IMLT65R040M2HXTMA1 vs IMLT65R060M2HXTMA1 对比
详细并排对比 IMLT65R040M2HXTMA1 出自 Infineon 和 IMLT65R060M2HXTMA1 出自 Infineon。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | IMLT65R040M2HXTMA1 | IMLT65R060M2HXTMA1 |
|---|---|---|
| 品牌 | Infineon | Infineon |
| 分类 | MOSFETs | MOSFETs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $4.25 | $5.18 |
| Manufacturer | Infineon Technologies | Infineon Technologies |
| Product Family | CoolSiC™ G2 (2nd generation SiC trench) | — |
| Technology | Silicon Carbide (SiC) N-channel MOSFET | Silicon Carbide (SiC) MOSFET, N-Channel |
| Drain-Source Voltage (VDS) | 650 V | 650 V |
| Continuous Drain Current (ID, TC) | 57 A | — |
| Pulsed Drain Current (ID,pulse) | 143 A | — |
| On-State Resistance RDS(on) (typ, VGS=18V) | 40 mΩ | — |
| On-State Resistance RDS(on) (max, VGS=18V) | 49 mΩ | — |
| Total Gate Charge QG | 28 nC | — |
| Output Charge QOSS @ 400 V | 53 nC | — |
| Output Energy EOSS @ 400 V | 7.2 µJ | — |
| Continuous Drain Power Dissipation (PD, TC) | 268 W | — |
| Recommended Gate Drive Voltage VGS | 18 V (turn-off: 0 V or negative) | — |
| 工作结温 | -55 °C to +150 °C | — |
| 封装 | PG-HDSOP-16-6 (surface mount, top-side-cooled) | PG-HDSOP-16-6 (TOLT) with .XT interconnection |
| 安装类型 | Surface Mount | Surface Mount |
| Qualification | JEDEC industrial | JEDEC-qualified for Industrial Applications |
| Packaging | Tape & Reel | — |
| Special Features | Kelvin source pin, low reverse-recovery charge, hard-switching optimized | — |
| Series | — | CoolSiC™ G2 |
| Typical RDS(on) | — | 60 mΩ |
| Maximum RDS(on) | — | 73 mΩ |
| Continuous Drain Current (Tc) | — | 40 A |
| 脉冲漏极电流 | — | 96 A |
| Total Power Dissipation (Tc) | — | 200 W |
| Total Gate Charge (Qg) | — | 18 nC |
| Gate-Drain Charge at 400 V (Qgd) | — | 36 nC |
| Output Capacitance Stored Energy at 400 V (Eoss) | — | 4.8 µJ |
| Gate Threshold Voltage (VGS(th)) | — | 4.5 V (benchmark) |
| 引脚数量 | — | 16 |