K4A8G165WC-BCPB vs K4A8G165WB-BCRC 对比
详细并排对比 K4A8G165WC-BCPB 出自 Samsung Electronics 和 K4A8G165WB-BCRC 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4A8G165WC-BCPB | K4A8G165WB-BCRC |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1.31 | $12.57 |
| 存储器类型 | DDR4 SDRAM (volatile DRAM) | DDR4 SDRAM (DRAM, volatile) |
| 存储容量 | 8 Gb | 8 Gb (1 GB) |
| Memory Organization | 512M x 16 | 512M x 16 |
| 数据速率 | DDR4-2133 (2133 Mbps/pin) | 2400 Mbps (PC4-19200) |
| 电源电压 | 1.2 V | 1.2 V (1.14 V to 1.26 V) |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| 接口 | DDR4 (16-bit data bus) | DDR4 (Double Data Rate, synchronous) |
| 封装 | 96-ball FBGA (TFBGA) | 96-ball FBGA (PBGA96) |
| Die Generation | C-die (1Y nm class) | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | 0C to +95C | -40C to +95C |
| 特性 | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask | — |
| Termination | On-die termination (ODT), dynamic | — |
| MSL 等级 | [DATA_NEEDED: MSL Level] | — |
| RoHS 状态 | Compliant | Compliant |
| Standard | JEDEC DDR4 SDRAM | — |
| Technology | — | CMOS DRAM, Samsung 8Gb B-die |
| Ball Pitch | — | 0.8 mm |
| On-Die Termination | — | Yes (ODT with dynamic ODT) |
| ZQ Calibration | — | Yes |
| CRC / CA Parity | — | Yes (CRC function) |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| Refresh | — | Auto-refresh and self-refresh |