K4RAH165VB-BIWM vs K4RAH165VB-BCQK 对比

详细并排对比 K4RAH165VB-BIWM 出自 Samsung Electronics 和 K4RAH165VB-BCQK 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4RAH165VB-BIWM K4RAH165VB-BIWM - 16Gb DDR5 1Gx16 5600Mbps DRAM | Samsung

K4RAH165VB-BIWM - 16Gb DDR5 1Gx16 5600Mbps DRAM | Samsung

K4RAH165VB-BIWM ✓ 量产中
Samsung Electronics
K4RAH165VB-BCQK K4RAH165VB-BCQK - 16Gb DDR5 SDRAM 4800Mbps 1.1V | Samsung

K4RAH165VB-BCQK - 16Gb DDR5 SDRAM 4800Mbps 1.1V | Samsung

K4RAH165VB-BCQK ✓ 量产中

规格对比

参数 K4RAH165VB-BIWM K4RAH165VB-BCQK
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $0.00
存储器类型 DDR5 SDRAM DDR5 SDRAM
Density 16 Gb —
存储组织 1G x 16 —
数据速率 5600 Mbps 4800 Mbps
电源电压 1.1 V —
封装 106-ball FBGA 106-ball FBGA
工作温度 0C to +85C 0C to +85C
On-Die ECC Yes (per K4RAH165VB family datasheet) —
Self Refresh Auto self-refresh —
Reset Function Asynchronous reset —
Write Leveling Yes —
CRC Function Yes —
ZQ Calibration Yes —
DLL DLL enabled mode of operation (per datasheet) —
安装类型 Surface Mount Surface Mount
Standard Packaging 1000 units —
RoHS 状态 Compliant (per JLCPCB listing for K4RAH165VB-BCWM, same family) [DATA_NEEDED: RoHS status]
存储容量 — 16 Gb
Memory Organization — 1G x 16
Memory Interface — Parallel
Supply Voltage (VDD) — 1.1 V
Error Correction — On-die ECC
特性 — Auto self-refresh, asynchronous reset, on-chip ECC, write leveling, CRC, ZQ calibration
Memory Format — DRAM (volatile)
Packaging — Tray
生命周期状态 — Active
Unit Price — [DATA_NEEDED: unit price]

数据手册与资源

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