K4RHE086VB-BCWM vs K4RAH086VB-BIQK 对比
详细并排对比 K4RHE086VB-BCWM 出自 Samsung Electronics 和 K4RAH086VB-BIQK 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4RHE086VB-BCWM | K4RAH086VB-BIQK |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7.65 | $4.25 |
| 存储器类型 | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb | 16 Gb |
| 存储组织 | 2G x 8 | 2G x 8 |
| 数据速率 | 5600 Mbps | 4800 Mbps/pin |
| 电源电压 | 1.1 V | — |
| 封装 | 82 FBGA | 82FBGA |
| 安装类型 | Surface Mount | — |
| 接口 | DDR5 (JEDEC) | DDR5 (CA reduced pin count) |
| Configuration | x8 | X8 |
| Application Segment | Server / Data Center / Premium PC | — |
| Manufacturer | Samsung Semiconductor | — |
| RoHS 状态 | unknown | Compliant (Lead-Free & Halogen-Free per Samsung 82FBGA) |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Access Time / CAS Latency | [DATA_NEEDED: CAS latency] | — |
| On-Die ECC | [DATA_NEEDED: on-die ECC support] | — |
| Package Height | [DATA_NEEDED: package height] | — |
| Core Supply Voltage | — | 1.1 V (nominal) |
| Speed Grade | — | BIQK (-BIQK bin) |
| ECC | — | On-die ECC (DDR5 standard) |
| Burst Length | — | 16 / 32 |
| Operating Mode | — | DLL enabled |
| CAS 延迟 | — | [DATA_NEEDED: CAS latency (CL)] |
| Refresh | — | [DATA_NEEDED: refresh rate specification] |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |