MPC860DEZQ50D4 vs MC860ENCVR50D4R2 对比

详细并排对比 MPC860DEZQ50D4 出自 NXP Semiconductors 和 MC860ENCVR50D4R2 出自 NXP。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC860DEZQ50D4 MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP

MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP

MPC860DEZQ50D4 Nrnd

规格对比

参数 MPC860DEZQ50D4 MC860ENCVR50D4R2
品牌 NXP Semiconductors NXP
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $24.95 $138.00
Processor Type MPC8xx PowerQUICC, 32-bit —
Core Architecture Power Architecture (embedded) PowerPC 32-bit
Core Frequency 50 MHz —
Communications Processor Module CPM with HDLC, Ethernet, PCMCIA, SCC —
Ethernet MAC 10/100 Mbps integrated —
HDLC/SDLC Channels Yes (multi-channel) —
PCMCIA Interface Yes —
Supply Voltage (I/O) 3.3 V —
封装 357-Ball PBGA (25x25 mm) —
安装类型 Surface Mount (BGA) Surface Mount, BGA
工作温度 0 C to +95 C [DATA_NEEDED: Operating Temperature]
RoHS 状态 Contains Lead (legacy BGA) RoHS compliant
Lead-Free Status Contains Lead —
Packaging Tray Digi-Reel / Tape and Reel
Sub-Brand Heritage Freescale / NXP PowerQUICC —
Processor Family — MPC8xx PowerQUICC
Core Count — 1
最大时钟频率 — 50 MHz
工作电源电压 — 3.3 V
封装 / 外壳 — 357-BBGA (PBGA, 25 x 25 mm)
Pitch — 1.27 mm
Lead Free Status — Lead Free
Communications Module — CPM (SCC/SMC/UART/SPI)
JTAG / Debug Interface — Yes (BDM/JTAG)
Memory Controller — Integrated DRAM/SRAM/Flash + PCMCIA
Process Technology — 0.32 um CMOS

数据手册与资源

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