K4A8G165WC-BCPB - 8Gb DDR4-2133 SDRAM 96-FBGA | Samsung
料号： K4A8G165WC-BCPB ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.74 | $1.74 |
| 10 | $1.66 | $16.60 |
| 100 | $1.55 | $155.00 |
| 500 | $1.42 | $710.00 |
| 1,000 | $1.31 | $1,310.00 |
K4A8G165WC-BCPB 概述
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random Access Memory) is the fourth generation of the DDR DRAM family, sitting within the broader hierarchy of volatile memory -> DRAM -> synchronous DRAM -> DDR SDRAM -> power-management-intensive main-memory ICs. Compared with DDR3, DDR4 lowers the operating voltage from 1.5 V to 1.2 V, doubles bank groups for higher bandwidth, and adds features such as bank group architecture, DLL-on/off modes, and per-DRAM addressability.
Key features of the K4A8G165WC-BCPB include the wide x16 data interface, which simplifies controller routing for embedded designs; auto precharge and asynchronous reset functions; CRC and parity support on critical signals; ZQ calibration for output driver impedance; dynamic on-chip termination (ODT); and a data mask (DM) function for partial writes. The 1.2 V rail reduces system power roughly 25% versus equivalent DDR3 solutions.
Technically, the device uses internal bank groups that allow interleaved accesses for higher effective bandwidth, a programmable DLL for output timing alignment, and programmable CAS latency appropriate to the 2133 Mbps/pin class. The 96-ball FBGA lead-free package measures approximately 7.5 mm x 10 mm x 0.8 mm and suits high-density soldered-down memory subsystems.
Typical applications include embedded industrial controllers, networking equipment line cards, set-top boxes, and FPGA-based processing systems that require soldered 8 Gb DDR4 with a 16-bit data bus, such as Xilinx Zynq UltraScale+ or AMD/Intel embedded platforms.
Design consideration: DDR4 fly-by routing requires proper on-die termination tuning, length-matched address/command groups, and VTT termination supply design; verify the controller supports the x16 organization, since x8 modules use a different 78-ball footprint.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Prices as of 2026-09-04.
直接替换替代料： K4A8G165WC-BCPB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： K4A8G165WC-BCPB （相同外形与封装尺寸） ——差异在于 Package, Data Rate, Operating Temperature, Interface, Memory Type.
快速对比工具——选择替代料号进行并排对比：
K4A8G165WB-BCPB
✅ 直接替换✓ 有现货
$2.3 / 个
查看数据手册 →K4A8G165WC-BCTD
✅ 直接替换✓ 有现货
$41.2 / 个
查看数据手册 →K4A8G165WC-BCRC
✅ 直接替换✓ 有现货
$23 / 个
查看数据手册 →K4A8G165WC-BCWE
✅ 直接替换✓ 有现货
$38 / 个
查看数据手册 →K4A8G165WB-BCTD
✅ 直接替换✓ 有现货
$37 / 个
查看数据手册 →K4A8G165WB-BCRC
✅ 直接替换✓ 有现货
$12.57 / 个
查看数据手册 →K4A8G165WB-BCWE
✅ 直接替换✓ 有现货
$6.55 / 个
查看数据手册 →K4A8G165WC-BCPB 最大额定值与电气特性
| 存储器类型 | DDR4 SDRAM (volatile DRAM) |
| 存储容量 | 8 Gb |
| Memory Organization | 512M x 16 |
| 数据速率 | DDR4-2133 (2133 Mbps/pin) |
| 电源电压 | 1.2 V |
| Operating Voltage Range | 1.14 V to 1.26 V |
| 接口 | DDR4 (16-bit data bus) |
| 封装 | 96-ball FBGA (TFBGA) |
| Die Generation | C-die (1Y nm class) |
| 安装类型 | Surface Mount |
| 工作温度 | 0C to +95C |
| 特性 | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask |
| Termination | On-die termination (ODT), dynamic |
| RoHS 状态 | Compliant |
| Standard | JEDEC DDR4 SDRAM |
K4A8G165WC-BCPB 96-ball fbga (tfbga) 引脚配置指南
K4A8G165WC-BCPB（96-ball fbga (tfbga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： K4A8G165WC-BCPB.
请参阅 数据手册 以查看完整引脚配置。
典型应用
K4A8G165WC-BCPB 适用于 6 应用s: Embedded Industrial Controllers, Networking Equipment Line Cards, FPGA-Based Processing Systems, Set-Top Boxes and Smart Home Gateways, Test and Measurement Instrumentation, Automotive-Adjacent Embedded Gateways (Industrial Grade).
Embedded Industrial Controllers
Industrial PLCs and edge controllers need soldered, high-density main memory with long-term availability. The K4A8G165WC-BCPB provides 8 Gb in a single 512M x16 chip at 1.2 V, cutting memory power versus DDR3 by roughly 25%, and its 96-ball FBGA package survives vibration better than SODIMM modules. Placed on a fly-by or matched-length DDR4 bus with dynamic ODT and ZQ calibration enabled, it sustains DDR4-2133 throughput for real-time control data logging. The 0C to +95C operating range covers typical industrial enclosure conditions, and the x16 bus halves component count versus x8, reducing BOM risk.
推荐
Networking Equipment Line Cards
Switch and router line cards use soldered DDR4 for packet buffers, routing tables, and control-plane memory. The K4A8G165WC-BCPB's 2133 Mbps/pin data rate delivers the bandwidth needed for queue management, while CRC support improves data integrity on high-availability links and the asynchronous reset function simplifies system-level fault recovery. Its 96-ball FBGA footprint allows multiple chips to be stacked on a matched-length bus for larger buffers. Dynamic ODT termination reduces signal-integrity tuning effort on multi-drop topologies common in networking backplane-adjacent designs.
推荐
FPGA-Based Processing Systems
FPGA image-processing and data-acquisition systems require large on-board frame buffers. The K4A8G165WC-BCPB's x16 organization lets a single chip provide a 16-bit DDR4 interface, simplifying FPGA bank placement versus two x8 devices. At DDR4-2133, one chip delivers roughly 4.2 GB/s of peak bandwidth, sufficient for multi-stream video line buffering. Enable the memory controller's ZQ calibration and train at board bring-up; use the data mask function for partial frame writes to avoid read-modify-write overhead on video payloads.
推荐
Set-Top Boxes and Smart Home Gateways
IPTV set-top boxes and home gateways run rich UI stacks and video pipelines that need gigabyte-class soldered memory. The K4A8G165WC-BCPB's 8 Gb density in one FBGA saves board area versus multiple lower-density chips, and its 1.2 V rail aligns with energy-efficiency targets for always-on consumer equipment. DDR4-2133 bandwidth supports simultaneous 4K decode buffering and network traffic. The device's auto precharge function improves page-hit efficiency for streaming access patterns, and RoHS compliance keeps consumer certification straightforward.
推荐
Test and Measurement Instrumentation
Oscilloscope, logic analyzer, and data-recorder front ends capture long acquisition records that overflow on-chip SRAM, so soldered DDR4 is used for deep capture memory. The K4A8G165WC-BCPB offers 8 Gb per chip at DDR4-2133, enabling multi-gigasample streaming architectures with sequential burst writes. ZQ calibration keeps output impedance accurate over temperature, protecting eye margins on long PCB traces typical of instrument backplanes. The asynchronous reset input allows the host to recover the memory subsystem without a full power cycle between captures.
推荐
Automotive-Adjacent Embedded Gateways (Industrial Grade)
Telematics gateways, fleet recorders, and off-highway equipment controllers use industrial-grade soldered DDR4 rather than AEC-Q100 memory. The K4A8G165WC-BCPB suits these designs where 0C to +95C operation is acceptable, providing 8 Gb for map, log, and communication buffering at DDR4-2133. The 96-ball FBGA's soldered attachment resists shock and vibration better than connectors, and the low 1.2 V rail reduces total power draw in battery-backed or energy-harvesting nodes. Verify the wider automotive temperature requirement before using it inside the passenger compartment ECU domain.
推荐
推荐产品汇总
工程参考数据： K4A8G165WC-BCPB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | K4A8G165WB-BCPB | K4A8G165WC-BCTD | K4A8G165WC-BCRC | K4A8G165WB-BCWE |
|---|---|---|---|---|---|
| Package | 96-ball FBGA (TFBGA) | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Size | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Supply Voltage | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) |
| Die Generation | C-die | B-die | C-die | C-die | B-die |
| Speed Grade (suffix) | PB (DDR4-2133 class) | PB (DDR4-2133 class) | TD (higher grade) | RC (lower grade) | WE (higher grade) |
关键差异点
- Newer C-die silicon generation （对比 K4A8G165WB-BCPB)
- Lowest quoted price among verified family members （对比 K4A8G165WC-BCTD)
- x16 organization halves component count （对比 K4A8G085WC-BCPB)
设计说明
Route DDR4 address/command/control as a fly-by topology with length-matched traces and tune write leveling and read training in the controller. The K4A8G165WC-BCPB's dynamic ODT and ZQ calibration help maintain eye margins at DDR4-2133, but you must still control trace impedance (40-50 ohm single-ended) and keep data-group skew within controller specifications. Run full DRAM training at board bring-up for every PCB stackup revision, since impedance changes shift the trained delays.
The device operates at 1.2 V nominal (1.14 V to 1.26 V) with separate VDD, VDDQ, and VPP rails per JEDEC DDR4 practice. Estimated: at DDR4-2133 with moderate utilization, a single 8 Gb x16 chip draws on the order of a few hundred milliwatts; use a dedicated buck regulator such as the TPS54218 for VDD/VDDQ and a proper VTT termination supply with bulk capacitance at the package. Keep rail ripple below the JEDEC DDR4 tolerance band to avoid refresh errors.
The most common substitution error is mixing organizations: the K4A8G085WC series (x8) uses a 78-ball FBGA that is physically incompatible with the 96-ball footprint of this x16 part. Also verify the speed-grade suffix (PB/RC/TD/WE) against your controller's validated timing table before BOM swaps, and do not assume B-die (WB family) timing settings carry over unchanged to C-die (WC family) silicon even when the footprint is identical.
Place the 96-ball FBGA within 50 mm of the controller where possible, keep the DRAM on a solid reference plane, and reserve space for series termination resistors on address/command nets. For multi-chip topologies, use fly-by routing of address/command with daisy-chained ODT, and length-match data groups per byte lane. Provide thermal relief via the PCB since FBGA packages dissipate heat through the ball field.
合规信息
RoHS compliance and lead-free FBGA package per distributor listings (LCSC, JLCPCB). REACH, halogen-free, and conflict-minerals declarations should be confirmed via Samsung's official environmental documentation.
