EP3SL70F780I4LN vs EP3SL70F780I3N 对比

详细并排对比 EP3SL70F780I4LN 出自 Intel 和 EP3SL70F780I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SL70F780I4LN EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780

EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780

EP3SL70F780I4LN ⚠ 最后一次采购

规格对比

参数 EP3SL70F780I4LN EP3SL70F780I3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 有效
库存状态 有库存 有库存
单价(USD) $1,245.00 $1,240.00
Family Stratix III L (logic-optimized) Stratix III L
Logic Elements 67,500 67,500
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Logic Array Blocks (LABs) 2,700 2,700
Embedded Memory 2,699,264 bits —
User I/Os 488 488
Operating Frequency (max) 375 MHz —
Process Node 65 nm —
Core Voltage 0.9 V 1.1 V (1.05 V to 1.15 V)
封装 780-ball FC-FBGA —
安装类型 Surface Mount Surface Mount
湿敏等级(MSL) 3 (168 hours) —
工作温度 -40C to +100C (industrial, I suffix) —
Speed Grade I4 I3 (industrial)
Lead-Free / RoHS Yes (compliant per datasheet) —
Transceivers (Gbps) [DATA_NEEDED: transceiver count] —
DSP Blocks [DATA_NEEDED: DSP block count] —
Embedded Memory (bits) — 2,699,264
Process Technology — 65 nm CMOS
Operating Frequency — 500 MHz
Package Type — 780-BBGA, FCBGA (Flip-Chip FineLine BGA)
Ball Pitch — 1.0 mm
工作结温 — -40 C to +100 C
Configuration — SRAM-based, volatile
RoHS 状态 — Compliant (per distributor listings)

数据手册与资源

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