EP2SGX60DF780C3N vs EP2SGX60DF780C5 对比

详细并排对比 EP2SGX60DF780C3N 出自 Intel 和 EP2SGX60DF780C5 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX60DF780C3N EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N ✗ 停产
Intel
EP2SGX60DF780C5 EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel

EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel

EP2SGX60DF780C5 ⚠ 最后一次采购

规格对比

参数 EP2SGX60DF780C3N EP2SGX60DF780C5
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 停产 最后采购期
库存状态 有库存 有库存
单价(USD) $188.00 $860.69
Family Stratix II GX Stratix II GX
Device Type FPGA Field-Programmable Gate Array (FPGA)
Logic Elements 60,440 60,440
LABs/CLBs 3,022 —
Total Memory Bits 2,544,192 —
User I/Os 364 —
Package Type 780-pin FC-FBGA (DF780) —
Package Dimensions 23 x 23 mm —
Pitch 1 mm —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm
Internal Frequency 717 MHz —
Propagation Delay [DATA_NEEDED: propagation delay ns] —
工作温度 [DATA_NEEDED: operating temperature range C] Commercial (0C to +85C)
安装类型 Surface Mount (BGA) Surface Mount
RoHS 状态 Compliant (per distributor listing) [DATA_NEEDED: RoHS status]
Logic Array Blocks (LABs) — 3,022
User I/O Pins — 364
封装 — 780-ball FC-FBGA
Package Body Size — 23 x 23 mm
Ball Pitch — 1.0 mm
Core Supply Voltage — 1.2 V
Internal Frequency (max, typical) — ~717 MHz
Speed Grade — -C5 (commercial, mid-band)
Lead-Free — [DATA_NEEDED: lead-free status]

数据手册与资源

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