H5AN8G4NCJR-XXC vs K4B4G1646D-BYK00 对比

详细并排对比 H5AN8G4NCJR-xxC 出自 SK hynix 和 K4B4G1646D-BYK00 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5AN8G4NCJR-xxC H5AN8G4NCJR-xxC - 8Gb DDR4 SDRAM | SK Hynix

H5AN8G4NCJR-xxC - 8Gb DDR4 SDRAM | SK Hynix

H5AN8G4NCJR-xxC ✓ 量产中
Samsung Electronics
K4B4G1646D-BYK00 K4B4G1646D-BYK00 - 4Gb DDR3L SDRAM 256Mx16 96FBGA | Samsung

K4B4G1646D-BYK00 - 4Gb DDR3L SDRAM 256Mx16 96FBGA | Samsung

K4B4G1646D-BYK00 ✓ 量产中

规格对比

参数 H5AN8G4NCJR-xxC K4B4G1646D-BYK00
品牌 SK hynix Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $8.50 $7.50
存储器类型 DDR4 SDRAM DDR3L SDRAM
Density 8Gb 4 Gb
存储组织 x4 (H5AN8G4NCJR) 256M x 16
电源电压 1.2V 1.35 V (also operates at 1.5 V)
数据速率 [DATA_NEEDED: speed grade from xxC suffix] 1600 Mbps
封装 FBGA 96-ball TFBGA
工作温度 [DATA_NEEDED: operating temperature range] 0°C to 85°C
RoHS Compliant Compliant
Lead-Free Yes Yes
无卤 Yes Yes
安装类型 Surface Mount —
Prefetch 8-bit —
Burst Length 8 (BL8) —
Refresh Auto-refresh and self-refresh —
On-Die Termination Yes —
Number of Terminals — 96
CAS 延迟 — Programmable
Additional Features — Auto precharge, asynchronous reset, ZQ calibration, data mask, dynamic on-chip termination
Package Shape — RECTANGULAR
Temperature Grade — OTHER

数据手册与资源

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