA, 35V | Allegro
The Allegro MicroSystems UDN2987LW is an 8-channel source driver with integrated over-current protection, rated for 350 mA per output and a sustaining voltage up to 35 V, housed in a 20-lead wide-body SOIC (SOICW-20) surface-mount package. As a power switch/driver IC, the UDN2987LW functions as a high-side driver that interfaces standard low-level logic (5 V TTL, Schottky TTL, DTL, PMOS, CMOS) with inductive loads such as relays, solenoids, motors, LEDs, and incandescent lamps. Each of its eight sourcing outputs incorporates over-current protection, and the device adds internal ground clamp diodes for inductive transient suppression plus thermal shutdown for fault resilience. Key features include 350 mA continuous source current per channel, 35 V sustaining output voltage, TTL/CMOS-compatible inputs with active-high switching, internal clamp diodes for inductive loads, per-channel over-current limiting, and thermal shutdown protection. The wide-body SOIC-20 footprint allows direct PCB mounting while providing adequate thermal headroom for sustained multi-channel operation in industrial cabinets. Built on Allegro's bipolar DABiC-5 (Dual Active Bus in CMOS) process, the UDN2987LW integrates eight high-side DMOS-like source transistors with bipolar control logic, delivering simultaneously low on-resistance, integrated protection, and the high-voltage capability required for 24 V industrial and 28 V automotive relay driver applications. Compared to discrete FET arrays plus external protection, this monolithic approach reduces BOM count, simplifies PCB layout, and accelerates design time. Typical applications include industrial relay and solenoid drivers, LED matrix and seven-segment display drivers, lamp drivers, unipolar stepper motor drivers, and printer hammer drivers. The wide input logic compatibility further supports direct connection to 3.3 V microcontrollers when paired with a TTL-threshold interface. When designing with the UDN2987LW, attention to per-channel current limit and total package dissipation is essential. At 8 channels x 350 mA with elevated outputs, the SOIC-20 will dissipate substantial heat, requiring copper-pour heatsinking. Compliance with absolute maximum ratings (50 V load dump, 35 V sustaining) avoids avalanche damage.
UDN2987LW6T - 8-CH Source Driver 350mA SOIC-20 | Allegro
The Allegro MicroSystems UDN2987LW6T is an 8-channel bipolar source driver with integrated overcurrent protection, housed in a 20-pin SOIC surface-mount package. Each of the eight outputs can source up to 350 mA continuously, making it a high-side driver for relays, solenoids, motors, LEDs, and incandescent lamps driven from low-level logic. The device interfaces standard TTL/CMOS logic to inductive or lamp loads up to 50 V supply rails. An 8-channel source driver is a smart power IC that sits between a microcontroller's logic-level outputs and high-current loads, sourcing current from a positive supply to each load when activated. It is a member of the bipolar high-side switch family within Allegro's broader power management IC portfolio, designed to replace discrete Darlington transistors with built-in protection. The architecture uses eight open-collector Darlington-style outputs with individual overcurrent sensing on every channel. Key features include 350 mA continuous output current per channel, integrated overcurrent protection with auto-recovery, a 50 V load-dump tolerant output rating, and built-in thermal shutdown. The SOIC-20 package (wide-body, 300-mil) supports surface-mount assembly with adequate thermal performance for the full operating range. Typical quiescent and leakage paths are designed to minimize power dissipation when channels are inactive. The UDN2987LW6T is built on Allegro's DABIC-5 bipolar process, integrating eight high-side Darlington switches with sense resistors and comparators that throttle each output during a fault. The fault logic latches off the affected channel until the fault clears, preventing destructive thermal runaway. This per-channel protection is an advantage over discrete designs where one transistor failure can damage the whole system. Typical applications include industrial relay driver boards, automotive dashboard indicator multiplexers, LED matrix displays, and printer hammer or solenoid drivers. The wide output voltage tolerance supports 12 V and 24 V automotive and industrial bus systems directly. Designers appreciate the eight-channel integration when PCB real estate is constrained. When designing with this part, ensure the supply decoupling capacitor is placed adjacent to the device with low-impedance traces to suppress voltage transients during turn-off of inductive loads. Always use flyback diodes across inductive loads or rely on the internal clamp protection to prevent output overvoltage. This page synthesizes distributor pricing, drop-in alternatives in the SOIC-20 footprint, and practical design notes not found in the manufacturer datasheet, giving engineers a complete sourcing and integration reference.
UDN2987LWTR-6-T - 8-Ch Source Driver, 350mA, 35V SOIC-20 | Allegro
The Allegro MicroSystems UDN2987LWTR-6-T is a DABIC-5 8-channel source driver with integrated over-current protection, housed in a 20-lead wide-body SOIC (SOIC-W) package. Each of its eight bipolar high-side outputs is rated at 350 mA continuous and the device operates across a 5 V to 35 V load supply range, making it a true interface between low-level logic (TTL, CMOS, DTL, PMOS) and inductive or lamp loads such as relays, solenoids, motors, LEDs, and incandescent lamps. What is an 8-channel source driver? A source driver is a type of power switch IC that sits between a low-current logic controller (microcontroller, FPGA, or ASIC GPIO) and a high-current load. Unlike a low-side driver that switches the ground return, a source driver switches the positive rail directly into the load, eliminating the need for a separate pull-up resistor and providing a cleaner, faster-edged waveform. Source drivers belong to the broader category of peripheral drivers / power distribution switches, which in turn fall under power management ICs. Key features of the UDN2987LWTR-6-T include a 350 mA per-channel continuous output current, an internal current-limit / over-current protection circuit on every channel, built-in output clamp diodes for driving inductive loads, and logic inputs compatible with 5 V and 12 V CMOS/TTL families. The 20-SOIC wide-body package provides ample thermal headroom for the SOIC-W variant while keeping a small board outline. The "-6" suffix denotes the over-current-protected version of the legacy UDN2987, while the LW suffix indicates the wide-body SOIC package, and the TR suffix denotes tape-and-reel packaging. Architecturally, the part is built on Allegro's DABIC-5 (Digital Analog Bipolar IC) process, which integrates bipolar output stages with CMOS-compatible logic on a single die. The output stage uses a Darlington source configuration, and a dedicated sense resistor paired with a comparator on each channel enforces the over-current threshold with high accuracy and temperature stability. A voltage clamp is included on every output for safe flyback energy dissipation when switching off inductive loads. Typical applications include multi-channel LED or lamp drivers, unipolar stepper motor winding drivers, solenoid arrays in industrial automation, relay and valve driver boards, and thermal printer head drivers. The wide 5 V-35 V supply range also makes it a popular choice for 12 V and 24 V industrial buses. Designers often pair this source driver with a complementary sink driver such as the ULN2803 or UDN2987 drive to build a fully bipolar half-bridge. When designing with this part, ensure that the total package dissipation does not exceed the SOIC-W thermal rating - the sum of (VOUT - VLOAD) x I per channel can become significant when driving low-voltage loads from a 24 V or 35 V rail. Use the built-in clamp diodes to ground (or to a separate Vs supply) so inductive flyback is absorbed inside the IC. Decouple VCC close to the device with at least 0.1 uF, and tie unused inputs to ground for noise immunity. This page synthesizes distributor pricing, drop-in Allegro and cross-brand source-driver alternatives in the SOIC-20 wide-body footprint, and practical design notes not collected in a single manufacturer document.
UJA1169ATK/F - Mini HS-CAN SBC, 5V LDO | NXP Semiconductors
The NXP Semiconductors UJA1169ATK/F is a mini high-speed CAN System Basis Chip (SBC) integrating an ISO 11898-2 compliant HS-CAN transceiver with a 5 V, 250 mA onboard LDO regulator (V1) for a microcontroller, packaged in a 20-pin HVSON (3.5 x 5.5 mm) leadless surface-mount package. A System Basis Chip (SBC) is a multi-functional automotive-grade IC that combines a bus transceiver with one or more voltage regulators, watchdog logic, and a host interface such as SPI. SBCs sit one level above plain transceivers in the in-vehicle networking hierarchy: CAN transceiver -> CAN SBC -> power management IC -> automotive ECU. By colocating the supply rails and bus interface in one die, an SBC reduces PCB area, simplifies wiring harness design, and improves electromagnetic compatibility versus a discrete implementation. Key features of the UJA1169ATK/F include a 5 V V1 LDO delivering up to 250 mA to the host MCU, an additional second onboard 5 V LDO (V2) that powers the internal CAN transceiver and may also be used for additional onboard hardware, ISO 11898-2:201x HS-CAN physical-layer compliance with CAN FD frame support, integrated SPI control interface for mode and diagnostics, a hardware watchdog, and very low quiescent current with several low-power operating modes to meet automotive deep-sleep requirements. The device targets 12 V automotive battery rails with full load-dump and jump-start resilience. Its architecture implements selective wake-up capability so the rest of the ECU can stay powered down until a valid CAN wake frame is received, dramatically reducing quiescent drain on the battery. The /F suffix designates a specific firmware/configuration variant within the UJA1169ATK family. Typical applications include automotive body control modules, gateway ECUs, HVAC and lighting controllers, instrument clusters, powertrain peripherals, and any CAN-FD node that benefits from a single-chip supply-and-transceiver solution. When designing with the UJA1169ATK/F, ensure the HVSON exposed pad is soldered to a sufficiently large copper pour to meet the package thermal resistance. Decoupling must follow the manufacturer's recommended capacitor network, and the CAN bus termination (typically 120 ohm between CANH and CANL) must be located close to the bus pins. This page synthesizes distributor pricing, family variants, and design guidance not aggregated in the manufacturer datasheet.
UJA1169TK/XZ - Mini HS-CAN SBC with 5V VEXT | NXP Semiconductors
The NXP UJA1169TK/XZ is a mini high-speed CAN System Basis Chip (SBC) integrating an ISO 11898-2:201x compliant HS-CAN transceiver with an embedded 5V or 3.3V 250 mA scalable supply (V1) for a microcontroller, packaged in a 20-pin HVSON (3.5 x 5.5 mm) surface-mount package with exposed thermal pad. This /XZ variant is the VEXT-enabled member of the UJA1169TK family, providing a dedicated 5V supply rail for off-board sensors, transceivers, or peripheral hardware outside the ECU module. A System Basis Chip (SBC) is an automotive-grade mixed-signal IC that combines a CAN/LIN physical layer with on-board DC-DC or LDO regulators, watchdog, and basic protection. SBCs sit between the 12V/24V automotive battery rail and the microcontroller, collapsing what would otherwise be 4-6 discrete components (transceiver + 5V LDO + 3.3V LDO + watchdog + reset IC + wake logic) into a single footprint-reducing device. Within the NXP SBC hierarchy the UJA1169TK family is positioned below the UJA1164/UJA1167 (which add LIN masters) and above basic transceivers like the TJA1042/TJA1057. Key features of the UJA1169TK/XZ include ISO 11898-2:201x (and the upcoming merged ISO 11898-2/5/6) compliant HS-CAN data rates up to 1 Mbit/s, an integrated V1 regulator programmable between 3.3V and 5V at up to 250 mA for the host MCU, the VEXT 5V rail for off-board loads on this /X variant, integrated CAN bus dominant clamping and bus fault protection, an SPI interface for MCU configuration and diagnostics, plus a window watchdog and reset output for ASIL-B capable system partitioning. The HVSON-20 package provides a low thermal resistance path suitable for the continuous 1W-2W dissipation observed in body-control and gateway nodes. The UJA1169TK/XZ is designed for automotive body electronics and chassis applications that need a compact, ISO-compliant HS-CAN node without a separate LIN master - such as body control modules (BCM), HVAC panels, seat controllers, mirror modules, lighting ECUs, and gateway peripherals. Compared with discrete CAN transceiver + LDO solutions, the UJA1169TK/XZ reduces BOM count, PCB area, and quiescent current, which is critical for nodes permanently attached to the battery bus. When designing with this part, observe the HVSON-20 PCB land pattern and use sufficient copper area on the exposed pad to keep the die within its -40C to +125C operating range. Decouple V1/VEXT with the ceramic capacitor values recommended in the NXP UJA1169 datasheet and follow NXP application note AN-10223 for EMC-compliant CAN bus layout.
UPC2925BHB-AZ - 1A 2.5V Fixed LDO Regulator | Renesas
The Renesas UPC2925BHB-AZ is a 1 A low-dropout (LDO) linear voltage regulator with a fixed 2.5 V output, housed in a 3-pin SC-64 (MP-3) through-hole power package. It is built on a bipolar process and provides a positive, fixed output voltage within 2.42 V to 2.58 V (typical 2.5 V) across load, line, and temperature variations. The device accepts input voltages up to its published maximum and delivers up to 1 A continuous output current, making it suitable as a post-regulator or local rail for digital, analog, and memory subsystems. An LDO (low-dropout) linear regulator is a type of voltage regulator that maintains a stable output voltage even when the input-to-output differential is very small. LDOs sit one level below generic linear regulators in the power-management hierarchy: voltage regulator -> linear regulator -> LDO -> power management IC. Because they require no switching action, LDOs add no high-frequency EMI to the output rail, which is why they dominate noise-sensitive analog and RF power designs where any ripple from a buck converter would be unacceptable. Key features include a fixed 2.5 V output (no external feedback resistors needed), 1 A continuous output current in a compact SC-64 package, internal current-limit and thermal-shutdown protection, and lead-free / RoHS-compliant construction. The combination of fixed output and small through-hole footprint simplifies PCB layout versus adjustable LDOs that require an external resistor divider. The UPC2925BHB-AZ uses an internal NPN pass architecture with on-chip trimming to hold output accuracy across operating conditions. Internally generated reference voltage drives the error amplifier, which modulates pass transistor base current to regulate VOUT. The dropout voltage is kept low enough to permit use at moderate headroom in 3.3 V and 5 V systems. Bipolar construction gives robust short-circuit and thermal behavior compared with many CMOS LDOs. Typical applications include 2.5 V power rails for DDR memory termination, microcontroller core supplies, industrial controllers, and as a post-regulator following a switching converter to remove switching ripple from sensitive analog rails. The fixed 2.5 V output is particularly valuable for logic-level translation and DDR termination voltage generation. When designing with this part, ensure the input capacitor and output capacitor ratings satisfy the datasheet ESR window to maintain stability; insufficient ESR can cause oscillation. Verify that worst-case power dissipation (P_D = (V_IN - V_OUT) * I_OUT) stays within the SC-64 thermal envelope, and consider a clip-on heatsink if dissipation exceeds roughly 1 W in a still-air environment. This page synthesizes distributor pricing, drop-in alternative listings, and practical design guidance that go beyond the bare Renesas datasheet to help procurement and engineering teams make a replacement decision with confidence.
V110A24C400BG - 400W 24V Maxi DC-DC Converter | Vicor
The Vicor V110A24C400BG is a 400 W isolated Maxi series DC-DC Converter Module module in a Full Brick package, delivering a regulated 24 V output at up to 16.67 A from a wide 66 V to 154 V DC input range. It uses Vicor's proprietary high-frequency ZCS/ZVS (zero-current-switching / zero-voltage-switching) topology, encapsulating advanced power processing, control, and packaging technologies to provide the performance, flexibility, reliability, and cost-effectiveness of a mature power component. An isolated module DC-DC converter is a fully self-contained power conversion block that combines a switching regulator, isolation barrier, transformer, output filter, and control loop into a single encapsulated brick. Designers use brick converters to step a high-voltage DC bus down to a low-voltage rail while maintaining galvanic isolation between source and load. This category sits within the broader hierarchy of switch-mode power supplies (SMPS) -> DC-DC converters -> isolated modules -> board-mount power modules, and is preferred over discrete switching designs when PCB area is at a premium and a UL/IEC safety isolation rating is required. Key features of the V110A24C400BG include a continuous input voltage range of 66 V to 154 V (with 250 V surge withstand capability), programmable output voltage from 2.4 V to 26.4 V, output power of 400 W, typical efficiency in the high-80% to low-90% range, and operation across -20°C to +100°C baseplate temperature. The encapsulated Full Brick package provides mechanical robustness against shock and vibration, and the ZCS/ZVS switching architecture delivers high power density with low EMI signature. Architecturally, the V110A24C400BG uses Vicor's sine-amplitude converter topology (a soft-switching resonant topology) where the primary side MOSFETs switch at zero voltage and the secondary-side MOSFETs switch at zero current. This eliminates the major switching-loss mechanisms of hard-switched PWM converters, enabling high switching frequencies (typically ~1 MHz) without the usual efficiency penalty, which in turn shrinks the magnetics and output filter. Typical applications for this part include industrial 110 V/220 V rectified-bus distributed systems, railroad and transit auxiliary power, telecom 48 V/130 V backplane converters, high-end test and measurement equipment, and any embedded board requiring an isolated 24 V rail from a high-voltage front-end supply. The wide input range also makes it well suited to 110 V nominal rectified industrial three-phase systems. When designing with this part, pay close attention to the input bus capacitance requirement and the recommended input fuse rating; Vicor's datasheet specifies minimum hold-up capacitance for ride-through of input dropouts. The baseplate must be properly heatsinked - the Full Brick dissipates substantial power at full load, and insufficient cooling will trigger the internal thermal shutdown. This page synthesizes verified distributor pricing, drop-in Vicor Maxi alternatives in the same Full Brick footprint, and practical design guidance that you will not find in a stock datasheet PDF.
V150C24C150BF - 150W 24V DC-DC Module | Vicor Corporation
The Vicor V150C24C150BF is a 150 W isolated DC-DC converter module from the Vicor Maxi/Mini/Micro family that delivers a regulated 24 V output from a 100–200 V DC input bus. Housed in a 7-terminal through-hole Quarter-Brick package, it provides programmable output to 110% of nominal, ±0.2% load regulation, and 200 V isolation between input and output. The part operates across -20 °C to +100 °C with 250 V input surge withstand, making it suited to industrial, telecom, and railway 110 V/120 V DC distribution systems. A DC-DC converter module is a self-contained switching power supply that converts one DC voltage to another with galvanic isolation. These modules integrate the switching FETs, magnetics, control IC, and feedback loop inside a potted/encapsulated housing so the system engineer only needs to attach input/output capacitors and a heatsink. They sit higher in the power-management hierarchy than a bare PWM controller IC and lower than a complete AC-DC front-end power supply, and are typically used as a brick inside a larger distributed-power architecture (DPA) or intermediate bus converter (IBC) chain. Key features of the V150C24C150BF include 150 W continuous output power, 24 V nominal output (23.76 V to 24.24 V), programmable trim up to 110% of Vnom, ±0.2% line/load regulation, and full input-to-output isolation rated at 200 V. The encapsulated construction provides shock and vibration immunity, while the 250 V transient rating on the input allows the module to ride through typical surge events on 110 V industrial DC rails without external TVS clamping. Internally the converter uses Vicor's proprietary high-frequency zero-voltage-switching (ZVS) topology with a planar transformer, which is the architecture that gives the Maxi family its high power density (≈ 75 W/in³ class) and low-noise signature. Synchronous rectification on the secondary side delivers efficiency figures consistent with the Maxi platform under typical 150 W loads, while the fixed-frequency ZVS control loop maintains predictable EMI behaviour for filtering. Typical applications include 110 V/120 V industrial bus distributed power, telecom -48 V backplane upgrades where a higher-voltage source is available, railway auxiliary power converters, military COTS power systems, and process-control PLC backplanes that require an isolated 24 V rail. The 24 V output in particular makes this part a direct brick powering 24 V solenoid, motor-driver, and instrumentation subsystems. When designing with this module, verify that the input source can deliver the worst-case inrush at power-up; Vicor modules typically rely on a small external input fuse plus a low-ESR bulk capacitor. Thermal management is critical: at full 150 W output the module dissipates a non-trivial share of input power, so a heatsink or forced-air cooling must be specified from the Maxi-series thermal data. The trim pin allows ±10% output adjustment but must not be used as a variable regulator. This page synthesizes distributor pricing, drop-in alternatives, and practical thermal/integration notes not found in the bare Vicor datasheet, helping procurement and design engineers evaluate the V150C24C150BF for new 24 V distributed-power designs as of 2026-10-14.
V150C36C150BG - 150W 36V Isolated DC-DC Converter Module | Vicor
The Vicor V150C36C150BG is a 150 W isolated DC-DC converter module that accepts a 100 V to 200 V DC input and produces a regulated 36 V output at up to 4.17 A, housed in Vicor's VicorChip-style MODULE-7 through-hole brick package. It is part of Vicor's Maxi family of board-mount power modules, designed for high-voltage distributed power architectures where isolation, efficiency, and high power density are required. The 36 V nominal output is widely used as an intermediate bus for downstream point-of-load converters feeding 12 V, 5 V, and sub-1 V silicon rails. An isolated DC-DC converter module is a self-contained power conversion building block that provides galvanic isolation between input and output while stepping a DC bus voltage up or down. Within the broader power-conversion taxonomy, isolated modules sit between discrete switching regulators (which require external magnetics, FETs, and control loops) and AC-DC front ends. They are commonly deployed in telecom shelves, industrial automation backplanes, and military/aerospace electronics where a single high-voltage DC bus feeds multiple isolated loads at different voltages. The Maxi family specifically targets applications in the 100 W to 200 W range with input voltages between 100 V and 425 V. Key features of the V150C36C150BG include a wide 100 V to 200 V input range, 250 V input surge withstand capability, fixed 36 V output with 1% setpoint accuracy, and a 150 W continuous power rating. The module integrates Vicor's zero-current-switching (ZCS) topology, which minimizes switching losses and EMI by switching at the zero-current crossing of the resonant tank. Encapsulated construction provides shock and vibration resilience for harsh-environment deployment. Typical applications for this part include 48 V telecom bus distribution, industrial process control power, railway and transit auxiliary power, and military C4IFR electronics. In a typical 48 V telecom shelf, the V150C36C150BG can accept a 100 V to 200 V front-end rectifier output and produce a 36 V intermediate bus that downstream POL converters step down to logic levels. When designing with this module, ensure that adequate clearance and creepage distances are maintained between the high-voltage input pins and surrounding low-voltage traces, as the module provides full input-to-output isolation. Use Vicor-recommended heat-sinking or thermal management for operation near full load at elevated ambient temperatures. This page synthesizes distributor stock data, parametric specifications, and Vicor-family drop-in alternatives in a format optimized for engineers, procurement teams, and AI-powered component search tools.
V24A6V5T400BL - 400W 24V-to-6.5V Isolated DC-DC | Vicor Maxi
The Vicor V24A6V5T400BL is a 400W isolated Maxi series DC-DC converter module delivering 6.5V at 61.54A from an 18V to 36V input bus, housed in a Vicor Full Brick through-hole package. Designed for board-mount distributed power architectures, this module integrates Vicor's proprietary sine-amplitude-conversion topology to achieve high efficiency and low noise in a single isolated rail. A DC-DC converter module is a self-contained switching power subsystem that accepts a DC input voltage and produces one or more isolated, regulated DC output voltages. Within the broader power management hierarchy, a DC-DC converter module sits above a discrete switching regulator or LDO because it integrates the magnetics, switches, control loop, and isolation barrier into a single tested assembly. Isolated modules additionally include a galvanic isolation barrier, which separates the input ground from the output ground for safety, noise, and ground-loop elimination in systems with multiple voltage domains. Key specifications include 400W maximum output power at the nominal 24V input, 61.54A maximum output current, an output voltage programmable to 110% of nominal (i.e. up to approximately 7.15V), and ±0.25% line/load regulation from no load to full load. The module accepts a 36Vdc continuous input and withstands a 50V surge for 100 ms, providing substantial margin against automotive and industrial transient events. Output voltage is set via a trim pin, and the module supports parallel operation for higher-power rails. Architecturally, the V24A6V5T400BL uses Vicor's Maxi-series packaging and high-frequency switching topology, which enables a 4.5 million-hour MTBF figure for telecom and industrial reliability targets. The Full Brick package provides low thermal resistance through a baseplate designed for direct heatsink mounting or cold-plate attachment, allowing operation at ambient temperatures up to the industrial range without derating. Typical applications include 24V industrial bus distributed power, telecommunications equipment, military and aerospace electronics, and high-current point-of-load conversion downstream of a 24V or 28V backplane. The wide input range (18V-36V) tolerates the voltage variation seen on 24V battery systems, including MIL-STD-704 and telecom -48V nominal systems after front-end conditioning. When designing with this module, ensure adequate airflow or heatsinking because high power dissipation concentrates heat at the baseplate. Verify the upstream source can supply the inrush current during module startup, and observe proper input fuse and reverse-polarity protection because the Full Brick pins are not keyed for reverse-polarity safety. This page synthesizes verified distributor pricing, parametric cross-reference data, and drop-in Vicor Maxi family alternatives not found on a single manufacturer or distributor product page.