MPC8347CZQAGDB-FR vs MPC8343CVRAGDB 对比

详细并排对比 MPC8347CZQAGDB-FR 出自 NXP Semiconductors 和 MPC8343CVRAGDB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8347CZQAGDB-FR MPC8347CZQAGDB-FR - 400MHz PowerQUICC II Pro MPU | NXP

MPC8347CZQAGDB-FR - 400MHz PowerQUICC II Pro MPU | NXP

MPC8347CZQAGDB-FR Obsolete
NXP Semiconductors
MPC8343CVRAGDB MPC8343CVRAGDB - PowerQUICC II Pro 400MHz SoC | NXP

MPC8343CVRAGDB - PowerQUICC II Pro 400MHz SoC | NXP

MPC8343CVRAGDB ✗ 停产

规格对比

参数 MPC8347CZQAGDB-FR MPC8343CVRAGDB
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 Obsolete 停产
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Series MPC83xx (PowerQUICC II Pro) PowerQUICC II Pro
Core Processor PowerPC e300 PowerPC e300
Number of Cores 1 1
数据总线宽度 32-bit 32-bit
Core Frequency 400 MHz —
Bus Speed 133 MHz (per core spec) —
L1 Cache (I/D) 32 KB / 32 KB —
FPU Double-precision hardware FPU —
MMU Yes (hardware) —
RAM Controllers DDR1 / DDR2 (up to 333 MHz) —
Ethernet 2x 10/100/1000 Mbps (GMII/RGMII/TBI) Dual 10/100/1000 (GigE)
PCI 2x PCI 2.3 (1x 64-bit/66 MHz, 1x 32-bit/66 MHz) Dual PCI (PCI 2.3)
USB Hi-Speed USB 2.0 (Host/Device/OTG) Hi-Speed USB 2.0
封装 620-TEPBGA II (29x29 mm, 1 mm pitch) —
Height 2.46 mm max —
Supply Voltage (Core) 1.2 V —
工作温度 -40C to +105C —
安装类型 Surface Mount (BGA) Surface Mount
Lead Free Yes (FR suffix) —
RoHS 状态 Compliant —
QUICC Engine Yes (HDLC/ATM/Ethernet offload) —
Part Family — MPC8343EA
Core Architecture — Power Architecture (Book E enhancements)
最大时钟频率 — 400 MHz
电源电压 — 1.2 V core / 1.8 V / 2.5 V / 3.3 V I/O
工作温度范围 — -40 °C to +105 °C
Package Type — 620-HBGA (Hi-TCE, 29 mm × 29 mm, 1 mm pitch)
Lead-Free / RoHS — Yes / Compliant
Memory Controller — DDR1 / DDR2
Security Accelerator — DES / 3DES / AES / IPSec / SSL/TLS
Silicon Revision — Rev 2.1

数据手册与资源

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