EP3SE50F780C4G vs EP3SE50F780C3G 对比

详细并排对比 EP3SE50F780C4G 出自 Intel 和 EP3SE50F780C3G 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE50F780C4G EP3SE50F780C3G
品牌 Intel Altera
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $593.00 $1,030.00
Family Stratix III E Stratix III E enhanced FPGA
Series Stratix III Stratix III E
Logic Elements 47,500 LE —
Adaptive Logic Modules (ALMs) 19,000 ALM —
Embedded Memory 5.76 Mbit (5760000 bit) 5.49 Mbit (5,760,000 bit)
Number of I/Os 488 —
Number of Logic Array Blocks (LABs) [DATA_NEEDED: LAB count from datasheet] —
Number of Multipliers (18x18) [DATA_NEEDED: 18x18 multiplier count] —
Process Technology 40 nm TSMC —
Core Supply Voltage 1.1 V 1.1 V
工作温度范围 0 C to +85 C (commercial) —
封装 780-ball FBGA (FCBGA) —
安装类型 Surface Mount (SMD/SMT) —
RoHS 状态 Compliant Compliant
Lead-Free Yes —
MSL 等级 MSL3 (per JEDEC J-STD-020) —
Configuration Memory SRAM-based (volatile, requires configuration device) External (EPCS / flash)
Design Software Quartus II —
Manufacturer — Altera (now Intel)
Number of Logic Elements (LE) — 47,500 LE
Number of Adaptive Logic Modules (ALM) — 19,000 ALM
Number of User I/O — 488
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
工作温度 — 0C to +85C (Commercial)
Speed Grade — C3
封装 / 外壳 — 780-BBGA, FCBGA (Flip-Chip)
安装方式 — SMD/SMT
Packaging — Tray
生命周期状态 — Not Recommended for New Designs (NRND)

数据手册与资源

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