W948D6FBHX5I-TR vs W948D6FBHX5I 对比
详细并排对比 W948D6FBHX5I-TR 出自 Winbond 和 W948D6FBHX5I 出自 Winbond。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | W948D6FBHX5I-TR | W948D6FBHX5I |
|---|---|---|
| 品牌 | Winbond | Winbond |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | Obsolete | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $1.15 |
| 存储器类型 | Mobile LPDDR SDRAM | SDRAM - Mobile LPDDR |
| 存储容量 | 256 Mbit | 256 Mbit |
| 存储组织 | 16M x 16 | 4M x 4 banks x 16 |
| 接口 | Parallel | Parallel, 16-bit |
| Clock Frequency | 200 MHz | 200 MHz |
| Access Time | 5 ns | — |
| 电源电压 | 1.8 V | — |
| Technology | SDRAM - Mobile LPDDR | — |
| 引脚数 | 60 | — |
| 封装 | 60-VFBGA (8x9 mm) | 60-VFBGA (8 x 9 mm, 0.80 mm pitch) |
| 安装类型 | Surface Mount | Surface Mount |
| Temperature Grade | Industrial (I suffix) | — |
| Packaging | Tape & Reel (TR) | — |
| Memory Format | DRAM (volatile) | DRAM (volatile) |
| Banks | [DATA_NEEDED: bank count] | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| Access Time / Clock Cycle | — | 5 ns |
| Supply Voltage (VDD/VDDQ) | — | 1.8 V |
| Number of Banks | — | 4 |
| Burst Length | — | 2, 4, 8 |
| Power Modes | — | Deep power-down, self-refresh, power-down, PASR, TCSR |
| Packaging Variant | — | Tray / Tape & Reel (W948D6FBHX5I-TR) |