K4AAG085WM-BCWE vs K4AAG165WM-BCWE 对比
详细并排对比 K4AAG085WM-BCWE 出自 Samsung Electronics 和 K4AAG165WM-BCWE 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4AAG085WM-BCWE | K4AAG165WM-BCWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | DRAM | DRAM |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7.00 | $54.65 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gb | 16 Gbit |
| 存储组织 | 2G x 8 | 256M x 16 (1G x 16) |
| 数据速率 | 3200 Mbps (DDR4-3200) | 3200 Mbps |
| 电源电压 | 1.2 V | — |
| 工作温度 | 0C to +85C | [DATA_NEEDED: temperature range for WM-BCWE] |
| 封装 | 78FBGA | 78-ball FBGA |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | DDR4 (JEDEC-standard) | Parallel (DDR4) |
| Bank Group Architecture | Yes (DDR4) | — |
| Speed Grade Suffix | -BCWE | — |
| Application Class | Memory IC / Storage Component | — |
| Power Reduction vs DDR3 | Approx. 25% lower (per Samsung DDR4 literature) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| Supply Voltage VDD | — | 1.2 V |
| Supply Voltage VDDQ | — | 1.2 V |
| Access Time (Clock Cycle Time) | — | [DATA_NEEDED: tCK for BCWE bin] |
| CAS 延迟 | — | [DATA_NEEDED: CL at 3200 Mbps] |
| Bank Groups | — | 4 (x16 configuration) |
| Burst Length | — | 8 |
| Die Revision | — | W (WM suffix) |
| Operating Frequency | — | 1600 MHz (DDR, 3200 Mbps) |