K4RAH086VE-BCWM vs K4RBH086VB-BCQK 对比

详细并排对比 K4RAH086VE-BCWM 出自 Samsung Electronics 和 K4RBH086VB-BCQK 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4RAH086VE-BCWM K4RAH086VE-BCWM - DDR5 16Gb 5600Mbps DRAM | Samsung Electronics

K4RAH086VE-BCWM - DDR5 16Gb 5600Mbps DRAM | Samsung Electronics

K4RAH086VE-BCWM ✓ 量产中
Samsung Electronics
K4RBH086VB-BCQK K4RBH086VB-BCQK - DDR5 16Gb 4800Mbps DRAM | Samsung

K4RBH086VB-BCQK - DDR5 16Gb 4800Mbps DRAM | Samsung

K4RBH086VB-BCQK ✓ 量产中

规格对比

参数 K4RAH086VE-BCWM K4RBH086VB-BCQK
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $7.60 $0.00
存储器类型 DDR5 SDRAM DDR5 SDRAM
Density 16 Gb 16 Gb
存储组织 2G x 8 2G x 8
数据速率 5600 Mbps 4800 Mbps
Supply Voltage (VDD) 1.1 V 1.1 V
封装 82-ball FBGA FBGA-82
安装类型 Surface Mount Surface Mount
工作温度 0C to +85C [DATA_NEEDED: operating temperature range]
Generation DDR5 —
Bank Groups [DATA_NEEDED: bank group count] —
CAS 延迟 [DATA_NEEDED: CL at 5600 Mbps] —
VDDQ Voltage [DATA_NEEDED: VDDQ value] —
Refresh [DATA_NEEDED: refresh rate] [DATA_NEEDED: refresh rate 32ms/64ms]
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
生命周期状态 Mass Production —
Manufacturer Samsung Electronics —
接口 — DDR5 (CA bus, ODECC)
On-die ECC — Yes
CAS Latency (CL) — [DATA_NEEDED: CAS latency at 4800 Mbps]
Power Supply Rails — VDD/VDDQ 1.1 V (PMIC on module)
MSL 等级 — [DATA_NEEDED: moisture sensitivity level]
Packaging — [DATA_NEEDED: tray or tape and reel standard quantity]

数据手册与资源

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