K9HCG08U1M vs K9XXG08UXM 对比
详细并排对比 K9HCG08U1M 出自 Samsung Electronics 和 K9XXG08UXM 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K9HCG08U1M | K9XXG08UXM |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $0.00 |
| Memory Technology | MLC NAND Flash | — |
| Total Capacity | 64 Gbit | — |
| 存储组织 | 8G x 8 | — |
| 数据总线宽度 | 8 bit | — |
| 接口类型 | Asynchronous NAND (multiplexed address/data/command) | — |
| 电源电压 | [DATA_NEEDED: supply voltage] | 2.7 V to 3.6 V |
| Page Size | [DATA_NEEDED: page size] | (2K + 64) Byte |
| Block Size | [DATA_NEEDED: block size] | (256K + 8K) Byte |
| Read Time (tR) | [DATA_NEEDED: read time] | — |
| Program Time (tPROG) | [DATA_NEEDED: program time] | — |
| Program/Erase Cycles | [DATA_NEEDED: endurance] | — |
| 封装 | TSOP-48 (PDSO48) | 48-pin TSOP |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -40C to +105C (TA) | [DATA_NEEDED: Operating Temperature] |
| Ready/Busy Output | Yes (R/B#) | — |
| Die Technology | Samsung E-die (per datasheet family) | — |
| Full Ordering Code | K9HCG08U1M-PCB0 / K9HCG08U1M-PCB0T00 | — |
| 存储容量 | — | 2G x 8 Bit (2Gb) |
| Memory Cell Array Organization | — | (1G + 32M) bit x 8 bit |
| Data Register | — | (2K + 64) bit x 8 bit |
| Program Operation | — | Automatic Page Program, (2K + 64) Byte |
| Erase Operation | — | Automatic Block Erase, (256K + 8K) Byte |
| I/O Interface | — | 8-bit multiplexed address/data/command |
| Control Signals | — | CLE, ALE, CE, RE, WE, WP, R/B |
| Cell Type | — | SLC (single-level cell) NAND |
| Access Time (tR) | — | [DATA_NEEDED: Access Time] |
| RoHS 状态 | — | [DATA_NEEDED: RoHS Status] |