EP2AGX45DF25I3G vs EP2AGX45CU17I3G 对比
详细并排对比 EP2AGX45DF25I3G 出自 Intel 和 EP2AGX45CU17I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGX45DF25I3G | EP2AGX45CU17I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $370.00 | $445.00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 42,959 | — |
| Adaptive Logic Modules (ALM) | 17,715 | — |
| Embedded Memory Bits | 3,517,440 bits | — |
| Embedded Memory M9K Blocks | [DATA_NEEDED: M9K block count] | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Maximum User I/O Pins | 252 | — |
| Transceiver Channels | [DATA_NEEDED: MGT channel count] | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| 封装 | 572-ball FCBGA (HBGA) | 358-ball UBGA (FCBGA), 17x17 mm |
| Package Dimensions | 25 mm x 25 mm | — |
| 工作温度范围 | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Process Node | 40 nm | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| Hard IP for PCIe | PCIe Gen1/Gen2 endpoints and root ports | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等级 | 3 | 3 (168 hours) |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| User I/O Pins | — | 156 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Transceivers | — | Up to 8 channels |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| Process Technology | — | 40 nm |
| Core Voltage (Vcc) | — | 1.0 V (0.9 V internal) |
| PLLs | — | 4 |
| DSP Blocks | — | Yes (variable-precision DSP) |
| 工作温度 | — | -40C to +100C (Industrial) |
| Ball Pitch | — | 1.0 mm |