K4A8G085WB-BIRC vs K4A8G085WB-BICR 对比
详细并排对比 K4A8G085WB-BIRC 出自 Samsung Electronics 和 K4A8G085WB-BICR 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Samsung Electronics
K4A8G085WB-BICR - Samsung 8Gb DDR4 1Gx8 2400Mbps Industrial
K4A8G085WB-BICR ✓ 量产中规格对比
| 参数 | K4A8G085WB-BIRC | K4A8G085WB-BICR |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $6.56 | $4.25 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gb |
| 存储组织 | 1G x 8 | 1G x 8 |
| 数据速率 | 2400 Mbps | 2400 Mbps |
| 电源电压 | 1.2 V | 1.2 V (VDD/VDDQ) |
| 工作温度 | -40°C to 95°C | — |
| 封装 | 78-FBGA | 78-ball FBGA |
| Number of Terminals | 78 | — |
| Refresh Cycles | 8192 | 8192 |
| Die Family | B-die | — |
| CAS 延迟 | [DATA_NEEDED: CAS Latency] | — |
| Burst Length | 8, 16 | — |
| 接口 | SSTL-12 | — |
| RoHS | Compliant | — |
| 安装类型 | Surface Mount | Surface Mount |
| Number of Banks | — | 16 |
| 引脚数量 | — | 78 |
| Temperature Grade | — | Industrial (I-grade) |
| 工作温度范围 | — | [DATA_NEEDED: exact temperature range for BICR industrial suffix] |
| Die / Process | — | Samsung 8Gb B-die DDR4 |
| Speed Grade | — | DDR4-2400 (PC4-19200) |
| RoHS 状态 | — | Compliant |
| Lead-Free | — | Yes |
| Refresh Management | — | Row refresh, auto-refresh and self-refresh supported |