H5AN4G8NBJR-VKC vs H5AN4G6NBJR-VKC 对比

详细并排对比 H5AN4G8NBJR-VKC 出自 SK hynix 和 H5AN4G6NBJR-VKC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5AN4G8NBJR-VKC H5AN4G8NBJR-VKC - 4Gb DDR4-2666 SDRAM x8 | SK hynix

H5AN4G8NBJR-VKC - 4Gb DDR4-2666 SDRAM x8 | SK hynix

H5AN4G8NBJR-VKC ✓ 量产中
SK hynix
H5AN4G6NBJR-VKC H5AN4G6NBJR-VKC - 4Gb DDR4 SDRAM 2666Mbps x16 | SK Hynix

H5AN4G6NBJR-VKC - 4Gb DDR4 SDRAM 2666Mbps x16 | SK Hynix

H5AN4G6NBJR-VKC ✓ 量产中

规格对比

参数 H5AN4G8NBJR-VKC H5AN4G6NBJR-VKC
品牌 SK hynix SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2.40 $12.96
存储器类型 DDR4 SDRAM DDR4 SDRAM
存储容量 4 Gb 4 Gbit
Memory Organization 512M x8 256M x 16
数据速率 2666 Mbps (DDR4-2666) 2666 Mbps
Memory Interface Parallel —
Supply Voltage (VDD) 1.2 V 1.2 V nominal (1.14 V to 1.26 V)
封装 FBGA-78 (7.5 x 11 mm) FBGA-96 / TFBGA (PBGA96)
安装类型 Surface Mount Surface Mount
Technology CMOS DRAM CMOS
Volatile / Non-Volatile Volatile —
工作温度 [DATA_NEEDED: operating temperature range] -40C to +95C
CAS 延迟 [DATA_NEEDED: CAS latency for 2666 grade] —
Refresh [DATA_NEEDED: refresh rate] Auto self-refresh
RoHS 状态 Compliant (Lead-Free & Halogen-Free per datasheet) Compliant
Packaging Tray Tray
生命周期状态 Active —
Clock Frequency — 1.6 GHz (internal reference per distributor data)
Operating Current — 38 mA (typical, per distributor data)
接口 — Parallel
Body Size — 13 mm, 1.2 mm profile, 0.8 mm ball pitch
Termination — Dynamic on-chip termination (ODT)
Calibration — ZQ calibration; write leveling
Protection Functions — Asynchronous reset; CRC; data mask

数据手册与资源

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