MPC860DEZQ50D4 vs MC860ENCVR50D4R2 Comparación
Comparación detallada lado a lado de MPC860DEZQ50D4 por NXP Semiconductors y MC860ENCVR50D4R2 por NXP. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC860DEZQ50D4 | MC860ENCVR50D4R2 |
|---|---|---|
| Marca | NXP Semiconductors | NXP |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,95 | $138,00 |
| Processor Type | MPC8xx PowerQUICC, 32-bit | — |
| Core Architecture | Power Architecture (embedded) | PowerPC 32-bit |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Encapsulado | 357-Ball PBGA (25x25 mm) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount, BGA |
| Temperatura de funcionamiento | 0 C to +95 C | [DATA_NEEDED: Operating Temperature] |
| Estado RoHS | Contains Lead (legacy BGA) | RoHS compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Digi-Reel / Tape and Reel |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Processor Family | — | MPC8xx PowerQUICC |
| Core Count | — | 1 |
| Frecuencia de reloj máxima | — | 50 MHz |
| Tensión de alimentación de funcionamiento | — | 3.3 V |
| Encapsulado / Carcasa | — | 357-BBGA (PBGA, 25 x 25 mm) |
| Pitch | — | 1.27 mm |
| Lead Free Status | — | Lead Free |
| Communications Module | — | CPM (SCC/SMC/UART/SPI) |
| JTAG / Debug Interface | — | Yes (BDM/JTAG) |
| Memory Controller | — | Integrated DRAM/SRAM/Flash + PCMCIA |
| Process Technology | — | 0.32 um CMOS |