5CSEBA4U23C6N vs 5CSEBA4U23C7SN Vergleich
Detaillierter Direktvergleich von 5CSEBA4U23C6N von Intel und 5CSEBA4U23C7SN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
5CSEBA4U23C6N - Cyclone V SE SoC FPGA 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C6N ✓ AktivIntel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ AktivSpezifikationsvergleich
| Parameter | 5CSEBA4U23C6N | 5CSEBA4U23C7SN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $86,20 | $18,20 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 40,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Embedded Memory (M10K + MLAB) | 2,460 Kbits | — |
| DSP Blocks (18x18 Multipliers) | 112 | — |
| HPS Processor Cores | Dual ARM Cortex-A9 MPCore | — |
| HPS Maximum CPU Clock | 925 MHz | — |
| Hard Memory Controller | DDR3 / DDR3L / LPDDR2 | — |
| Process Technology | TSMC 28 nm low-power | — |
| Core Voltage (VCC) | 1.1 V | — |
| General-Purpose FPGA I/Os | 188 | — |
| Transceivers | Not integrated on SE device | — |
| Gehäuse | 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch | 672-ball UBGA, 23x23 mm |
| Montageart | Surface Mount (BGA) | — |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) | — |
| Configuration Modes | JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ | JTAG, serial passive/active |
| RoHS-Status | Compliant | Compliant |
| Device Logic Elements | — | 40,000 |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | — | 800 MHz |
| Embedded Memory (Kbits) | — | 2,460 |
| DSP Blocks (18x18) | — | 112 |
| Maximum User I/Os | — | 364 |
| Ball Pitch | — | 0.8 mm |
| Process Node | — | TSMC 28 nm low-power |
| Betriebstemperatur | — | -40C to +85C (industrial) |
| Memory Interfaces | — | DDR2, DDR3, LPDDR2 (hard controller) |
| Peripherals (HPS) | — | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART |
| Speed Grade | — | C7 |