MPC860PZQ66D4 vs MPC860TZQ66D4 对比
详细并排对比 MPC860PZQ66D4 出自 NXP Semiconductors 和 MPC860TZQ66D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC860PZQ66D4 | MPC860TZQ66D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $102.02 | $81.28 |
| Processor Family | PowerQUICC MPC8xx | — |
| Core Architecture | 32-bit PowerPC | PowerPC, 32-bit |
| Core Count | 1 | 1 |
| Maximum CPU Clock | 66 MHz | — |
| 工作电源电压 | 3.3 V | — |
| 封装 | 357-PBGA (25x25 mm) | — |
| 安装类型 | Surface Mount | Surface Mount |
| Lead Status | Contains Lead (non-RoHS) | — |
| RoHS 状态 | Non-Compliant (Contains Lead) | RoHS non-compliant (Contains Lead) |
| Packaging | Tray | Tray |
| On-chip Communications Module | CPM with SCCs, SMCs, Ethernet, HDLC | — |
| Memory Controller | DRAM, SRAM, Flash, EPROM | — |
| Timers | 4 x 16-bit | — |
| Process Technology | 0.32 um CMOS | — |
| 工作温度 | -40C to +95C (industrial, per D4 revision) | 0 °C to +70 °C |
| MSL 等级 | 3 | — |
| Series | PowerQUICC | — |
| Manufacturer | — | NXP Semiconductors |
| Part Family | — | MPC8xx PowerQUICC |
| Core Frequency | — | 66 MHz |
| 电源电压 | — | 3.3 V |
| 封装 / 外壳 | — | 357-PBGA (25x25 mm) |
| Lead Free Status | — | Contains Lead |
| Communications Module | — | CPM (QUICC Engine) |
| 生命周期状态 | — | End of Life (per NXP) |
| 分类 | — | Microprocessors - MPU |