K6X1008C2D-BF55 vs K6X1008C2D-BF70 对比
详细并排对比 K6X1008C2D-BF55 出自 Samsung Electro-Mechanics 和 K6X1008C2D-BF70 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Samsung Electro-Mechanics
K6X1008C2D-BF55 - 128Kx8 Low Power CMOS SRAM | Samsung
K6X1008C2D-BF55 ObsoleteSamsung Electronics
K6X1008C2D-BF70 - 128Kx8 70ns Low Power CMOS SRAM | Samsung
K6X1008C2D-BF70 Nrnd规格对比
| 参数 | K6X1008C2D-BF55 | K6X1008C2D-BF70 |
|---|---|---|
| 品牌 | Samsung Electro-Mechanics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1.18 | $1.28 |
| 存储器类型 | Asynchronous CMOS Static RAM (SRAM) | Volatile SRAM (asynchronous, static) |
| Memory Organization | 128K x 8 bit (1 Mbit) | 128K x 8 (1 Mbit total) |
| Density | 1 Mbit | — |
| Access Time | 55 ns | 70 ns |
| Supply Voltage (VCC) | 5 V (single supply) | [DATA_NEEDED: VCC range] |
| Operating Current (ICC) | 30 mA typical | — |
| Standby Current (ICC2) | [DATA_NEEDED: standby current value] | — |
| 接口 | Parallel, asynchronous | — |
| 数据总线宽度 | 8 bit | — |
| Address Bus Width | 17 bit | — |
| 封装 | 32-SOP-525 (SOP-32) | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | [DATA_NEEDED: operating temperature grade] | — |
| Data Retention Voltage | Low data retention voltage supported | — |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| Lead-Free | Yes (Lead-Free variant) | — |
| RoHS 状态 | Compliant | — |
| Cell Technology | 6T CMOS memory cell | — |
| Number of Words | — | 131,072 |
| Bits per Word | — | 8 |
| 接口类型 | — | Parallel, asynchronous |
| I/O Compatibility | — | TTL-compatible |
| Operating Mode | — | Fully static (no clock, no refresh) |
| Package Type | — | 32-SOP-525 (PDSO32) |
| Speed Grade Suffix | — | BF70 (= 70 ns) |
| 工作温度范围 | — | [DATA_NEEDED: temperature grade] |
| Active Supply Current (ICC) | — | [DATA_NEEDED: ICC max] |
| CMOS Standby Current (ICC2) | — | [DATA_NEEDED: ICC2 max] |
| Output Enable (OE) Pin | — | Yes (three-state outputs) |
| Write Enable (WE) Pin | — | Yes |
| Chip Enable (CE) Pin | — | Yes |
| Lead-Free Finish | — | Yes (per datasheet revision history) |
| Process Technology | — | Low-power CMOS |