MPC860DEZQ50D4 vs MC860ENCVR50D4R2 Vergleich
Detaillierter Direktvergleich von MPC860DEZQ50D4 von NXP Semiconductors und MC860ENCVR50D4R2 von NXP. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC860DEZQ50D4 | MC860ENCVR50D4R2 |
|---|---|---|
| Marke | NXP Semiconductors | NXP |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,95 | $138,00 |
| Processor Type | MPC8xx PowerQUICC, 32-bit | — |
| Core Architecture | Power Architecture (embedded) | PowerPC 32-bit |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Gehäuse | 357-Ball PBGA (25x25 mm) | — |
| Montageart | Surface Mount (BGA) | Surface Mount, BGA |
| Betriebstemperatur | 0 C to +95 C | [DATA_NEEDED: Operating Temperature] |
| RoHS-Status | Contains Lead (legacy BGA) | RoHS compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Digi-Reel / Tape and Reel |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Processor Family | — | MPC8xx PowerQUICC |
| Core Count | — | 1 |
| Maximale Taktfrequenz | — | 50 MHz |
| Betriebsversorgungsspannung | — | 3.3 V |
| Gehäuse / Bauform | — | 357-BBGA (PBGA, 25 x 25 mm) |
| Pitch | — | 1.27 mm |
| Lead Free Status | — | Lead Free |
| Communications Module | — | CPM (SCC/SMC/UART/SPI) |
| JTAG / Debug Interface | — | Yes (BDM/JTAG) |
| Memory Controller | — | Integrated DRAM/SRAM/Flash + PCMCIA |
| Process Technology | — | 0.32 um CMOS |