5CSEBA4U23C6N vs 5CSEBA4U23C7SN Comparison
Detailed side-by-side comparison of 5CSEBA4U23C6N by Intel and 5CSEBA4U23C7SN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
5CSEBA4U23C6N - Cyclone V SE SoC FPGA 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C6N ✓ ActiveIntel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ ActiveSpecification Comparison
| Parameter | 5CSEBA4U23C6N | 5CSEBA4U23C7SN |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $86.20 | $18.20 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 40,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Embedded Memory (M10K + MLAB) | 2,460 Kbits | — |
| DSP Blocks (18x18 Multipliers) | 112 | — |
| HPS Processor Cores | Dual ARM Cortex-A9 MPCore | — |
| HPS Maximum CPU Clock | 925 MHz | — |
| Hard Memory Controller | DDR3 / DDR3L / LPDDR2 | — |
| Process Technology | TSMC 28 nm low-power | — |
| Core Voltage (VCC) | 1.1 V | — |
| General-Purpose FPGA I/Os | 188 | — |
| Transceivers | Not integrated on SE device | — |
| Package | 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch | 672-ball UBGA, 23x23 mm |
| Mounting Type | Surface Mount (BGA) | — |
| Operating Junction Temperature | -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) | — |
| Configuration Modes | JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ | JTAG, serial passive/active |
| RoHS Status | Compliant | Compliant |
| Device Logic Elements | — | 40,000 |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | — | 800 MHz |
| Embedded Memory (Kbits) | — | 2,460 |
| DSP Blocks (18x18) | — | 112 |
| Maximum User I/Os | — | 364 |
| Ball Pitch | — | 0.8 mm |
| Process Node | — | TSMC 28 nm low-power |
| Operating Temperature | — | -40C to +85C (industrial) |
| Memory Interfaces | — | DDR2, DDR3, LPDDR2 (hard controller) |
| Peripherals (HPS) | — | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART |
| Speed Grade | — | C7 |