H5AN8G4NCJR-xxC - 8Gb DDR4 SDRAM | SK Hynix
料号： H5AN8G4NCJR-xxC ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $10.1 | $1,010.00 |
| 500 | $9 | $4,500.00 |
| 1,000 | $8.5 | $8,500.00 |
H5AN8G4NCJR-xxC 概述
DDR4 SDRAM is a type of synchronous dynamic random-access memory that doubles the data rate of its predecessor DDR3, operating at higher speeds and lower voltages (typically 1.2V). It is the industry standard for main memory in servers, desktops, laptops, and networking equipment, providing the high bandwidth and density required for modern computing workloads. DDR4 memory is part of the broader DRAM family, which includes DDR3, DDR4, and DDR5, and is essential for system performance in applications ranging from cloud computing to artificial intelligence.
Key features of the H5AN8G4NCJR-xxC include a density of 8Gb, a data rate that supports high-speed operation (specific speed grade indicated by the xxC suffix), and a FBGA package that enables compact, high-density board designs. The device operates with a 1.2V power supply, reducing power consumption compared to earlier generations. It also supports on-die termination (ODT) and programmable read/write latencies, allowing system designers to optimize signal integrity and timing.
Technically, the H5AN8G4NCJR-xxC uses a CMOS process and features an 8n-prefetch architecture, which allows it to transfer 8 data bits per clock cycle per pin, achieving high bandwidth. The device includes auto-refresh and self-refresh modes for low-power standby, and it supports a burst length of 8 (BL8) for efficient data transfer. The FBGA package provides excellent thermal and electrical performance, with a ball pitch that supports high-speed signaling.
Typical applications include servers, data centers, networking equipment, and high-performance computing systems where large memory capacity and high bandwidth are critical. The device is also used in consumer electronics such as high-end desktops and gaming consoles, where DDR4 memory is the standard. Its low power consumption and high reliability make it suitable for enterprise storage and cloud infrastructure.
When designing with this device, ensure proper signal integrity by following the manufacturer's layout guidelines, including controlled impedance traces and adequate decoupling. The device requires a stable 1.2V power supply and a reference voltage (VREF) for optimal operation. Consider using the on-die termination feature to match impedance and reduce reflections on the data bus.
直接替换替代料： H5AN8G4NCJR-xxC ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： H5AN8G4NCJR-xxC （相同外形与封装尺寸） ——差异在于 Package, Supply Voltage, Memory Type, Density, Organization.
快速对比工具——选择替代料号进行并排对比：
H5AN8G8NCJR-xxC
✅ 直接替换📋 参考替代料（不在目录中）
H5AN8G6NCJR-xxC
✅ 直接替换✓ 有现货
$6.5 / 个
查看数据手册 →MT41K256M16HA-125
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$6.3636 / 个
查看数据手册 →K4B4G1646D-BYK00
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$7.5 / 个
查看数据手册 →IS43TR16256AL-125KBL
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5.6 / 个
查看数据手册 →H5AN8G4NCJR-xxC 最大额定值与电气特性
| 存储器类型 | DDR4 SDRAM |
| Density | 8Gb |
| 存储组织 | x4 (H5AN8G4NCJR) |
| 电源电压 | 1.2V |
| 封装 | FBGA |
| RoHS | Compliant |
| Lead-Free | Yes |
| 无卤 | Yes |
| 安装类型 | Surface Mount |
| Prefetch | 8-bit |
| Burst Length | 8 (BL8) |
| Refresh | Auto-refresh and self-refresh |
| On-Die Termination | Yes |
H5AN8G4NCJR-xxC 引脚配置
| 引脚 A0-A15 | Address Inputs — Row/column address inputs |
| 引脚 BA0-BA1 | Bank Address Inputs — Bank select |
| 引脚 BG0-BG1 | Bank Group Inputs — Bank group select |
| 引脚 DQ0-DQ3 | Data Input/Output — Data bus (x4) |
| 引脚 DQS | Data Strobe — Data strobe |
| 引脚 CK, CK# | Clock — Differential clock |
| 引脚 CKE | Clock Enable — Activates clock |
| 引脚 CS# | Chip Select — Selects device |
| 引脚 RAS# | Row Address Strobe — Row command |
| 引脚 CAS# | Column Address Strobe — Column command |
| 引脚 WE# | Write Enable — Write command |
| 引脚 ODT | On-Die Termination — Termination control |
| 引脚 VDD | Power Supply — 1.2V core supply |
| 引脚 VDDQ | I/O Power Supply — 1.2V I/O supply |
| 引脚 VSS | Ground — Ground |
典型应用
H5AN8G4NCJR-xxC 适用于 6 应用s: Server Main Memory, Networking Equipment, Data Center Storage, High-Performance Computing, Consumer Desktop PCs, Embedded Systems.
Server Main Memory
The H5AN8G4NCJR-xxC provides high-density, high-bandwidth memory for server applications. Its 8Gb density and DDR4 speed enable large memory pools for virtualization, cloud computing, and database workloads. The x4 organization supports ECC and advanced reliability features, making it ideal for enterprise servers where data integrity is critical. The low 1.2V operation reduces power consumption in dense memory configurations, improving overall system efficiency.
推荐
Networking Equipment
In networking equipment such as routers and switches, the H5AN8G4NCJR-xxC offers the high bandwidth needed for packet processing and forwarding. Its 8Gb density allows for large routing tables and buffering, while the DDR4 interface supports high-speed data transfer. The FBGA package is suitable for compact line cards, and the low power consumption helps manage thermal budgets in dense chassis. The device's reliability ensures stable operation in 24/7 environments.
推荐
Data Center Storage
The H5AN8G4NCJR-xxC is used in data center storage systems, including SSDs and storage servers, where high memory bandwidth and capacity are essential for caching and metadata management. Its 8Gb density enables large cache pools, improving read/write performance. The DDR4 interface provides the speed needed to keep up with NVMe and SAS controllers. The device's low power consumption is beneficial in power-constrained data centers, and its RoHS compliance meets environmental standards.
推荐
High-Performance Computing
In HPC systems, the H5AN8G4NCJR-xxC provides the memory bandwidth required for complex simulations and scientific computing. Its 8Gb density allows for large memory footprints, while the DDR4 speed supports high data throughput. The x4 organization is often used in HPC memory modules to achieve higher capacity per rank. The device's low latency and high reliability are critical for long-running compute jobs, and its 1.2V operation reduces power consumption in large clusters.
推荐
Consumer Desktop PCs
The H5AN8G4NCJR-xxC is suitable for high-end desktop PCs, providing the memory capacity and speed needed for gaming, content creation, and multitasking. Its 8Gb density allows for 16GB or 32GB memory configurations, while DDR4 speeds ensure smooth performance. The FBGA package is compatible with standard DIMM sockets, and the low power consumption helps keep system temperatures down. The device's reliability ensures stable operation for everyday use.
推荐
Embedded Systems
In embedded systems, the H5AN8G4NCJR-xxC offers high-density memory for applications such as industrial controllers, medical devices, and automotive infotainment. Its 8Gb density provides ample storage for firmware and data, while the DDR4 interface supports high-speed processing. The FBGA package is suitable for compact PCBs, and the device's low power consumption is ideal for battery-powered or thermally constrained designs. Its RoHS compliance meets regulatory requirements.
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推荐产品汇总
工程参考数据： H5AN8G4NCJR-xxC ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | H5AN8G8NCJR-xxC | H5AN8G6NCJR-xxC | MT41K256M16HA-125 | K4B4G1646D-BYK0 |
|---|---|---|---|---|---|
| Package | FBGA | FBGA | FBGA | FBGA | FBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | Micron | Samsung |
| Density | 8Gb | 8Gb | 8Gb | 4Gb | 4Gb |
| Organization | x4 | x8 | x16 | x16 | x16 |
| Supply Voltage | 1.2V | 1.2V | 1.2V | 1.35V (DDR3L) | 1.35V (DDR3L) |
| Memory Type | DDR4 | DDR4 | DDR4 | DDR3L | DDR3L |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
关键差异点
- x4 organization enables higher density per rank （对比 H5AN8G8NCJR-xxC)
- DDR4 technology with lower power consumption （对比 MT41K256M16HA-125)
- Higher density per device （对比 K4B4G1646D-BYK0)
设计说明
For DDR4 routing, maintain controlled impedance of 40-50 ohms for single-ended signals and 80-100 ohms for differential pairs. Keep trace lengths matched within 10 mils for data and address buses. Use ground planes to minimize noise and ensure proper return paths. Follow the manufacturer's layout guidelines for the FBGA package to ensure reliable soldering.
Decouple the VDD and VDDQ pins with 0.1uF and 1uF ceramic capacitors placed as close to the pins as possible. Use a dedicated power plane for 1.2V and ensure low impedance at high frequencies. The VREF pin should be bypassed with a 0.1uF capacitor to ground. Proper power integrity is essential for stable DDR4 operation.
The FBGA package has a thermal resistance that depends on PCB design. Ensure adequate airflow and consider adding thermal vias under the package to improve heat dissipation. The device's power consumption is relatively low, but in dense memory arrays, thermal management is important to maintain reliability. Monitor junction temperature to stay within the specified range.
合规信息
Lead-Free and Halogen-Free per datasheet. RoHS compliant. No AEC-Q100 qualification for memory components.
