H5AN8G8NAFR-VKC vs H5AN8G8NCJR-PBC 对比

详细并排对比 H5AN8G8NAFR-VKC 出自 SK hynix 和 H5AN8G8NCJR-PBC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5AN8G8NAFR-VKC H5AN8G8NAFR-VKC - 8Gb DDR4-2666 SDRAM 1.2V | SK hynix

H5AN8G8NAFR-VKC - 8Gb DDR4-2666 SDRAM 1.2V | SK hynix

H5AN8G8NAFR-VKC ✓ 量产中
SK hynix
H5AN8G8NCJR-PBC H5AN8G8NCJR-PBC - 8Gb DDR4 SDRAM, 1.2V | SK Hynix

H5AN8G8NCJR-PBC - 8Gb DDR4 SDRAM, 1.2V | SK Hynix

H5AN8G8NCJR-PBC ✓ 量产中

规格对比

参数 H5AN8G8NAFR-VKC H5AN8G8NCJR-PBC
品牌 SK hynix SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $4.15 $2.40
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 8 Gb —
存储组织 1G x 8 1G x 8 (x8)
Speed Grade DDR4-2666 (VKC bin) —
Supply Voltage (VDD) 1.2 V 1.2 V
接口 SSTL12 —
Burst Length 8 (BL8) BL8
Bank Group Architecture Supported (per DDR4 JEDEC architecture) —
On-Die Termination (ODT) Yes —
DLL Yes (DLL for output skew control) —
封装 78-ball FBGA 78-ball FBGA
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
RoHS 状态 Compliant (Lead-Free & Halogen-Free) Lead-Free & Halogen-Free
Process Technology CMOS —
Recommended Application Main memory requiring large density and high bandwidth —
存储容量 — 8 Gb (1 GB)
Interface Voltage (VDDQ) — 1.2 V (SSTL12)
数据速率 — [DATA_NEEDED: data rate for -PBC speed grade (Mbps/MT/s)]
Architecture — CMOS, fully synchronous, dual-edge clocked
Bank Structure — 8 internal banks, bank-group architecture
特性 — ODT, DM, DQS strobes, programmable CAS latency, self-refresh
Die Revision Family — CJR (H5AN8G8NCJR-xxC)
Refresh — Auto-refresh and self-refresh
Typical Applications — PC/server main memory, embedded solder-down memory

数据手册与资源

浏览全部产品 创建 BOM 获取报价