EP2AGX45DF25I3G vs EP2AGX45CU17I3G 비교
다음의 상세 나란히 비교: EP2AGX45DF25I3G 제조: Intel 및 EP2AGX45CU17I3G 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP2AGX45DF25I3G | EP2AGX45CU17I3G |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $370.00 | $445.00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 42,959 | — |
| Adaptive Logic Modules (ALM) | 17,715 | — |
| Embedded Memory Bits | 3,517,440 bits | — |
| Embedded Memory M9K Blocks | [DATA_NEEDED: M9K block count] | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Maximum User I/O Pins | 252 | — |
| Transceiver Channels | [DATA_NEEDED: MGT channel count] | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| 패키지 | 572-ball FCBGA (HBGA) | 358-ball UBGA (FCBGA), 17x17 mm |
| Package Dimensions | 25 mm x 25 mm | — |
| 동작 온도 범위 | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Process Node | 40 nm | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| Hard IP for PCIe | PCIe Gen1/Gen2 endpoints and root ports | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 레벨 | 3 | 3 (168 hours) |
| RoHS 상태 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| User I/O Pins | — | 156 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Transceivers | — | Up to 8 channels |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| Process Technology | — | 40 nm |
| Core Voltage (Vcc) | — | 1.0 V (0.9 V internal) |
| PLLs | — | 4 |
| DSP Blocks | — | Yes (variable-precision DSP) |
| 동작 온도 | — | -40C to +100C (Industrial) |
| Ball Pitch | — | 1.0 mm |