EP3SE260F1517I3G vs EP3SE260F1517C3N 对比
详细并排对比 EP3SE260F1517I3G 出自 Intel 和 EP3SE260F1517C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1517I3G | EP3SE260F1517C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3,520.00 | $9,850.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory Bits | 16,672,768 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Core Voltage | 1.1 V | — |
| User I/O Count | 976 | — |
| 封装 | 1517-ball FC-FBGA (Flip-Chip BGA) | 1517-BBGA (FCBGA) |
| 安装类型 | Surface Mount | Surface Mount |
| Process Node | 65 nm | — |
| Embedded Multipliers | 768 (18x18) | — |
| PLL Count | 12 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Lead-Free / RoHS | Yes (RoHS compliant per DigiKey listing) | — |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Process Technology | — | 65 nm TSMC low-power CMOS |
| Speed Grade | — | C3 (commercial) |
| 工作结温 | — | 0 C to +85 C (commercial) |
| RoHS 状态 | — | Compliant |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |