5CSEBA4U23C6N vs 5CSEBA4U23C7SN 对比

详细并排对比 5CSEBA4U23C6N 出自 Intel 和 5CSEBA4U23C7SN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 5CSEBA4U23C6N 5CSEBA4U23C7SN
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $86.20 $18.20
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 40,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] [DATA_NEEDED: ALM count]
Embedded Memory (M10K + MLAB) 2,460 Kbits —
DSP Blocks (18x18 Multipliers) 112 —
HPS Processor Cores Dual ARM Cortex-A9 MPCore —
HPS Maximum CPU Clock 925 MHz —
Hard Memory Controller DDR3 / DDR3L / LPDDR2 —
Process Technology TSMC 28 nm low-power —
Core Voltage (VCC) 1.1 V —
General-Purpose FPGA I/Os 188 —
Transceivers Not integrated on SE device —
封装 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch 672-ball UBGA, 23x23 mm
安装类型 Surface Mount (BGA) —
工作结温 -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) —
Configuration Modes JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ JTAG, serial passive/active
RoHS 状态 Compliant Compliant
Device Logic Elements — 40,000
Hard Processor System — Dual-core ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency — 800 MHz
Embedded Memory (Kbits) — 2,460
DSP Blocks (18x18) — 112
Maximum User I/Os — 364
Ball Pitch — 0.8 mm
Process Node — TSMC 28 nm low-power
工作温度 — -40C to +85C (industrial)
Memory Interfaces — DDR2, DDR3, LPDDR2 (hard controller)
Peripherals (HPS) — USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART
Speed Grade — C7

数据手册与资源

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